M

Micron Technology

Makes memory and storage chips for AI and PCs

HBM Memory Design Engineer Intern - HBM

Silicon & ASIC DesignConfirmed live in the last 24 hours
InternshipRichardson, TX, USANo salary listedIn-person

About the Job

Requirements

  • Pursuing a Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related technical field.
  • Working knowledge of CMOS circuit design fundamentals and semiconductor device physics.
  • Experience with schematic entry and circuit simulation tools such as FineSim and/or HSPICE.
  • Familiarity with Verilog modeling, simulation environments, power network analysis, and state machine logic.
  • Experience with scripting languages such as Python, TCL, or Perl.
  • Strong analytical problem-solving skills.

Responsibilities

  • Design, analyze, and optimize memory, logic, and analog circuits for HBM products, including support for layout, validation, and tape-out activities.
  • Perform circuit verification, parasitic modeling, and design simulations using industry-standard tools to ensure performance and reliability targets are achieved.
  • Collaborate with layout, CAD, modeling, verification, and multifunctional engineering teams to meet floor-planning, routing, manufacturability, and quality objectives.
  • Partner with Product Engineering, Test, Probe, Process Integration, Assembly, and Marketing teams to support product development and successful production ramps.
  • Leverage AI-assisted tools and AI-enabled workflows to improve design efficiency, accelerate analysis, and support data-driven engineering decisions.

Desired Qualifications

  • Knowledge of DRAM architecture, memory design concepts, and SoC/IO interfaces.
  • Experience communicating complex technical concepts effectively through verbal and written presentations.
  • Experience using AI agents, generative AI, or other AI-assisted engineering productivity tools to support design, analysis, and workflow optimization.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

Recently Posted Jobs

Explore more opportunities at Micron Technology

See more jobs