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Micron Technology

Makes memory and storage chips for AI and PCs

Dry Etch – Distinguished Member of Technical Staff - PD, Advanced NAND

Process EngineeringConfirmed live in the last 24 hours
Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

  • Demonstrated interest in a research and development environment.
  • 15–20 years of dry etch process development experience within research and development (NAND, DRAM, or Logic) moving into manufacturing roles, with 10–15 years specifically in memory products such as NAND and DRAM.
  • Knowledge of plasma physics, plasma chemistry, transport, or surface phenomena gained through experience and/or coursework.
  • Demonstrated leadership in problem solving and experience managing technical projects.
  • Understanding of various types of plasma dry etch reactors, including radio-frequency sources and chemistries.
  • Expertise in statistical process control and analysis.
  • Experience solving scalability problems of deep high-aspect-ratio silicon/dielectric etches, with a fundamental understanding of advanced conventional and unconventional tailored pulsing schemes.
  • Ability to lead supplier head-to-head evaluations.
  • Strong computer skills, including Microsoft Office and SAS software such as JMP or similar.
  • PhD in Chemical Engineering, Mechanical Engineering, Electrical Engineering, Materials Science, Physics, Chemical Physics, Chemistry, Semiconductor Engineering, or a related field, with 15–20 years of applicable dry etch process development experience; alternatively, a BS/MS in those fields or a related field with over 18 years of pertinent experience.

Responsibilities

  • Participate in a next-generation NAND research and development dry etch team, defining, developing, and transferring advanced dry etch processes for NAND technologies.
  • Lead advancements in dry etch technology and essential module development.
  • Act as a technical expert in dry etch processes, hardware, and applications for NAND technology development at F10, Singapore.
  • Provide broad technical vision and domain expertise informed by extensive knowledge of dry etch physics and chemistry.
  • Define the equipment roadmap; work with suppliers to develop a mechanism-focused logical hardware roadmap for upcoming NAND generations.
  • Benchmark NAND dry etch capability against industry standards and translate external findings into internal advantage.
  • Provide forward-looking technical insight on dry etch trends, tool capabilities, and integration risks.
  • Bring external perspectives and insight from experience across semiconductor companies.
  • Provide technical mentorship and direction to SMTS/STS engineers and raise dry etch technical capability within the Singapore NAND organization.
  • Resolve complex NAND yield, defectivity, and integration challenges using expertise in plasma physics, surface interactions, and materials.
  • Represent Singapore NAND dry etch interests at international conferences and cross-site and cross-company technical forums.
  • Contribute to the Technical Leadership Program.
  • Mentor less experienced engineers and build skills within the team.
  • Collaborate with and lead multifunctional teams to solve sophisticated structural problems.
  • Simplify problems through model-based problem solving.
  • Champion artificial-intelligence-based solutions through the Technology Development ecosystem.
  • Lead collaborative efforts across Technology Development, Process Integration, and Manufacturing.
  • Develop and innovate dry etch methods to meet structural and electrical requirements.
  • Lead first-of-a-kind dry etch process development, including recipe architecture, endpoint detection strategy, control plans, and integration alignment.
  • Present process and technology roadmaps for current and future technology nodes in executive meetings.
  • Predict future issues and proactively develop mitigation plans.
  • Influence technology roadmaps in other process areas.
  • Serve as a resource and guide for colleagues in dry etch technology and/or project management.
  • Provide upper management with critical project-status and impact updates.
  • Integrate AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness while exercising sound judgment and complying with organizational standards and legal requirements.
  • Identify, test, and share AI-enabled improvements within the scope of work.

Desired Qualifications

  • Data science fundamentals, Python coding, or AI coding experience are preferred.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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