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Kulicke & Soffa

Manufactures semiconductor packaging equipment and tools

Engineer – Customer Support

Equipment Field ServicePosted on Nov 11
Full-timeChengdu, Sichuan, ChinaNo salary listed

About the Job

Requirements

  • A degree or technical study in an engineering discipline is required; engineering, electrical, or mechanical study is preferred.
  • General equipment knowledge and the ability to read basic mechanical and electrical drawings are required.
  • Basic machine knowledge is required.
  • A valid driver's license is required.
  • Willingness to travel to customer sites within the region or country is required.
  • Strong problem-solving skills and strong written and verbal communication skills in the required language are required.

Responsibilities

  • Provide highly visible customer support by performing on-site installation and overseeing diagnosis, troubleshooting, service, and repair of equipment and systems.
  • Install equipment on site, including new equipment, upgrades, and system relocations.
  • Troubleshoot hardware and software.
  • Provide responsive telephone and email support to help customers use equipment successfully.
  • Assist with machine installation at customer sites, including new equipment, upgrades, and system relocations.
  • Evaluate and diagnose basic problems, make appropriate repairs, and troubleshoot.
  • Document completed troubleshooting and escalate issues to other departments when required.
  • Act as the company liaison between the organization and customers for administrative and technical matters.
  • Perform standard buy-offs.
  • Perform first-level basic application verification.

About the Company

Kulicke & Soffa

Manufactures semiconductor packaging equipment and tools

Kulicke & Soffa designs, manufactures, and sells capital equipment and tools for assembling semiconductor devices. Its product line includes ball bonders that ultrasonically attach fine wires to a semiconductor die, thermo-compression bonding systems for high-density interconnects, and equipment for surface-mount technology and die attach. The company differentiates itself with a long history dating back to 1951, a broad portfolio across wire bonding, advanced packaging, and die attach, and a strong Asia-Pacific presence plus an active after-market parts and services business. Its goal is to enable mass production of semiconductors by providing reliable, high-precision packaging and assembly solutions that help customers scale manufacturing and keep equipment running smoothly.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Singapore, Singapore
Founded
1951

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