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Netpreme

Photonic interconnects enabling AI data transfer

Member of Technical Staff - Performance Modeling

Hardware EngineeringUpdated on Nov 7
Full-time

About the Job

Requirements

  • A bachelor's or master's degree in Electrical Engineering, Computer Engineering, or a closely related field.
  • Five or more years of experience in performance modeling for data movement devices such as network interface cards, memory expansion cards (for example, Compute Express Link), IPU/DPU, or network-on-chip devices.
  • Ability to reason across multiple abstraction layers, from architectural details to system-level performance behavior.

Responsibilities

  • Build and maintain system-level, including rack-scale, and chip-level performance models for high-bandwidth data movement between devices operating in the scale-up domain.
  • Model workloads from software memory access patterns through data distribution in the network and down to on-device memory channels.
  • Work day-to-day with silicon architects, system designers, and workload owners to align performance expectations and constraints.
  • Identify performance bottlenecks, scaling limits, and sensitivity points across compute, memory, and interconnects in end-to-end workload settings.
  • Communicate modeling assumptions, limitations, and conclusions to technical and non-specialist stakeholders.

Desired Qualifications

  • Prior experience modeling performance for networking protocols with memory semantics.
  • Familiarity with shared memory systems and frameworks such as CUDA virtual memory management.
  • Familiarity with the modern AI/ML technical stack from a workload perspective, including large language model inference and sharding, key-value caching, and serving systems such as continuous batching.
  • Experience with scale-up and high-bandwidth interconnects such as NVLink or similar technologies.
  • Experience with modeling memory subsystems.

About the Company

Netpreme

Photonic interconnects enabling AI data transfer

Netpreme develops photonic networking solutions that remove data transmission bottlenecks in AI systems by using high-bandwidth optical interconnects for XPU memory expansion. Its approach combines hardware and software to integrate optical interconnects into AI compute systems, enabling data to move over light instead of traditional electrical networks. It differentiates itself by targeting memory expansion paths for AI accelerators with photonics to improve data-plane AI workloads. The company aims to speed up AI communication, boost efficiency, and scale AI systems through practical, deployable photonic interconnect components for AI infrastructure.

Company size
11-50
Company stage
Early VC
Total funding
$11.9M
Headquarters
Cambridge, MA
Founded
2024

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