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Diamond Foundry

Manufactures diamond wafers for thermal management

Application Engineering Director

Engineering LeadershipConfirmed live in the last 24 hours
Full-timeCalifornia, USA$180k - $270k /yr

About the Job

Requirements

  • A bachelor's degree in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related field is required; a master's or PhD is preferred.
  • At least 10 years of experience in semiconductor packaging, process engineering, or thermal management, including at least 3 years leading engineering teams or programs.
  • Deep, hands-on expertise in wafer/die bonding technologies and related processes, including surface preparation, thin-film metallization, metrology, failure analysis, and reliability testing.
  • Strong understanding of advanced packaging architectures, including 2.5D/3D IC, CoWoS, flip-chip, and fan-out, and their thermal management challenges.
  • Proven record of taking bonding or packaging processes from research and development through qualification and into high-volume manufacturing, including technology transfer to customers or OSATs.
  • Ability to translate complex technical issues into clear business decisions for management and customers.
  • Experience with high-thermal-conductivity materials such as diamond or silicon carbide is highly desirable.

Responsibilities

  • Lead and grow the application engineering function, setting technical direction for bonding single-crystal diamond to customer devices in advanced packaging and thermal management applications.
  • Own bonding technology strategy, including evaluating, selecting, and optimizing pressure and pressureless sintering, thermocompression, surface/plasma-activated, hybrid, and emerging bonding methods across device designs and material stacks.
  • Direct process development and validation, including surface preparation, metallization, design of experiments-based optimization, characterization, failure analysis, and reliability testing.
  • Serve as senior technical lead on customer programs from prototyping through qualification, technology transfer, and scale-up to mass production.
  • Partner with executive leadership, research and development, product, and business development on product roadmaps, resourcing, and new application opportunities, reporting on schedules, technical risks, and results.
  • Present technical results and strategy to customers, executives, and industry partners.

Desired Qualifications

  • Experience with high-thermal-conductivity materials such as diamond or silicon carbide.

About the Company

Diamond Foundry

Manufactures diamond wafers for thermal management

Diamond Foundry produces single crystal diamond wafers used to improve heat management in high-tech systems. They develop and manufacture semiconductor-grade diamond wafers and related technologies for B2B customers, including AI, EVs, and wireless communications, to help devices run cooler and more efficiently. The wafers leverage diamond's exceptional thermal conductivity to spread and dissipate heat from powerful chips beyond what traditional materials can handle. They differentiate themselves by offering a sustainable, zero-carbon production process and a complete semiconductor-grade tech stack, targeting Tier 1 automakers and other high-tech firms. Their goal is to lead in both advanced materials and environmental sustainability by providing reliable, high-performance cooling solutions for mega tech applications.

Company size
201-500
Company stage
Grant
Total funding
$1.3B
Headquarters
South San Francisco, CA
Founded
2012

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