B

Black Semiconductor

Graphene photonics enable optical chip interconnects

ALD Lab Working Student Intern

Physical SciencesConfirmed live in the last 24 hours
InternshipAachen, GermanyNo salary listedHybrid

About the Job

Requirements

  • Current enrollment in a bachelor's or master's program in materials science, physics, chemistry, mechanical engineering, electrical engineering, or a related field, ideally in the last year.
  • A basic understanding of thin-film characterization methods such as ellipsometry, Raman spectroscopy, optical microscopy, or atomic force microscopy.
  • Strong attention to detail and the ability to handle delicate samples accurately.
  • An interest in semiconductor processing and willingness to learn cleanroom protocols.
  • Basic proficiency in data logging, documentation, and data visualization using Excel or Python.
  • Good communication skills in English.
  • The ability to work effectively and reliably within a laboratory team.

Responsibilities

  • Support the daily operation of the Atomic Layer Deposition tool and relevant metrology tools in the FabONE cleanroom in Aachen.
  • Prepare samples for Atomic Layer Deposition and characterization runs.
  • Perform routine thin-film measurements using spectroscopic ellipsometry, Raman spectroscopy, optical microscopy, and atomic force microscopy.
  • Support senior Atomic Layer Deposition process engineers with setting up tool test runs and recording operational parameters.
  • Handle delicate samples and cleanroom equipment in accordance with established safety and quality procedures.
  • Document characterization results and upload structured metrology data to central repositories.
  • Organize measurement data and prepare clear summaries of film-characterization results.
  • Help establish and maintain an inventory system for chemicals and precursors.

About the Company

Black Semiconductor

Graphene photonics enable optical chip interconnects

Black Semiconductor develops graphene-based photonics that integrate optical components into the outer layers of CMOS-like chips, enabling direct optical chip-to-chip communication. It works by using graphene as a translator to convert electronic signals to optical signals and back, so electrons on silicon can talk to photons through integrated photonic interconnects. This approach differs from traditional silicon photonics or pure electronic interconnects by being CMOS-compatible, wafer-scale, and capable of linking multiple chips as a single high-performance unit while reducing production steps by about 60%. The company aims to move from pilot production to mass manufacturing, building a 300mm wafer facility (FabONE) in Aachen, with pilot production by 2027 and mass production by 2031, backed by a large European funding round and investors.

Company size
51-200
Company stage
Growth Equity (Non-Venture Capital)
Total funding
$287.4M
Headquarters
Aachen, Germany
Founded
2020

Recently Posted Jobs

Explore more opportunities at Black Semiconductor

See more jobs