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Huawei

Global ICT infrastructure and devices provider

Technical Vice President - Computing Bus System Research

Hardware Systems IntegrationUpdated on Nov 13
Full-timeMarkham, ON, CanadaNo salary listedIn-person

About the Job

Responsibilities

  • Conduct in-depth analysis of industry-leading bus architectures and technologies, develop long-term technology plans and roadmaps, and lead technical decision-making.
  • Build competitive bus architectures and interconnection protocols for AI and general-computing scenarios in alignment with mainstream industry architectures and protocols. Drive the ongoing evolution of bus technology to maintain the competitiveness of large-scale computing cluster solutions.
  • Apply in-depth understanding of chip architecture and software frameworks to implement system-level solutions centered on bus architecture and protocols. Drive co-innovation across chip design, hardware and software, and solutions to support business success.

About the Company

Huawei

Global ICT infrastructure and devices provider

Huawei designs and sells ICT infrastructure, devices, and cloud services for telecom operators, enterprises, and consumers. Its products span telecom networks, IT infrastructure, smart devices, and cloud offerings, and they operate globally in more than 170 countries. Huawei’s technology works by combining hardware and software across networking gear, servers, consumer electronics, and cloud platforms, enabling connectivity, data processing, and smart solutions for businesses and homes, with a focus on secure, open collaboration with ecosystem partners. Differences from competitors come from its large scale, employee ownership structure, extensive R&D investment, and broad end-to-end solutions that integrate networks, IT, devices, and cloud. The company aims to empower people, enrich home life, and drive organizational innovation by delivering value through collaboration, advanced technologies, and customer-focused services.

Company size
10,001+
Company stage
Debt Financing
Total funding
$2.4B
Headquarters
Shenzhen, China
Founded
1987

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