Advanced Packaging Modeling Engineer

About GlobalFoundries:

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

Summary of Role:We are looking for an experienced mechanical, thermal or electrical modeler / engineer to address 3DHI and advanced packaging questions for a wide range of logic, RF, analog and memory technologies.  This person will focus upon the use of commercial modeling tools for guiding device, integration and 3DHI advanced packaging optimizations for mechanical, thermal or electrical performance optimizations. 

Work Location: This position is for a role in our state-of-the-art300mm fabrication facility in Malta, New York.

Essential Responsibilities:

• Familiarity with commercial software for mechanical or thermal or electrical modeling.

• Stress simulations for continuous and discontinuous active areas, and how stress affects device performance if the skill is mechanical modeling. 

• Anticipate integration/process issues, based on provided information from integration, process or design enablement teams and performed modeling. 

• Facilitate discussion with originating team to identify simulations that highlight critical process interactions and drive optimal 3DHI technology decisions.

• Apply commercial simulation software to mimic semiconductor process flows and highlight the areas of concern.

• Extensive interaction with integration, device, and design engineers to assure development of a working technology 

Other Responsibilities:

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs. 

• Other duties as assigned by manager.

Required Qualifications:

• M.S. + minimum of 5 years of relevant experience

• PhD + minimum of 3 years of relevant experience

• Semiconductor mechanical or thermal or electrical simulation tool experience with Ansys Mechanical Workbench or other applicable software for any of those 3 modeling applications

• Must have at least an overall 3.0 GPA and proven good academic standing.

• Language Fluency - English (Written & Verbal).

• Solid understanding of semiconductor processes and integration techniques

• Good computer / software skills

• Ability to clearly present results to small and large groups 

Preferred Qualifications: 

• PhD + 5 years of relevant experience

• Thermal and electrical simulation for specific IC circuit designs (RF analog experience preferred) and with LVS and DRC verification tools (Cadence / Mentors Graphics / Keysight ADS…)  

• Demonstrated work performance in an environment requiring a high level of attention to detail and timeliness.

• Demonstrated prior leadership experience in the workplace, school projects, competitions, etc. 

• Project management skills, i.e. the ability to innovate and execute solutions that matter; the ability to navigate ambiguity.  

• Strong written and verbal communication skills.  

• Strong planning & organizational skills.