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Micron Technology

Makes memory and storage chips for AI and PCs

Engineer – Advanced Packaging Die Level Technology Engineering - Advanced Packaging Die Level Technology Engineering

Manufacturing Engineering +1Confirmed live in the last 24 hours
Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

  • A bachelor's or advanced degree in Engineering or Science is required.
  • Strong analytical, logical, and critical-thinking skills are required.
  • Effective communication and the ability to collaborate across all levels are required.
  • A growth mindset and passion for continuous learning are required.

Responsibilities

  • Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking (Chip on Wafer and Chip to Wafer).
  • Improve product quality, yield, cost, and productivity.
  • Establish and improve process-management projects to deliver technology-node requirements.
  • Evaluate and promote new equipment and materials to enhance process capabilities.
  • Set process parameters for a variety of semiconductor equipment.
  • Plan for new equipment and materials.
  • Ensure defense coverage through process, measurement, inspection, and testing.
  • Establish correlations between defense mechanisms to identify improvement opportunities.
  • Conduct continuous data analysis to establish advanced controls and identify improvement opportunities.
  • Work with internal and external stakeholders to build and execute technology-development strategies aligned with organizational and business objectives.
  • Work with Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality teams to integrate manufacturing processes for optimal performance and quality control.
  • Ensure smooth transition from new-product development, qualification, and small-volume production to high-volume production.
  • Provide Process of Record (POR) and Model of Record (MOR) documentation for product transfer to production high-volume manufacturing fabrication facilities.

Desired Qualifications

  • Internship or experience in the semiconductor industry is a plus.
  • Demonstrated leadership and a track record of impact are highly desirable.
  • Interest in and knowledge of the semiconductor industry and Micron are preferred.
  • Proficiency in Python, R, and SQL for statistical analysis, process modeling, and data analytics is preferred.
  • Experience with Visual Basic for automation and tool integration is preferred.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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