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Lumilens

Photonic interconnects for AI infrastructure

Senior/Staff Process Engineer - Wire Bond

Manufacturing EngineeringConfirmed live in the last 24 hours
Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

  • A bachelor's degree in Electrical Engineering, Industrial Engineering, Mechanical Engineering, Physics, or a related field, plus 7 or more years of experience in high-volume optical transceiver and/or laser manufacturing.
  • Excellent problem-solving and analytical skills.
  • In-depth technical knowledge and hands-on experience designing, developing, selecting, and implementing manufacturing processes, equipment, materials, and methodologies for optical assemblies.
  • Expertise in one or more optical transceiver assembly processes, such as die attach, wire bond, active optical alignment, general assembly, product testing, or burn-in.
  • Expertise in data analysis, statistical process control, and report generation.
  • In-depth understanding of quality management systems and applicable quality standard requirements.
  • Data query and data analysis skills using statistical tools and techniques.
  • Expertise in optics failure analysis processes and tools.
  • Ability to work effectively in a geographically diverse, cross-functional team.
  • Good command of spoken and written English, including in-person and virtual presentation skills.
  • International travel is required.

Responsibilities

  • Define, develop, prove out, and deploy manufacturing processes for new products across the transceiver assembly flow, including die attach, wire bond, active alignment, and general assembly, and implement continuous improvement projects to achieve yield, throughput, efficiency, scrap, and quality targets.
  • Own manufacturing process documentation, including process specifications, work instructions, control plans, and failure mode and effects analysis, and review and approve process changes implemented on the production line.
  • Maintain end-to-end manufacturing ownership by ensuring product, process, material, and equipment changes are managed under change control according to established quality management system requirements.
  • Lead or support equipment selection and new equipment introduction by defining requirements, working with suppliers and stakeholders to develop process algorithms, machine hardware, and software, and managing the process from buy-off through release to manufacturing.
  • Collaborate with design engineering and contract manufacturing teams to execute, improve, and sustain manufacturing processes and ensure design for manufacturing guidelines are met.
  • Collaborate with the quality team to plan and execute qualification, reliability, and burn-in testing in support of new product introduction and process changes.
  • Analyze process and yield data to identify the root causes of excursions and drive corrective and preventive actions across relevant assembly processes.
  • Prepare process reports by collecting, analyzing, and summarizing information and trends.
  • Automate manufacturing processes where possible to support scale-up and high-volume production.

About the Company

Lumilens

Photonic interconnects for AI infrastructure

Lumilens designs and manufactures optical interconnect products to accelerate AI infrastructure. It provides high-density photonic interconnects—such as high-density pluggable, near-packaged, and co-packaged optics—built with in-house silicon photonics to scale GPU clusters in AI data centers. Its products include 800G and 1.6T optical transceivers for AI networking, and it is pursuing broader integration like Electrical-Optical Interposers through a strategic partnership with POET Technologies. The company differentiates itself through vertical integration, custom robotics-driven manufacturing, and AI-optimized production processes that aim to improve yield and supply chain stability. Lumilens targets hyperscalers and large AI providers, seeking to move interconnect bottlenecks from compute to scalable, efficient data-center networks. Its goal is to enable faster, denser GPU connectivity to support growing AI workloads and models.

Company size
51-200
Company stage
Series C
Total funding
$839.5M
Headquarters
San Jose, CA
Founded
2024

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