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Micron Technology

Makes memory and storage chips for AI and PCs

Pee Diffusion Intern

Process EngineeringConfirmed live in the last 24 hours
InternshipSingaporeNo salary listedIn-person

About the Job

Requirements

  • Strong background in semiconductor process engineering, yield analysis, and defectivity characterization.
  • Proficiency in data analytics, statistical analysis, and use of inspection and inline metrology tools.
  • Ability to perform root-cause analysis and translate data insights into manufacturing improvements.

Responsibilities

  • Conduct fab-to-fab offload interaction studies to identify and diagnose inline mismatches between N and W processes that contribute to yield differences.
  • Perform detailed bevel characterization to assess defectivity performance differences and quantify their impact on inline die loss.
  • Analyze cross-module data to establish root-cause relationships between process variation and yield performance.
  • Drive WEE performance metrics, including 22UE capability and 1H edge coat performance, to maximize overall yield.
  • Identify, troubleshoot, and mitigate process detractors impacting WEE metrics and edge-related yield loss.
  • Develop and implement an accurate Wafer Inspection System (WIS) algorithm to reliably capture true 22UE performance while excluding known detractors such as wet moisture signature.
  • Apply advanced analytical and data-mining tools to extract actionable insights and identify yield improvement opportunities.
  • Integrate inline, defect, and inspection data to support root-cause analysis and data-driven decision-making.
  • Exercise engineering judgment to prioritize actions, balance risk, and drive effective technical solutions across cross-functional teams.
  • Close the F10 N/W yield mismatch gap of approximately 0.9%.
  • Drive the RegE WEE program toward a 160s edge exclusion target of zero non-live dies.
  • Deliver a robust WIS algorithm that excludes wet moisture signatures while accurately reflecting true 22UE performance.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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