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Teledyne

Manufactures sensors, imaging systems, and avionics

Lead Up Assembler

Product AssemblyConfirmed live in the last 24 hours
Full-timeRancho Cordova, CA, USA$39k - $52kIn-person

About the Job

Requirements

  • Ability to interpret production drawings, wiring diagrams, and bills of materials.
  • Proficiency with through-hole and surface-mount soldering and basic hand tools.
  • Strong manual dexterity and attention to detail.
  • High school diploma.

Responsibilities

  • Assemble electronic and electro-mechanical units by following drawings, schematics, sample assemblies, and verbal instructions.
  • Install, solder, and remove through-hole and surface-mount components using soldering irons and hot-air tools.
  • Prepare, position, align, and secure components using fixtures, jigs, and hand tools.
  • Perform wiring, lead preparation, crimping, staking, and connections between components and printed circuit assemblies.
  • Conduct basic tests, inspections, and go/no-go verifications throughout the build process.
  • Rework, repair, or troubleshoot components and assemblies that do not meet specifications.
  • Work under microscopes as needed for detailed soldering and inspection.
  • Follow safety guidelines when handling chemicals, tools, or equipment.
  • Document production results, updates, and issues in logs and reports.

Desired Qualifications

  • Ability to perform inspections and basic electrical tests.
  • Experience with component mounting, cleaning, preparation, or small-parts assembly.
  • Vocational or technical electronics training.
  • 0–2 years of related assembly experience.

About the Company

Teledyne

Manufactures sensors, imaging systems, and avionics

Teledyne Technologies designs and makes sensors, cameras, and electronics used in aerospace, environmental monitoring, medical imaging, and defense. Its products include digital imaging sensors, high-reliability cameras, instrumentation, aerospace and defense electronics, and engineered systems that provide integrated sensing solutions for demanding environments. The company grows by acquiring specialized high-tech firms, building a diversified portfolio that serves markets with high barriers to entry. Its goal is to expand capabilities and market reach through targeted acquisitions while delivering reliable sensing and imaging technology for critical industries.

Company size
11-50
Company stage
IPO
Headquarters
Thousand Oaks, CA
Founded
1960

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