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Analog Devices

Designs high-performance analog and DSP ICs

System Mechanical & Integration Engineer

Full-Time
$110.4k - $151.8k/yr+ Discretionary performance-based bonus
Mid
Master's, PhD
Burlington, MA, USA
In PersonOn-site in Wilmington, Massachusetts; ~10% travel.
Mechanical EngineeringDesign Engineering, Thermal & Fluids Engineering

About the job

Requirements
  • MS or PhD in Mechanical Engineering, Thermal Engineering, Aerospace Engineering, Electrical Engineering, or a related field.
  • 3+ years of experience with a strong foundation in mechanical design and product development, thermal management of electronic systems, and system integration of power electronics platforms; candidates with additional experience may be considered at the Senior Engineer level.
  • Demonstrated experience (research, projects, internships, or industry) developing mechanical and thermal solutions for electronic products, power systems, or high-performance computing infrastructure.
  • Experience with CAD tools such as Creo, SolidWorks, NX, or CATIA.
  • Experience performing thermal simulations, CFD analysis, or airflow optimization for electronics cooling applications.
  • Understanding of structural mechanics, tolerance analysis, material selection, and manufacturing processes.
  • Knowledge of high-current power distribution methods including busbars, connectors, grounding, creepage, and clearance requirements.
  • Strong analytical and problem-solving skills with a hands-on approach to design validation and troubleshooting.
Responsibilities
  • Design and integrate mechanical subsystems for high voltage power conversion platforms, including HV DC/DC module, intelligent power system, and Power Distribution Box (PDB).
  • Own enclosure and structural design activities, including sheet metal design, die-cast components, machined parts, fastening strategies, tolerance stack-up analysis, manufacturability, and assembly considerations.
  • Develop thermal solutions for high-power electronic systems utilizing air cooling, liquid cooling, cold plates, heat sinks, vapor chambers, heat spreaders, and advanced thermal interface materials.
  • Perform thermal simulations and airflow analysis using industry-standard tools (Icepak, Fluent, 6SigmaET, FloTHERM, Star-CCM+, or equivalent) to optimize cooling performance and maintain component reliability.
  • Design and validate power interconnect solutions including busbars, copper current-carrying structures, high-current connectors, grounding systems, and electrical isolation features.
  • Collaborate closely with electrical and power electronics teams to optimize mechanical packaging of transformers, inductors, capacitors, semiconductors, and magnetic components.
  • Create and execute thermal, mechanical, vibration, shock, and environmental validation plans to ensure compliance with product and customer requirements.
  • Support prototype builds, design verification testing (DVT), and root-cause analysis of thermal, structural, or assembly-related issues.
  • Work with manufacturing partners, suppliers, and contract manufacturers to develop cost-effective, scalable, and production-ready mechanical solutions.
  • Document system architecture, design analyses, simulations, test results, and lessons learned to support product development and continuous improvement.
Desired Qualifications
  • Industry experience with data center power supplies, server platforms, rack-level power systems, renewable energy, or energy storage systems.
  • Experience designing high-power systems (>3 kW), power shelves, >400V power conversion platforms, or AI infrastructure hardware.
  • Proficiency with thermal simulation tools such as ANSYS Icepak, Fluent, FloTHERM, 6SigmaET, or Star-CCM+.
  • Experience with liquid-cooling technologies including cold plates, CDU integration, direct-to-chip cooling, and rack-level thermal management.
  • Knowledge of power electronics packaging including magnetic components, power semiconductors, busbar design, and EMC/EMI considerations.
  • Familiarity with mechanical reliability testing including vibration, shock, HALT/HASS, and environmental qualification.
  • Experience with DFM, DFA, FMEA, GD&T, tolerance stack-up, and production release processes.
  • Python or MATLAB experience for thermal data analysis, automation, and model correlation.
  • Strong communication skills and ability to work effectively in multidisciplinary engineering teams.

About the company

ADI designs, manufactures, and sells high-performance analog, mixed-signal, and DSP integrated circuits that sense, measure, interpret, connect, and power the physical world in electronic devices. Its products include data converters, amplifiers, and power-management ICs that OEMs embed to handle analog sensing and digital processing inside their products. ADI differentiates itself through a broad, industry-spanning portfolio and close collaboration with customers to solve complex engineering challenges, rather than focusing on a single product type. Its goal is to provide reliable signal-processing solutions that bridge the physical world and digital systems, helping customers create more capable electronic products.

Company Size

10,001+

Company Stage

IPO

Headquarters

Wilmington, Massachusetts

Founded

1965

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Simplify's Take

What believers are saying

  • Fiscal Q3 2026 revenue hit $4.02 billion, up 40%, led by data center.
  • Adjusted gross margin reached 72.5% and operating margin 50%, both new 2026 highs.
  • Q4 guidance of $4.3 billion signals another record, with industrial momentum intact.

What critics are saying

  • August 2026 10-Q disclosed a June cybersecurity incident that exfiltrated files from systems.
  • The $1.35 billion Alif purchase closes under HSR review before year-end 2026.
  • September 17, 2026 notes raise fixed obligations before Alif integration synergies arrive.

What makes Analog Devices unique

  • ADI's September 9, 2026 Alif deal builds Physical Intelligence across sensing, power, and AI.
  • July 7, 2026 Empower Semiconductor extends ADI from grid to core power delivery.
  • Cadence and ADI's SHARC-FX automotive DSP, announced in 2026, targets voice and audio.

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Benefits

Health Insurance

Dental Insurance

Vision Insurance

401(k) Retirement Plan

401(k) Company Match

Paid Vacation

Paid Holidays

Paid Sick Leave

Growth & Insights and Company News

Headcount

6 month growth

4%

1 year growth

4%

2 year growth

4%
Yahoo Finance
Oct 2nd, 2026
Analog chip makers Texas Instruments, Analog Devices, and ON Semiconductor capitalise on AI data centre boom

Texas Instruments, Analog Devices, and ON Semiconductor are capitalising on growing demand for analog chips in AI infrastructure. These chips manage power flows and convert real-world inputs into digital data, making them essential for data center operations. Texas Instruments reported 23% year-over-year revenue growth in Q2, with its analog segment up 29%. The company cited continued growth in industrial, data center, and automotive segments. Analog Devices saw 40% year-over-year revenue growth in fiscal 2026 Q3, with net income more than doubling. The company maintains a 39% free cash flow margin and has returned over $24 billion to shareholders in the past decade. ON Semiconductor expects AI data center revenue to more than double in 2026. The company is acquiring Synaptics to strengthen its position in physical AI, expanding its addressable market to $243 billion by 2030.

Yahoo Finance
Sep 25th, 2026
4 chip stocks poised for strong returns in October amid AI boom

The global semiconductor market reached record sales of $403.3 billion in the second quarter of 2026, rising 35.1% sequentially, driven by artificial intelligence and advanced computing demand. June sales climbed 123.6% year-over-year to $134.5 billion. Four chip stocks appear well-positioned to benefit from the AI boom. Analog Devices is experiencing broad-based recovery with AI-related data centre activity expanding across optical and power applications. Taiwan Semiconductor Manufacturing Company maintained 73% market share, supported by robust AI demand. Semtech is benefiting from rising AI data centre networking demand as 800G remains active. ASM International holds a market share exceeding 55% in ALD technology, with management expecting second-half revenues to rise more than 20%. All four companies show strong growth trajectories, with consensus estimates suggesting revenue increases of 34% to 41% and earnings growth of 55% to 104% for 2026.

Minichart
Sep 17th, 2026
Analog Devices prices $3B senior notes offering across four tranches

Analog Devices has priced a $3 billion senior notes offering, closing on 17 September 2026, according to an SEC filing. The offering comprises four tranches: $500 million of 5.100% notes due 2029, $500 million of 5.350% notes due 2031, $1 billion of 5.600% notes due 2033, and $1 billion of 5.750% notes due 2036. J.P. Morgan Securities served as representative of the underwriters. The notes are unsecured and rank equally with the company's existing senior indebtedness. The weighted average coupon across the four tranches is approximately 5.57%, implying annual pre-tax interest expense of roughly $167 million. The filing does not disclose the intended use of proceeds.

Associated Press
Sep 15th, 2026
Cadence Tensilica IP powers Analog Devices' next-gen automotive audio DSP with 5X performance boost

Cadence has announced a collaboration with Analog Devices to develop the latest generation of SHARC automotive audio processors. The partnership integrates Cadence's Tensilica DSP architecture into ADI's ADSP product family, enabling enhanced audio experiences and AI capabilities for automotive platforms. ADI is introducing the ADSP-SC84x/2184x platform, featuring the new SHARC-FX processor core developed jointly with Cadence. Built on 16nm process technology, the platform delivers five times higher performance compared to the previous generation. The SHARC-FX core supports AI-driven audio processing, including noise cancellation and voice assistance. The processors power various automotive applications, including advanced driver alerts, road noise cancellation, immersive 3D audio, and voice processing. The architecture enables on-chip AI workloads whilst maintaining real-time performance for safety-critical automotive systems.

PR Newswire
Sep 9th, 2026
Analog Devices acquires Alif Semiconductor for $1.35B to advance AI-native edge processing

Analog Devices will acquire Alif Semiconductor for $1.35 billion in cash, with a potential additional $200 million in contingent payments. The deal, expected to close before the end of 2026, aims to advance what ADI calls "Physical Intelligence" — systems that sense, reason, and act locally in real time. Alif provides AI-native microcontrollers and fusion processors designed for edge intelligence. The acquisition will combine Alif's digital processing platform with ADI's analog capabilities in sensing, signal processing, power, and connectivity. The merger targets applications across industrial, data center infrastructure, defence, energy, robotics, digital health, and wearables. Alif's silicon is already shipping to production customers. PJT Partners advised ADI, whilst Qatalyst Partners advised Alif. The transaction requires regulatory approval under the Hart-Scott-Rodino Antitrust Improvements Act.