Our Team

Semtech's Signal Integrity Products (SIP) Business Unit delivers high-performance mixed-signal ICs for the data communications and video broadcast industries — powering the interconnects that move data inside the world's largest hyperscaler data centers. Our Packaging Technology team sits at the heart of this mission, bridging the gap between silicon and system through world-class IC package design, signal integrity engineering, and close collaboration with a global network of advanced manufacturing partners.

You will be joining a highly integrated team of digital, analog, physical, and systems engineers who are passionate about solving hard problems at the intersection of speed, density, and reliability. If you thrive in a technically challenging, fast-moving environment where your work directly impacts next-generation Datacenter connectivity products — this is your team.

Job Summary

As a Principal Engineer in IC Package Design and Signal Integrity, you will lead the design and electrical characterization of advanced high-speed IC packages for Semtech's Datacenter connectivity product portfolio. Your primary responsibilities will span 3D electrical signal integrity modeling, IC package layout, and cross-functional collaboration across design, manufacturing, quality, and reliability engineering disciplines.

This role requires a deep understanding of high-speed transmission line behavior, advanced packaging architectures, and the full NPI lifecycle from concept through qualification. You will work closely with internal teams and external manufacturing partners, serving as a key technical authority on package-level signal and power integrity. The ideal candidate brings strong hands-on experience in EDA tooling, RF/SI measurement, and a track record of delivering complex package designs into high-volume production.

Responsibilities

Design high-speed IC packages and Chip-On-Board (COB) solutions to meet new product technical and financial requirements; develop robust solutions that achieve the highest levels of quality and reliability in fast-paced Datacenter connectivity environments.

Perform 3D signal integrity modeling at silicon, package, and system levels, including experimental validation via Scattering Parameter (S-parameter) and Time-Domain Reflectometer (TDR) measurements where required.

Prepare technical reports and application notes for internal teams and external customers/suppliers, covering Signal and Power Integrity (SI/PI), PCB layout guidance, and assembly process instructions.

Design and produce PCB and high-density substrate layouts for reliability qualification and electrical performance evaluation.

Serve as technical interface with manufacturing suppliers throughout new product introduction (NPI), package definition, and design phases; drive alignment between design intent and manufacturing capability.

Identify, evaluate, and launch projects with new strategic suppliers and emerging package technologies to advance Semtech's packaging roadmap.

Mentor junior packaging engineers and contribute to continuous improvement of design methodologies, tools, and workflows.

Minimum Qualifications

Bachelor's degree in Electrical Engineering, Physics Engineering, or a related field, with 8+ years of experience as an IC Package Design Engineer or Signal Integrity Engineer.
Deep expertise in high-speed transmission line theory, multi-domain power delivery network (PDN) design, and package-level signal integrity — including crosstalk, impedance control, and return-loss optimization.
Hands-on proficiency with industry-standard EDA tools: Keysight Advanced Design System (ADS), Cadence Advanced Package Designer (APD/SiP), and Ansys HFSS.
Demonstrated experience with RF/SI measurement equipment including Vector Network Analyzers (VNA) and Time-Domain Reflectometers (TDR).
Familiarity with multiple advanced packaging technologies: 2D, 2.5D, 3D, Fan-In, Fan-Out (FOCOS), high-density substrate, silicon bridge interconnects, and Chip-On-Board (COB).
Experience in optoelectronics package design or opto-electronic assembly is a strong asset.
Working knowledge of JEDEC specification JESD47H (Stress-Test-Driven Qualification of Integrated Circuits) and its design implications.
Proven ability to manage supplier relationships and drive technical alignment throughout NPI and package qualification phases.
Strong written and verbal communication skills, with the ability to produce high-quality technical documentation for both internal and customer-facing audiences.

Desired Qualifications

Master's degree or Ph.D. in Electrical Engineering, Physics, or a related discipline.
Experience with opto-electronic package assembly and photonic integration is highly desirable.
Background in Datacenter or high-speed communications product development (400G, 800G, 1.6T).
Familiarity with thermo-mechanical simulation tools and reliability engineering methodologies (e.g., finite element analysis for package stress modeling).
Experience working in a fabless semiconductor environment with global contract manufacturing partners.

Career Growth Philosophy

At Semtech, we seek innovation and leadership from each and every member of our team. Our goal is to ensure that our talented professionals are equipped with the support, resources, and opportunities they need to excel — both technically and professionally. Our pay-for-performance philosophy provides recognition and prestige coupled with a competitive compensation and benefits package, including equity participation. We invest in your growth because your success is our success.

The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may be required to perform job-related tasks other than those specifically included in this description.

All duties and responsibilities are essential job functions and requirements and are subject to possible modification to reasonably accommodate individuals with disabilities.

We are proud to be an EEO employer M/F/D/V. We maintain a drug-free workplace.

We may leverage Artificial Intelligence (AI) tools to enhance efficiency during candidate screening, assessment, and recruitment. Final hiring decisions remain with our Hiring Teams, not AI systems.

A reasonable estimate of the pay range for this position is $150,000 - $164,000. There are several factors taken into consideration in determining base salary, including but not limited to: job-related qualifications, skills, education and experience, as well as job location and the value of other elements of an employee’s total compensation package.

About the company

Semtech makes high-performance semiconductors, IoT systems, and cloud connectivity for telecom, environmental monitoring, and audiovisual markets. Its XR60 5G Router Solution combines 5G and Wi-Fi 6 in a compact, durable device for demanding environments. LoRa enables wide IoT deployments for decarbonization and efficient data collection, while BlueRiver uses AV over IP chipsets to transmit uncompressed 4K HDR video with zero latency over standard Ethernet (SDVoE). The company earns from selling hardware, software, and connectivity services, differentiating itself with an integrated mix of semiconductors, LoRa IoT, and SDVoE video networking to serve niche networking, sustainability, and professional video needs, with a goal to enable reliable connectivity, monitor environments, and accelerate decarbonization and digital transformation.

Company Size

1,001-5,000

Company Stage

IPO

Headquarters

Camarillo, California

Founded

1960

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Simplify's Take

What believers are saying

Fiscal 2026 revenue hit $1.05 billion, up 15%, with $59.1 million free cash flow.
September 2026 50G fronthaul entered full production for 5G-Advanced deployments.
HIFU acquisition strengthens indium phosphide supply for 1.6T and 3.2T modules.

What critics are saying

Broadcom and Marvell outscale Semtech in optics, threatening pricing and socket wins.
Q1 2027 guidance embeds 52.8% gross margin despite HIFU ramp costs.
A weak 50G PON rollout delays GN7153C revenue and leaves Semtech dependent on data-center optics.

What makes Semtech unique

September 2026 GN7153C combines GPON, XGS-PON, and 50G PON in one SFP-DD.
September 2026 AirLink plus Palo Alto Networks integrates edge routers with NGFWs.
Semtech's linear optics and LoRa portfolios span data center, broadband, and industrial IoT.

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Benefits

Hybrid Work Options
Flexible Work Hours

Company News

MarketScreener

Oct 24th, 2026

Semtech Corporation adds new resilient communications building blocks to its airlink 5G Networking Solutions.

Semtech Corporation adds new resilient communications building blocks to its airlink 5G Networking Solutions. Published on 10/24/2026 at 08:51 am EDT S&P Capital IQ Semtech Corporation was adding new resilient communications building blocks to its AirLink(R) 5G Networking Solutions. Semtech will demonstrate the new capabilities in booth #2964 at the International Association of Chiefs of Police (IACP) conference in Orlando, Fla. Semtech?s AirLink XR60, XR80 and XR90 in-vehicle 5G routers support network slicing, FIPS 140-3 and fleet management for public safety agencies. The AirLink XR90, XR80 and XR60 in-vehicle 5G routers are built for public safety fleets. All three are FirstNet Trusted? for use on FirstNet, built with AT&T, and certified for both T-Mobile?s T-Priority and Verizon?s Frontline network slices, giving agencies dedicated, prioritized access to emergency network resources on either carrier. With the new AirLink OS 6.1 operating system release, compatible AirLink routers can meet the new Federal Information Processing Standards (FIPS) 140-3 through a software update, with no hardware replacement required. FIPS 140-3 replaces FIPS 140-2, whose certificates the National Institute of Standards and Technology?s Cryptographic Module Validation Program (CMVP) moved to its Historical List on Sept. 21, 2026. New fleet management groups in Semtech?s AirLink Management Service platform let administrators set the software and configuration standard for each device model, check compliance across the fleet immediately and correct devices that are not configured to the standard. AirLink Manager /AirLink Mobility Manager 2.18.1 extends that flexibility further, adding on-premises management options across the full AirLink OS portfolio, so agencies can manage fleets in the cloud or air-gapped. At booth #2964, attendees can see an interactive network slicing demonstration, Semtech?s cloud and on-premises management platforms and integrations with in-vehicle technology providers. (C) S&P Capital IQ - 2026

Semtech

Oct 24th, 2026

Semtech brings 5G Network Slicing, FIPS 140-3 to IACP 2026.

Semtech brings 5G Network Slicing, FIPS 140-3 to IACP 2026. AirLink 5G Solutions Keep First Responders Connected During Peak Network Demand CAMARILLO, Calif., Oct. 24, 2026 - Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductors powering AI data center networking and intelligent, connected Internet of Things ("IoT") devices worldwide, is adding new resilient communications building blocks to its AirLink(R) 5G Networking Solutions. Semtech will demonstrate the new capabilities in booth #2964 at the International Association of Chiefs of Police (IACP) conference in Orlando, Fla. First responders rely on in-vehicle connectivity for computer-aided dispatch, live video and mobile data. When a mass-casualty incident, large-scale event or natural disaster pushes commercial networks to capacity, public safety traffic can get caught in the same congestion. In a recent survey, 64% of first responders named unreliable network connectivity as their single biggest concern (Source: T-Mobile, "5G and Public Safety: Transforming Emergency Response with T-Priority," T-Mobile Newsroom, 2025). "Resilient communication is not a capacity problem; it's a priority and a data security problem," said Kinana Hussein, vice president of networking solutions at Semtech. "AirLink networking solutions help address both. Network slicing support gives public safety dedicated, prioritized access to network resources, and AirLink OS 6.1 helps agencies meet FIPS 140-3 through a software update, with no hardware replacement." AirLink XR90, XR80 and XR60 Routers The AirLink XR90, XR80 and XR60 in-vehicle 5G routers are built for public safety fleets. All three are FirstNet Trusted(TM) for use on FirstNet, built with AT&T, and certified for both T-Mobile's T-Priority and Verizon's Frontline network slices, giving agencies dedicated, prioritized access to emergency network resources on either carrier. FIPS 140-3 and Zero Trust With the new AirLink OS 6.1 operating system release, compatible AirLink routers can meet the new Federal Information Processing Standards (FIPS) 140-3 through a software update, with no hardware replacement required. FIPS 140-3 replaces FIPS 140-2, whose certificates the National Institute of Standards and Technology's Cryptographic Module Validation Program (CMVP) moved to its Historical List on Sept. 21, 2026. Semtech's Zero Trust architecture builds on its recently announced integration with Palo Alto Networks Next-Generation Firewalls. Fleet Management Built to Scale New fleet management groups in Semtech's AirLink Management Service platform let administrators set the software and configuration standard for each device model, check compliance across the fleet immediately and correct devices that are not configured to the standard. AirLink Manager / AirLink Mobility Manager 2.18.1 extends that flexibility further, adding on-premises management options across the full AirLink OS portfolio, so agencies can manage fleets in the cloud or air-gapped. Semtech at IACP 2026 Booth 2964 Greg Hill, Semtech director of product management, AirLink Networking Solutions, and Dan Robinson, Semtech director of AirLink government sales and a former police chief, will present "5G Network Slicing, Satellite, Zero Trust: The New Building Blocks of Resilient Communications" on Monday, Oct. 26 from 3:15-3:45 PM EDT. At booth #2964, attendees can see an interactive network slicing demonstration, Semtech's cloud and on-premises management platforms and integrations with in-vehicle technology providers. About Semtech Semtech Corporation (Nasdaq: SMTC) is a leading provider of high-performance semiconductors powering AI data center networking, IoT connectivity and intelligent connected devices worldwide. Its global teams are committed to empowering solution architects and application developers to develop breakthrough products for the infrastructure, industrial and consumer markets. To learn more, visit Semtech.com or follow HieFo Corporation on LinkedIn or X. Semtech, the Semtech logo and AirLink are registered trademarks or service marks of Semtech Corporation or its subsidiaries. All other trademarks, service marks and trade names mentioned in this press release are the property of their respective owners. SMTC-P Press contact.

Yahoo Finance

Oct 22nd, 2026

Semtech's LoRa sales hit record $58M, up 58% as Amazon Sidewalk expands

Semtech's LoRa business is growing fast. LoRa-enabled net sales hit a record $58 million in the second quarter of fiscal 2027, up 31% from the previous quarter and 58% from a year earlier. Management expects third-quarter LoRa revenue to rise about 15% sequentially and 65% year over year. It now sees long-term growth above its previous 20% benchmark. Demand spans smart homes, security systems, and industrial monitoring. Its LoRa Gen 4 platform offers higher data speeds with low power use, and Amazon Sidewalk is expanding from the US to Canada and Mexico, with Europe, Australia, and Japan to follow. Semtech shares are up 92.2% year to date, against 38.4% for its industry. It trades at a forward price-to-sales ratio of 7.36.

Converge! Network Digest

Oct 14th, 2026

Tower and Semtech secure SiGe capacity for AI optical interconnects.

Tower and Semtech secure SiGe capacity for AI optical interconnects. Tower and Semtech expand their multiyear SiGe manufacturing partnership to support AI optical interconnects, reserving capacity in the U.S., Israel and Japan. Semtech will invest in dedicated silicon germanium (SiGe) manufacturing capacity at Tower Semiconductor under an expanded multiyear agreement supporting AI data center interconnects. The arrangement extends a 20-year partnership and covers fabs in the United States, Israel and Japan. Financial terms, wafer volumes and a detailed capacity ramp schedule were not disclosed. The agreement supports Semtech's transimpedance amplifiers (TIAs), modulator and laser drivers, and linear equalizers as interconnects advance from 800G and 1.6T toward 3.2T. The companies also continue joint technology-roadmap development, linking manufacturing commitments with successive generations of high-speed analog components. Semtech's earlier 224 Gbps-per-lane portfolio illustrates the components involved. Its four- and eight-channel TIAs incorporate equalization, while its modulator drivers support silicon photonics, indium phosphide and thin-film lithium niobate transmitters. These devices address linear pluggable optics (LPO), linear receive optics (LRO), near-packaged optics (NPO) and co-packaged optics (CPO), with link monitoring and telemetry integrated into the signal chain. | Tower-Semtech: Key Points | | - Agreement | Multiyear dedicated SiGe capacity. | | - Geography | U.S., Israel and Japan. | | - Components | TIAs, drivers and equalizers. | | - Roadmap | 800G | 1.6T | 3.2T. | | - Disclosure | Investment amount and volumes undisclosed. | "Connectivity is now a primary factor in how far AI systems can scale," said Hong Hou, Semtech President and CEO. Analysis. The agreement highlights the manufacturing requirements behind faster optical links. Moving more processing out of a module does not remove the need for high-performance analog circuitry. Semtech's linear-optics portfolio still requires low-noise receive amplification, linear transmit drivers and equalization, with electrical characteristics matched to the optical technology and host interface. Its support for multiple transmitter materials also places the analog signal chain across several photonic implementations. Tower's SiGe and silicon photonics platforms address different parts of that chain. SiGe supports high-speed analog electronic circuits, while silicon photonics implements optical functions. Tower describes geographically separated, cross-qualified manufacturing for its major technology nodes. The editorial significance is that optical-interconnect scaling depends on both device performance and qualified production capacity; a faster demonstration alone does not establish the supply needed for deployment. | Company Profile - Tower Semiconductor | | Headquarters | Migdal Haemek, Israel | | CEO | Russell Ellwanger | | Founded | 1993 | | Status | Public company · Nasdaq/TASE: TSEM | | Business | Specialty analog semiconductor foundry providing process development, manufacturing and design enablement. | | Technologies | SiGe and silicon photonics; RF, mixed-signal CMOS, image sensors and power management. | | Website | towersemi.com | | Company Profile - Semtech | | Headquarters | Camarillo, California, USA | | President & CEO | Hong Hou | | Founded | 1960 | | Status | Public company · Nasdaq: SMTC | | Business | Semiconductors for data center connectivity and IoT applications. | | Optical Portfolio | TIAs, laser and modulator drivers, equalization and telemetry for high-speed optical links. | | Website | semtech.com | | Related Converge Digest Coverage | | September 21, 2026 · Dense Pluggable Optics ECOC: Semtech Joins XPO MSA with 200G/Lane Driver for 12.8T Optics Extends Semtech's analog portfolio into a higher-density pluggable ecosystem. | | September 9, 2026 · Optical Components Semtech Targets NPO and CPO with 224G Linear Optical Chipset Details the TIAs and modulator drivers supporting packaged optical engines. | | August 11, 2026 · Photonic Design Tower and OpenLight Target 1.6T, NPO and CPO with Cadence Shows Tower's complementary work on integrated photonic manufacturing and design tools. | | March 23, 2026 · Silicon Photonics Tower Semiconductor and Coherent Demo 400G/lane in SiPho Provides context for the next increase in per-lane optical bandwidth. | | February 11, 2026 · Foundry Capacity Tower Boosts Silicon Photonics Investment to $920M on 1.6T Demand Background on Tower's broader SiPho and SiGe expansion program. | Converge Digest is tracking the latest developments in optical networking. Follow its ongoing coverage at https://convergedigest.com/category/optical/ Help others discover this reporting. Editorial responsibility Jim Carroll. Editor & Publisher Every article published by Converge Digest is researched, curated, fact-checked and editorially reviewed by Jim Carroll, Editor & Publisher. AI-assisted drafting may be used to accelerate production, but all content is reviewed, refined and approved prior to publication. From the Technology Graveyard You just read about Optical. A technology from the archive that helped get Converge Digest here: SPARC / MIPS / PA-RISC served 1980-2021. What ultimately replaced it? On this day. October 13 From 25 years of the Converge Digest archive.

Asianet News

Oct 13th, 2026

TSEM stock bucks market selloff on Semtech AI chip deal securing capacity across 3 regions.

TSEM stock bucks market selloff on Semtech AI chip deal securing capacity across 3 regions. Published: Oct 13 2026, 06:00 PM IST * FB * TW * Linkdin * Whatsapp * GNFollow Us Tower CEO Russell Ellwanger said the companies are qualifying solutions ahead of anticipated demand for future generations of optical connectivity products. * Semtech will invest in securing dedicated silicon germanium capacity at Tower's facilities in the U.S., Israel and Japan. * The agreement is intended to support demand for optical interconnect components and connectivity technologies spanning 800G, 1.6T and 3.2T. * The companies will continue joint technology development, including work on optical components built using Tower's SiGe manufacturing technology. Tower Semiconductor (TSEM) on Tuesday announced that it was extending its 20-year partnership with Semtech (SMTC) with a multi-year agreement aimed at securing chip supply for AI data center connectivity products. The company said that Semtech would invest in securing dedicated silicon germanium (SiGe) manufacturing capacity at Tower to support strong design wins and rising demand for optical interconnect components used in AI data centers. It added that the capacity will span Tower's manufacturing facilities in the U.S., Israel and Japan, giving Semtech greater supply assurance and geographic diversification. TSEM stock rose as much as 2% in pre-market trade. On Stocktwits, retail sentiment around the company dipped to 'neutral' from 'bullish' territory over the past day. Meanwhile, SMTC stock fell over 3% with sentiment trending in 'bearish' territory, despite getting a price target hike from BMO Capital. Analyst Harsh Kumar raised the price target to $230 from $255 and reiterated an 'Outperform' rating on the shares ahead of the firm's analyst day later this week. Tower, Semtech target next generation of AI data center connectivity. Semtech CEO Hong Hou said the expanded agreement would help the company meet rising customer demand and support the next generation of connectivity products. "Meeting that demand requires long-term capacity planning and commitment with our manufacturing partners," Hou said, adding that the agreement would support copper and optical interconnects from 800 gigabits per second (G) and 1.6 terabits per second (T) through 3.2T and beyond. The agreement comes as AI data centers require faster connections to move increasing volumes of data between processors, servers and storage systems. Partnership covers manufacturing capacity, technology development. The companies said their collaboration extends beyond securing manufacturing capacity to joint technology development. Semtech recently received an Optical Component Innovation award at the European Conference on Optical Communication (ECOC) 2026 for its 224-gigabits-per-second-per-lane transimpedance amplifier family for linear pluggable optics, which is built on Tower's SiGe technology. Tower CEO Russell Ellwanger said the companies were qualifying solutions ahead of anticipated market demand to prepare for the next generations of optical connectivity products. TSEM stock has gained over 70% this year, while SMTC stock has more than doubled, surging over 120%. Read also: Dan Ives Says Semiconductor Sell-Off Is 'Way Overdone' As AI Spending Fears Rattle NVDA, MU, SKHY, SNDK For updates and corrections, email newsroom[at]stocktwits[dot]com.< Stay updated with all the latest Business News, including market trends, Share Market News, stock updates, taxation, IPOs, banking, finance, real estate, savings, and investments. Track daily Gold Price changes, updates on DA Hike, and the latest developments on the 8th Pay Commission. Get in-depth analysis, expert opinions, and real-time updates to make informed financial decisions. Download the Asianet News Official App from the Android Play Store and iPhone App Store to stay ahead in business. 0 Comments / 0 New