Summer 2027

Software Engineer Intern

NHRC

Updated on 9/3/2026

Teledyne

Teledyne

11-50 employees

Manufactures sensors, imaging systems, and avionics

No salary listed

No H1B Sponsorship

Huntsville, AL, USA

In Person

Housing is not provided; the intern must arrange their own housing.

US Citizenship Required

Bachelor's

Category
Software Engineering
Required Skills
Microsoft Azure
Data Structures & Algorithms
ASP.NET
Java
.NET
C#
Web Development
C/C++

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Requirements
  • Current enrollment in an accredited college or university with completion of at least two years toward a degree in Software Engineering, Computer Science, or a related field.
  • A strong foundation in an object-oriented programming language such as C#, C++, or Java.
  • Basic knowledge of object-oriented programming concepts including classes, interfaces, encapsulation, and inheritance.
  • Basic knowledge of data structures and algorithms including arrays, lists, stacks or queues, and hash maps.
  • Basic knowledge of software design principles including modularity and separation of concerns.
  • U.S. citizenship is required due to classified work and facility access restrictions.
Responsibilities
  • Implement simple front-end or back-end features.
  • Support browser compatibility testing and basic debugging under supervision.
  • Fix minor bugs identified by the team.
  • Participate in team meetings, sprint planning, and code reviews to learn about the software development lifecycle.
  • Communicate progress to mentors or team leaders.
  • Shadow experienced software engineers to learn best practices in modular design, code reuse, and maintainability.
  • Learn new technologies, tools, and workflows, including .NET, Visual Studio, and Azure DevOps.
  • Complete small research or prototyping tasks to explore new features or technologies.
Desired Qualifications
  • Prior exposure to the employer's technology stack, including C# and .NET web development with Blazor or ASP.NET.
  • Ability to explain technical concepts in written and verbal form to diverse audiences and contribute to team discussions.
  • Ability to ask timely questions needed to complete tasks.
  • Ability to work effectively in cross-functional teams.
  • Ability to identify and resolve UI/UX challenges and performance issues.
  • Adaptability to changing requirements and willingness to learn new technologies.
  • Ability to prioritize tasks and meet deadlines.

Teledyne designs and manufactures sensors, imaging cameras, and electronics for aerospace, defense, environmental monitoring, and medical imaging. Its products combine core sensing and imaging capabilities into integrated solutions, including digital imaging sensors, high-reliability cameras, instrumentation, aerospace and defense electronics, and engineered systems for harsh environments. The company differentiates itself by growing through targeted acquisitions, building a diversified portfolio with specialized capabilities and high barriers to entry. Its goal is to expand capabilities and market reach by acquiring complementary technologies while delivering reliable sensing and imaging technology for critical industries.

Company Size

11-50

Company Stage

IPO

Headquarters

Thousand Oaks, California

Founded

1960

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Simplify Jobs

Simplify's Take

What believers are saying

  • Roman launched August 30, 2026, validating Teledyne detectors across NASA and ESA missions.
  • Teledyne FLIR won the U.S. Army DUTCH award on August 27, 2026.
  • Everspin and Teledyne HiRel partnered September 2, 2026, expanding defense MRAM offerings.

What critics are saying

  • BIS fined Teledyne FLIR $1 million in February 2026 for 19 export violations.
  • Teledyne faces Supreme Court docket 25A1388 in 2026, prolonging Raj Shekar litigation.
  • Varex antitrust approval for the $1.1 billion deal can still block early-2027 closing.

What makes Teledyne unique

  • Teledyne spans sensors, cameras, and electronics from deep-sea robotics to space telescopes.
  • Teledyne FLIR and DALSA own hard-to-replace thermal and scientific imaging platforms.
  • Teledyne SevenCs anchors maritime navigation software as S-100 standards reshape bridge workflows.

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Benefits

Hybrid Work Options

Company News

LinkeWire
Sep 4th, 2026
Machine Vision Device Market to expand at 11.5% CAGR as ai-driven automation reshapes industrial inspection.

Machine Vision Device Market to expand at 11.5% CAGR as ai-driven automation reshapes industrial inspection. The Machine Vision Device Market is moving beyond conventional camera-based inspection and becoming a core intelligence layer for automated manufacturing. As factories demand higher throughput, tighter tolerances and fewer manual quality checks, machine vision devices are increasingly responsible for seeing, measuring, identifying and guiding production decisions in real time. The market is projected to grow strongly through 2034, supported by accelerating adoption of 2D and 3D vision, AI-enabled image processing, robotics and automated quality control. Recent market estimates place the global opportunity at approximately 12.5 billion in 2025, with an industry forecast indicating an 11.5% CAGR through 2034. Market Dynamics The strongest growth driver is the industrial shift from inspection after production to continuous, data-driven quality assurance. Machine vision devices can inspect components at production speed while identifying defects, dimensional deviations, incorrect assembly and surface imperfections. This is particularly valuable in automotive, electronics, semiconductor, pharmaceutical, food and packaging operations. AI is also changing the economics of machine vision. Traditional rule-based inspection can struggle with product variation, complex surfaces and changing production conditions. Deep-learning vision systems can handle more variable visual patterns, allowing manufacturers to deploy inspection across higher-mix production environments. Discover more Try Photo Hosting The key restraint remains integration complexity. Vision devices often need appropriate lighting, optics, computing infrastructure, software and industrial communication interfaces. Poor system calibration or inadequate integration can reduce the expected return on investment. Supply-chain constraints involving sensors, processors and specialized components can also affect deployment timelines. Key Players Analysis Competition is increasingly divided between established vision specialists and broader automation companies. Cognex Corporation remains a prominent participant, particularly across industrial inspection and identification applications. KEYENCE, Basler, SICK, OMRON, Teledyne Technologies, FANUC, MVTec Software and other technology providers compete across cameras, sensors, software, robotics and integrated vision platforms. The competitive advantage is shifting from hardware specifications alone toward complete solutions. Vendors able to combine high-speed imaging, edge processing, AI algorithms, industrial connectivity and easy configuration are better positioned to capture recurring demand. Regional Analysis Asia-Pacific represents the most strategically important growth center because of its large electronics, automotive, semiconductor and industrial manufacturing base. China, Japan, South Korea and India are increasing investments in factory automation, robotics and intelligent inspection. Asia-Pacific accounted for 43.7% of the broader global machine vision market in 2025, demonstrating the region's manufacturing influence. Discover more Video Content Promotion Market Trend Reports Content Promotion Services North America benefits from advanced automation adoption, reshoring initiatives and strong demand for inspection technologies across aerospace, medical devices, automotive and electronics. Europe remains highly relevant because of its engineering-intensive automotive and machinery industries, with Germany serving as an important automation hub. Recent industry developments are centered on AI-powered inspection, 3D perception, edge computing and robotics integration. Manufacturers increasingly want vision systems that can make decisions directly on production equipment rather than continuously transferring image data to centralized systems. The expansion of 3D machine vision is particularly significant. Three-dimensional sensing enables machines to understand depth, geometry and object positioning, making it valuable for robotic picking, dimensional inspection and complex assembly. The broader 3D machine vision segment is forecast to grow rapidly as manufacturers pursue higher precision and more flexible automation. Market Segmentation The Machine Vision Device Market can be segmented by: | Segment | Key Categories | | Type | 2D Vision Systems, 3D Vision Systems, Hyperspectral Imaging Systems, Laser Scanners, Thermal Cameras | | Application | Quality Inspection, Measurement, Identification, Positioning & Guidance | | Technology | Rule-Based Vision, AI-Based Vision, Deep Learning | | End Use | Automotive, Electronics, Manufacturing, Pharmaceuticals, Food & Beverage, Logistics | | Distribution | Direct Sales, Distributors, Online Platforms | The strongest commercial opportunity is emerging where vision systems are integrated directly into automated production and robotic workflows rather than purchased as standalone inspection equipment. What is driving the Machine Vision Device Market? Industrial automation, quality-control requirements, robotics integration, AI adoption and demand for real-time inspection are the primary growth factors. Which technology is gaining importance? 3D vision and AI-enabled machine vision are gaining substantial attention because they support complex inspection, robotic guidance and variable production environments. Which region offers strong growth potential? Asia-Pacific remains a major opportunity because of its manufacturing scale and accelerating factory automation investments. What industries use machine vision devices? Major applications include automotive, electronics, semiconductor manufacturing, pharmaceuticals, food and beverage, packaging, logistics and general manufacturing. What is the market growth outlook? The market is expected to maintain strong expansion through 2034, with one recent industry estimate projecting an 11.5% CAGR over the forecast period. Thanks for reading this article; you can also get individual chapter-wise sections or region-wise report versions like North America, LATAM, Europe, or Southeast Asia. About Author: HTF Market Intelligence is a leading market research company providing end-to-end syndicated and custom market page, consulting services, and insightful information across the globe. With over 15,000+ page from 27 industries covering 60+ geographies, value research page, opportunities, and cope with the most critical business challenges, and transform businesses. Analysts at HTF MI focus on comprehending the unique needs of each client to deliver insights that are most suited to their particular requirements. Contact Us: Nidhi Bhawsar (PR & Marketing Manager) HTF Market Intelligence Consulting Private Limited Phone: +15075562445 [email protected]

Semiconductor for You
Sep 2nd, 2026
Everspin Technologies and Teledyne HiRel Semiconductors partner to accelerate MRAM adoption in aerospace and defense applications.

Everspin Technologies and Teledyne HiRel Semiconductors partner to accelerate MRAM adoption in aerospace and defense applications. New partnership will bring Everspin 256Mb PERSYST MRAM into Teledyne HiRel Semiconductors' memory solutions for mission-critical systems. CHANDLER, Ariz., and GARLAND, Texas, Sept. 2, 2026 - Everspin Technologies, Inc. (NASDAQ: MRAM), the world's leading developer and manufacturer of MRAM solutions, and Teledyne HiRel Semiconductors (Teledyne HiRel), a business unit of Teledyne Technologies Incorporated (NYSE: TDY) and a leading supplier of high-reliability semiconductor solutions, today announced a strategic partnership to accelerate adoption of Everspin's MRAM in aerospace, defense and other demanding systems. This collaboration will begin with the 256Mb PERSYST spin-transfer torque MRAM (STT-MRAM), a non-volatile memory that combines RAM-like speed with the ability to retain data through power loss, system resets and unexpected interruptions. Through the new partnership, Teledyne HiRel will initially offer Everspin's 256Mb PERSYST STT-MRAM as part of its memory products portfolio for military and aerospace customers, with target applications including avionics, VPX and single-board computer platforms, radar and electronic warfare payloads, satellite electronics, autonomous systems and other next-generation electronic solutions. The agreement also covers other PERSYST STT-MRAM products, including 64Mb and 128Mb options, giving customers additional density choices as program requirements vary. As component availability, lifecycle planning and long-term supply become greater considerations for programs with long service lives, customers are evaluating persistent memory options that enable fast writes, high endurance and data retention through power loss. These capabilities are especially important for startup, configuration storage, event logging, recovery and other functions that must remain available throughout the product's service life. Because PERSYST enables frequent writes with high endurance and retains data without battery backup, it can replace or complement NOR flash in applications that need faster updates or power-loss-safe storage, reducing a program's reliance on battery-backed SRAM, hold-up power or capacitor-backed memory schemes. By combining RAM-like access with non-volatility, MRAM can also help simplify architectures that would otherwise require separate volatile memory, non-volatile storage, backup power, wear-leveling strategies or complex data-protection circuitry. Teledyne HiRel will back this new capability with product guidance, screening flows, qualification documentation, procurement support and obsolescence management. "Aerospace and defense programs require memory solutions that can sustain long operating lifecycles, documented qualification requirements and reliable performance in harsh environments," said Mont Taylor, Vice President of Business Development at Teledyne HiRel Semiconductors. "By adding Everspin's PERSYST STT-MRAM to our non-volatile memory portfolio, we give customers a qualified path to specify persistent memory for their most critical applications." "PERSYST MRAM delivers a unique combination of endurance, instant-on data retention and high-performance operation," said Sanjeev Aggarwal, President and CEO of Everspin Technologies. "Through our partnership with Teledyne HiRel, customers gain access not only to advanced MRAM technology, but also to the screening expertise and supply continuity needed throughout extended program timelines. This collaboration helps reduce adoption barriers while providing confidence in long-term product availability." PERSYST MRAM products will ship from Teledyne HiRel Semiconductors' facility in Milpitas, California, with customer availability anticipated in the fourth quarter of 2026.

Business Wire
Aug 31st, 2026
Teledyne surpasses 1,000 space sensors with NASA's Roman telescope launch

Teledyne Space Imaging has surpassed 1,000 scientific imaging sensors in space following NASA's Nancy Grace Roman Space Telescope launch on 30 August aboard a SpaceX Falcon Heavy rocket. The company supplied detector technologies for both of Roman's primary instruments under a $23 million contract awarded in 2018, later expanded to deliver 28 sensor chip assemblies. For Roman's Wide Field Instrument, Teledyne provided 18 H4RG-10 infrared detector arrays, creating the largest infrared focal plane ever flown in space with over 300 million pixels. The company also supplied three CCD311-20 detectors for the telescope's advanced Coronagraph Instrument. Roman will survey billions of galaxies to investigate dark energy and identify thousands of exoplanets. Teledyne's imaging sensors also support missions including Hubble, James Webb, and ESA's Sentinel programmes.

Valeport
Aug 27th, 2026
Teledyne Valeport at WWEM 2026.

Teledyne Valeport at WWEM 2026. Posted 27 August 2026 | News Teledyne Valeport is pleased to be returning to the annual Water, Wastewater and Environmental Management (WWEM) Expo, Europe's premier event for the water management, quality, treatment and wastewater sectors. Taking place on 16-17 September 2026 at the NEC Birmingham, the Expo brings together industry professionals, researchers, and suppliers to address the sector's most pressing challenges. Visit Valeport Ltd at stand WW-K92, where Valeport Ltd'll be featured as part of Teledyne Water's stand along with two other specialist Teledyne businesses: Teledyne ISCO, and Teledyne Gas & Flame Detection. Teledyne Water's stand at WWEM offers a comprehensive look at instrumentation from cutting-edge sensors to precision flowmeters, so whether you're focused on water quality or infrastructure monitoring, its team will be on hand to demonstrate the latest technologies and discuss how they can support your applications. Visitors can explore the Teledyne 0810 doppler velocity probe and the 804 insertion flowmeter - which will be presented in a pipe to demonstrate its in-situ configuration, a great opportunity to see how it integrates into real-world systems. Also on display will be the Pipe ID Gauge, a solution offering accurate pipe dimensions, reducing errors in flow calculations. If you're attending WWEM 2026, stop by the Teledyne Water stand to see its technologies in action, speak to its specialists and find out how Teledyne Water's solutions can support your water and wastewater applications.

SPIE Europe
Aug 27th, 2026
Teledyne FLIR to develop new uncooled thermal imagers for US Army.

Teledyne FLIR to develop new uncooled thermal imagers for US Army. Program award under 'DUTCH' initiative is intended to enhance next-generation sensors. 27 August 2026 Teledyne FLIR OEM says that the US Army's 'DUTCH' award strengthens the trusted domestic US thermal imaging industrial base, critical to defense modernization and drone priorities. Image: Teledyne FLIR OEM. Teledyne FLIR's OEM division has announced its selection under the US military's so-called "Delivering Unmatched Thermal Capability Hastened" (DUTCH) initiative, for which it is set to develop compact new uncooled imagers. Focused on strengthening thermal sensor performance, the program will also look to reduce size, weight, power, and cost (SWaP-C) requirements, while maintaining high-volume production capability. California-headquartered Teledyne FLIR OEM adds that the work will build on its prior investment in advanced small-pixel pitch uncooled thermal architectures, including recent product innovations intended to scale integration across defense missions, one example being uncrewed platforms. Paul Clayton, the president of Teledyne FLIR OEM, commented: "Teledyne FLIR OEM is proud to contribute to the US Army's efforts to accelerate next-generation uncooled thermal performance while strengthening a secure, resilient domestic industrial base. "Our ability to deliver state-of-the-art, NDAA-compliant thermal imaging solutions on time and at scale helps reduce program risk and ensure reliable long-term access for critical defense programs, like Drone Dominance." NDAA compliance relates to the 2019 US National Defense Authorization Act, which bans the use of equipment made by a number of international suppliers, notably China's Huawei and ZTE. Secure supply chains Examples of Teledyne FLIR OEM's NDAA-compliant uncooled thermal imaging products include the Boson+ platform with zoom lens capability, the dual-sensor Hadron 640 that combines infrared and visible imaging, and the firm's cost-effective Lepton camera modules. The company says that its AI-ready architecture, with optional factory-integrated continuous zoom lenses, provide superior performance for drones, handheld thermal devices, weapon sights, and loitering munitions. According to Teledyne the DUTCH initiative aligns with the Pentagon's priorities to strengthen secure microelectronics supply chains while restoring domestic manufacturing capacity for mission-critical technologies. Teledyne FLIR OEM, which operates out of locations in Santa Barbara, Boston, and Charlotte, describes itself as a "non-traditional" defense contractor providing high-volume manufacturing and system-level integration for uncooled thermal imaging systems, helping expand a scalable, low-risk domestic supply base for infrared components. George Bobb, the CEO and president of parent company Teledyne Technologies, added: "A trusted, scalable, and resilient domestic supply of high-performance thermal imaging camera modules is vital to US national security. "Across Teledyne, we are committed to moving quickly to develop and deliver the critical defense technologies needed by our war fighters." Last month Teledyne Technologies announced record-breaking quarterly sales of $1.66 billion, with the company's digital imaging segment accounting for $869 million of that total, a rise of 13 per cent year-on-year thanks largely to higher sales of infrared imaging detectors, components, and subsystems for both defense and commercial applications.