Description

Job Title: Principal Engineer, System HW Design - SI/PI

Job Location: Bangalore, India (This position requires a full-time, on-site presence in our Bangalore, India Office)

Job ID: AI2545

Job Description:

As Principal Engineer, System HW Design - SI/PI, you will be part of the Systems Hardware Engineering Team that designs, builds, brings-up, and productizes PCB boards for SiMa.ai. This showcases SiMa's MLSoC™ Machine Learning SoC across bring-up and debug, characterization, customer samples, and eventual production. In this role, you will define and drive SI/PI strategy across our entire MLSoC product line — spanning System-on-Module designs, PCIe add-in cards, chip-down BGA reference designs, and full development platforms. This is a significant technical contributor role that will define how signal and power integrity (SI/PI) is implemented across the hardware organization. Working with internal teams and external vendors, the role will guide PCB design, simulation, and lab validation to ensure reliable high-speed signaling and power delivery across our hardware platforms.

Role & responsibilities:

Define, document (including simulation reports and design decisions),own SI/PI architecture, design guidelines, review processes, and sign-off criteria across the full SiMa.ai product portfolio (SoM, PCIe HHHL card, chip-down BGA design, DevKit carrier, and future platforms).
Serve as the technical specialist on high-speed interface margin closure: PCIe Gen5 (root complex, up to 32 GT/s/lane), MIPI CSI/DSI (C-PHY/D-PHY), USB 3.x/Type-C, 10 Gigabit Ethernet SerDes, and LPDDR memory channels
Drive stack-up, impedance, and channel budget decisions across concurrent board programs, resolving trade-offs between cost, manufacturability, and signal margin at the product-line level
Own power delivery network (PDN) architecture for high-transient-current AI accelerator silicon, setting design targets and review standards used across all boards
Set the long-term connector/interconnect strategy across product generations (board-to-board, M.2 NVMe, PCIe edge-card interfaces)
Define lab validation standards and own escalation-level debug for the hardest SI/PI bring-up issues across programs
Own the SI/PI simulation tool strategy and flow (Ansys HFSS/SIwave, Cadence Sigrity/Clarity, Keysight ADS, or equivalent) — evaluate and select tools, and build reusable methodology assets for the team
Own or support compliance testing (PCIe-SIG, USB-IF, MIPI Alliance) for interfaces on production and pre-production boards
Engage with component/module vendors and standards bodies as needed to stay ahead of emerging high-speed interface requirements

Minimum Requirements:

Bachelor's in Electrical Engineering or a related field. Master’s degree preferred with 15 years of industry experience in signal integrity and power integrity engineering for high-speed digital systems, including experience leading SI/PI strategy across multiple concurrent programs
Deep, demonstrated expertise with PCIe Gen4/Gen5, DDR4/DDR5/LPDDR, USB 3.x, and MIPI D-PHY/C-PHY signaling, including having driven margin closure on production designs
Proven track record owning PDN architecture for high-power SoCs/ASICs (AI accelerators, GPUs, or comparable compute silicon) at a product-line level
Expert-level proficiency with SI/PI EDA tools: Ansys HFSS/SIwave, Cadence Sigrity/Clarity, Keysight ADS, or similar, including tool selection and methodology development
Extensive hands-on lab validation experience — VNA, TDR, high-bandwidth oscilloscopes — and experience owning escalation-level debug
Expertise in PCB stack-up design, transmission line theory, S-parameters, and channel modeling.
Strong working knowledge of industry compliance standards (PCIe-SIG, USB-IF, MIPI Alliance)
Demonstrated ability to set technical direction and standards across a hardware organization, and to mentor senior/staff-level engineers
Good cross-functional leadership skills — comfortable driving alignment across ASIC, package, hardware, layout, and firmware teams at a strategic level
Knowledge of ASIC characterization, PCB manufacturing, assembly, test, quality & reliability is a plus.

Personal Attributes:

Demonstrates a proactive, solutions-oriented mindset and takes ownership of outcomes
Collaborates effectively across cross-functional teams and fosters a strong team culture
Intellectually curious, with a creative approach to problem-solving and technical challenges
Execution-focused and results-driven, with a track record of delivering under ambiguity
Self-motivated and highly accountable, with the ability to think strategically and drive long-term impact
Strong verbal and written communication skills, with the ability to convey complex technical concepts clearly to diverse audiences.

About the company

SiMa.ai provides a no-code, drag-and-drop environment for building, training, and deploying machine learning models on edge devices. Its platform lets users visually assemble ML solutions without writing code, and runs on its own MLSoC silicon designed for edge computing to reduce latency and speed up inference close to data sources. The product works by combining the no-code development tools with specialized edge-ready hardware, enabling deployment of ML applications such as computer vision on edge devices. SiMa.ai differentiates itself from competitors by pairing a purpose-built MLSoC with an integrated no-code development platform, plus an ecosystem of a developer portal, expert consulting, and a partner program to accelerate AI innovations at the edge. The company aims to broaden access to edge ML, helping individuals and organizations deploy efficient AI at the edge across various industries.

Company Size

201-500

Company Stage

Series C

Total Funding

$495M

Headquarters

San Jose, California

Founded

2018

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Simplify's Take

What believers are saying

Oct. 2026 workshops in Burlington, Austin, and Bloomington deepen developer adoption.
SiMa.ai says revenue quadrupled from 2024 to 2025 and momentum continued in 2026.
Customer list includes Bosch, Emerson, Synopsys, Micron, Intrinsic, and TRUMPF SE.

What critics are saying

Nvidia Jetson Thor already anchors humanoids; SiMa.ai must displace entrenched design wins by 2028.
Gen 3 hardware slips to H1 2028, leaving years for competitors to widen benchmarks.
If Palette Neat or Modalix miss production economics, SiMa.ai becomes a niche prototyping vendor.

What makes SiMa.ai unique

Sep. 2026 Series C: $500 million raised, $1.45 billion valuation, signaling investor conviction.
Modalix is in production now, with Palette Neat and pin-compatible SiMa SoM.
SiMa.ai targets robots, drones, and ADAS with sub-10W to 60W edge inference.

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Central News Agency (CNA)

Oct 28th, 2026

Taiwan's AerosoarX collaborates with U.S. firms on AI drones.

Taiwan's AerosoarX collaborates with U.S. firms on AI drones. 10/28/2026 06:52 PM Taipei, Oct. 28 (CNA) Taiwanese drone developer AerosoarX signed strategic cooperation memorandums with U.S. companies Rajant and SiMa.ai on Wednesday to develop AI-enabled unmanned systems. The partnerships combine AerosoarX's drone platforms with Rajant's mobile mesh networking technology and SiMa.ai's onboard AI computing, according to a company statement released at its brand launch event in Taipei. The combination is intended to let drones process sensor data onboard and exchange information with one another, supporting coordinated operations with less reliance on continuous ground control, the company said. AerosoarX Chairman Max Lo (羅正方) told reporters that the company had already become a supplier of drone platforms and components in the United States through its cooperation with Rajant. His presentation showed that AerosoarX sent personnel to Rajant's Kentucky facility in September for integration work and was targeting production readiness for its 15-inch AI-enabled first-person-view drone in November. The planned integration uses SiMa.ai's Modalix processor for onboard AI tasks such as visual perception and Rajant's mesh technology for exchanging and relaying data between aircraft. Lo described SiMa.ai as the only solution that met AerosoarX's requirements for 50 trillion operations per second (TOPS) of AI computing within its power constraints. Lo said the choice depended not simply on computing power, but on performance per watt, with AerosoarX co-founder and CEO Jason Wu (吳俊逸) also noting that energy efficiency was critical for drones. SiMa.ai founder and CEO Krishna Rangasayee, meanwhile, told the event that power efficiency and flight time were "very, very critical for success." Rangasayee said his company was working with more than 30 drone companies globally, adding that its processors and software were intended to help partners develop applications more quickly. Rajant Corp. Vice President of Systems Don Gilbreath said greater onboard computing would allow drones to coordinate tasks, altitudes and separation, reducing the need for an operator to manage each aircraft individually. "The more computing horsepower we have on the drones, the more we can do," he said. Gilbreath said the collaboration had already led to drone sales to U.S. Army and Navy research laboratories interested in the team's swarm demonstrations. Not every aircraft would require the same equipment, however, Lo said, explaining that a drone coordinating other aircraft could carry more capable hardware, with units assigned simpler tasks using less expensive configurations. On its U.S. business, Lo clarified that AerosoarX was supplying platforms and working jointly with Rajant, rather than acting as the prime contractor. His presentation identified Phase III of the U.S. Drone Dominance Program as a target for 2027. (By Chao Yen-hsiang)

Business Wire

Oct 5th, 2026

SiMa.ai and Wobot.ai partner to deliver edge-based reasoning video analytics for Physical AI

SiMa.ai and Wobot.ai have partnered to deliver reasoning-based video analytics for Physical AI applications. Wobot.ai's AI-powered video intelligence solution is now available on SiMa.ai's Modalix MLSoC PCIe Card and System-on-Module. The partnership addresses challenges organizations face in converting video data into actionable insights. By processing video on-premises at the edge, the solution reduces delays, costs and privacy risks associated with cloud-based analysis whilst helping meet data-privacy requirements in Europe, Japan and Korea. Wobot.ai's analytics, deployed across quick-service restaurants, retail, hospitality and manufacturing sectors, will run on SiMa.ai's Physical AI platform. The platform combines SiMa.ai's Modalix MLSoC hardware with Palette Neat, described as the industry's first agentic AI software environment for Physical AI. The solution will be demonstrated at VISION 2026 in Stuttgart, Germany, 6-8 October.

Edge AI and Vision Alliance

Sep 30th, 2026

Upcoming SiMa.ai Palette Neat Hands-on Workshops on physical AI.

Upcoming SiMa.ai Palette Neat Hands-on Workshops on physical AI. On October 13, 21 and 28, 2026, SiMa.ai will present in-person "Palette Neat Hands-on Workshops" in Burlington, Massachusetts; Austin, Texas; and Bloomington, Minnesota, respectively. Each half-day workshop runs from 9:00 am to 1:00 pm and focuses on developing real-time physical AI applications using Palette Neat and the Modalix system-on-module (SoM). Based on the event registration pages, participants will work with SiMa.ai engineers in guided labs to learn how to build, migrate and deploy applications, while exploring ways to accelerate development for their own use cases. Attendees will also receive a 15% discount on the Modalix DevKit. Workshop Dates and Locations * October 13, 2026 - Burlington, Massachusetts: 9:00 am-1:00 pm. Details and registration. * October 21, 2026 - Austin, Texas: 9:00 am-1:00 pm. Details and registration. * October 28, 2026 - Bloomington, Minnesota: 9:00 am-1:00 pm. Details and registration. Seating is limited. To register, please visit the event page for your preferred location. Here you'll find a wealth of practical technical insights and expert advice to help you bring AI and visual intelligence into your products without flying blind. Pages. Topics. Contact. Address. Berkeley Design Technology, Inc. PO Box #4446 Walnut Creek, CA 94596 Phone. Phone: +1 (925) 954-1411

Aura-V

Sep 30th, 2026

SiMa.ai secures $150 million Series C, valued at $1.45 billion.

SiMa.ai secures $150 million Series C, valued at $1.45 billion. GTM & Outbound Investigative Reporter - 2026-09-30 - 1 min SiMa.ai announced a $150 million Series C round led by Fidelity Management & Research Company and Amplify, valuing the San Jose startup at $1.45 billion ventureburn.com. The oversubscribed round also attracted J.P. Morgan, AllianceBernstein, Baron Capital and the State of Michigan, bringing total capital raised to $500 million. The cash will be poured into aggressive research and development, with the company targeting a 1,000 dense TOPS AI chip by 2028. SiMa.ai's proprietary Palette Neat software and purpose-built silicon aim to replace power-hungry GPUs in autonomous cars, drones and robots, cutting deployment times from months to days. By securing partnerships with Bosch, Synopsys and Micron, SiMa.ai is moving beyond prototype to commercial scale, challenging NVIDIA's dominance in cloud training by offering low-power, on-device inference. Analysts project 145 million physical AI devices shipped by 2035, a market SiMa.ai hopes to capture with its edge-optimized chips. Topics: #MarTech #News Aura-V Engineering Advisory Interested in implementing this technology inside your company? Its studio designs custom agent meshes, data pipelines, and outbound GTM systems for forward-looking enterprises.

Hoodline

Sep 29th, 2026

San Jose chipmaker SiMa.ai hits $1.45 billion valuation on $150M round.

San Jose chipmaker SiMa.ai hits $1.45 billion valuation on $150M round. Published on September 29, 2026 333 W. San Carlos St. - SiMa.ai Company Location Google Street View A San Jose semiconductor company that builds chips letting robots and drones think for themselves just landed a $150 million cash infusion, and with it, a valuation of $1.45 billion. SiMa.ai, which makes hardware and software for what it calls Physical AI, announced the Series C financing, bringing its total capital raised to $500 million. The company plans to pour the money into scaling its software platform and developing a new generation of chips aimed at humanoid robots, drones and cars. The round was co-led by Fidelity Management & Research Company and Amplify, according to a press release from SiMa.ai. Four new institutional investors joined the round: AllianceBernstein, Baron Capital, J.P. Morgan and the State of Michigan. As citybiz reported, the fresh capital is meant to support both product development and commercial expansion for the eight-year-old company. SiMa.ai was founded in 2018 by Krishna Rangasayee, who previously served as chief operating officer at chipmaker Groq, per TechCrunch. The company builds what it describes as a full-stack computing platform, pairing purpose-built silicon with software that lets AI workloads run directly on physical devices rather than relying on a distant data center. TechCrunch describes the pitch simply: chips and software that let robots, drones, cameras and other devices run AI directly on the device itself. A bet on the $50 trillion physical world. Rangasayee has framed the opportunity in sweeping terms, saying that Physical AI in humanoids, automotive and drones is the gateway to a $50 trillion market that has remained largely untouched by modern innovation. SiMa.ai is concentrating its $500 million in funding on computing infrastructure meant to serve exactly that kind of physical-world machine. The company's platform is designed around the power, latency and deployment constraints unique to edge environments, where devices can't always lean on cloud servers for split-second decisions. That framing puts SiMa.ai squarely in competition with entrenched players. According to SiliconANGLE, SiMa.ai is positioning itself as a lower-power alternative to Nvidia's CUDA-based hardware and software stack. Nvidia's high-end Jetson AGX Thor modules already hit 2,000 FP4 TOPS of compute, with the smaller Jetson T2000 and T3000 modules delivering roughly 400 and 865 TOPS respectively, the outlet reports, giving a sense of the benchmark SiMa.ai is chasing. Next-Generation chips targeted for 2028. SiMa.ai plans to develop a new generation of Physical AI hardware targeting 1,000 dense TOPS of computing performance, with that hardware portfolio slated to arrive in the first half of 2028. The planned lineup will include machine-learning intellectual property, chiplets and systems-on-chip, according to DatacenterDynamics. Customers already working with SiMa.ai's current products are expected to be able to migrate their applications onto that future hardware architecture without starting over. The expansion push extends the company's reach into medium- and high-end drones, humanoid robotics, automotive advanced driver assistance systems and AI-powered vehicle cockpits, alongside existing work in industrial automation, aerospace and defense, smart vision and healthcare applications. SiMa.ai's customer and partner network already spans companies including Bosch, Micron, Emerson, Synopsys, Kontron, TRUMPF, Intrinsic, AVerMedia, STIGA, L&T Technology Services, Ark Electronics and Virya Autonomous Technologies. Palette Neat aims to speed up development. Much of the new funding is earmarked for scaling Palette Neat, the agentic software environment SiMa.ai launched in June that's built for moving AI applications onto physical systems. The company describes Palette Neat as shortening that process from months down to days or even hours. SiMa.ai says it plans to expand the software environment further as part of its broader roadmap. The company points to strong financial momentum behind the raise. SiMa.ai has said its revenue growth quadrupled year over year between 2024 and 2025, and that it has continued to see upward revenue momentum through 2026. Scott Darling, president and managing director of Dell Technologies Capital, said SiMa.ai's platform delivers the software agility and Physical AI-optimized compute needed to scale computer vision and autonomous capabilities. Alongside Fidelity and Amplify, the Series C also drew participation from Alter Venture Partners, Dell Technologies Capital, Maverick Capital, +ND Capital, Point72 and StepStone Group. SiMa.ai points to broader industry research from Counterpoint Research projecting cumulative global shipments of Physical AI devices to reach 145 million units by 2035, a figure the company cites as evidence of the market it's chasing. Part of a broader chip-funding wave. SiMa.ai isn't alone in drawing big money for physical-world AI chips. Just two weeks earlier, Dutch AI chip startup Euclyd raised a $230 million round co-led by Samsung, Somerset Capital Partners, the Scaleup Europe Fund and Innovation Industries, according to CNBC. Euclyd is aiming to roll out its own physical chip systems in 2028 and serve thousands of enterprise customers by 2030, targeting revenue both from selling hardware and rack systems and from licensing its intellectual property, per the same report. SiMa.ai's own funding history includes some conflicting detail about its prior raise. TechCrunch reports the company was previously valued at $960 million after an $85 million Series B in July 2025, while SiMa.ai's own August 2025 announcement described that $85 million round as bringing its total capital raised to $355 million at the time. Either way, the company's valuation has climbed sharply since then, positioning SiMa.ai as one of the more closely watched names in the crowded race to put artificial intelligence directly inside the machines that move through the physical world.

SiMa.ai

Principal Engineer, System Hardware Design - Signal Integrity/Power Integrity

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