AttoTude

Photonic interconnects powering AI data centers

Advanced Packaging Design Engineer

Mechanical EngineeringConfirmed live in the last 24 hours

Full-timeOttawa, ON, CanadaNo salary listedIn-person

About the Job

Requirements

Experience in advanced silicon packaging, multichip module and high-speed interposer designs as well as solid understanding of assembly process.
Mechanical, thermal and Finite Element Analysis modeling and design experience.
Proven track-record of product development, from concept through volume production.
Ability to work effectively in cross-disciplinary teams and drive technical collaborations.
Excellent analytical and problem-solving skills.
Master’s degree or higher in Mechanical Engineering, Materials Science, or related field.

Responsibilities

Designing advanced packaging solutions.
Conducting research and development initiatives.
Collaborating with cross-functional teams and suppliers.
Managing deliverables to ensure timely delivery.
Architecture of advanced packaging solutions.
Detailed design of advanced packaging solutions.
Validation of packaging solutions.
New product introduction for packaging.

Role Description

This is a full-time, on-site role located in Ottawa, ON, for an Advanced Packaging Engineer. The responsibilities include designing advanced packaging solutions, conducting research and development initiatives, collaborating with cross-functional teams and suppliers, and managing deliverables to ensure timely delivery. The role requires hands-on problem-solving and the ability to innovate in a rapidly evolving technical environment. Responsibilities range from architecture, detailed design, validation and new product introduction.

Qualifications

Experience in advanced silicon packaging, multichip module and high-speed interposer designs as well as solid understanding of assembly process.

Mechanical, thermal and FEA modeling and design experience.
Proven track-record of product development, from concept through volume production.
Ability to work effectively in cross-disciplinary teams and drive technical collaborations.
Excellent analytical and problem-solving skills.
Master’s degree or higher in Mechanical Engineering, Materials Science, or related field.

About the Company

AttoTude

Photonic interconnects powering AI data centers

AttoTude designs and sells advanced interconnect technology for data centers, focusing on AI workloads. Its main products are photonic interconnect solutions built on photonic integrated circuits and optical communications that move data at very high speeds with low bottlenecks. These interconnects connect servers, switches, and storage to enable high-speed parallel processing and supercomputing, reducing latency and increasing bandwidth in large-scale deployments. The company differentiates itself by concentrating on photonics-based networking to address AI-specific data center bottlenecks, serving large operators and enterprises through direct sales and licensing. Its goal is to help data centers scale AI capabilities efficiently by providing reliable, high-performance interconnects that support demanding workloads and future growth.

Company size: 51-200
Company stage: Series C
Total funding: $131M
Headquarters: Menlo Park, CA
Founded: 2024

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