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Micron Technology

Makes memory and storage chips for AI and PCs

Engineer Intern - Hig Hbm Dtpco

Hardware Validation & TestingConfirmed live in the last 24 hours
Full-timeRichardson, TX, USANo salary listedIn-person

About the Job

Requirements

  • A Bachelor's degree in Electrical Engineering, Computer Engineering, Materials Science, Physics, or a related technical field is required.
  • At least 3 years of experience in semiconductor characterization, failure analysis, product engineering, test engineering, or a related field is required.
  • Hands-on experience with laboratory equipment such as oscilloscopes, SMUs, power supplies, thermal systems, probe stations, or automated test hardware is required.
  • Programming experience in Python and at least one additional language such as C/C++ or Verilog is required.
  • Experience analyzing complex datasets and driving root-cause investigations using statistical and engineering methods is required.

Responsibilities

  • Design, build, debug, and complete custom bench-level test setups, fixtures, and measurement flows using laboratory equipment including power supplies, SMUs, oscilloscopes, thermal systems, handlers, sockets, and probe cards.
  • Perform thermal, mechanical, and electrical characterization of HBM cubes under hot/cold, transient, and forced-temperature conditions, including power-temperature correlation, warpage analysis, stress characterization, timing margin evaluation, and failure-onset analysis.
  • Develop and maintain Python-, Verilog-, and C/C++-based test programs, stress patterns, workloads, and observability features to accelerate root-cause investigations and improve characterization efficiency.
  • Analyze MBIST signatures and multifaceted electrical, thermal, and mechanical datasets to identify root causes related to design, process, package, assembly, or test interactions, and recommend corrective actions.
  • Leverage AI, Agentic AI, and Generative AI tools to improve engineering workflows, data analysis, test development efficiency, and problem-solving effectiveness.

Desired Qualifications

  • A Master's or PhD degree in Electrical Engineering, Computer Engineering, Materials Science, Physics, or a related field is preferred.
  • Experience with DRAM, HBM, memory subsystems, advanced semiconductor packaging, or silicon characterization is preferred.
  • Knowledge of thermal and mechanical stress, reliability, yield improvement, DOE methodologies, and power-performance correlation techniques is preferred.
  • Experience working with MBIST analysis, parametric characterization, failure signatures, and semiconductor test methodologies is preferred.
  • Proficiency using AI-enabled tools, Agentic AI, Generative AI, or AI-assisted coding platforms such as Claude Code or Code Assist to improve engineering productivity, data analysis, and workflow automation is preferred.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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