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GlobalFoundries

Semiconductor foundry delivering specialized chips

Principal Lead Field Applications Engineer - Multiple Teams

Full-TimeUpdated
$145k - $236k
Expert
Bachelor's, Master's
Santa Clara, CA, USA
In Person
Solution EngineeringPre-Sales Solution Engineering
Company Does Not Provide H1B Sponsorship

About the job

Requirements
  • A bachelor's or master's degree in an engineering discipline or similar is required.
  • At least 10 years of experience in Field Application Engineering, Applications Engineering, or Design Engineering is required.
  • Experience in semiconductor IP, SoC/ASIC development, embedded systems, or related industrial, automotive, or IDM electronics markets is required.
  • A proven track record supporting customer engagements and design wins is required.
  • Strong understanding of industrial, automotive, or IDM electronic architectures, including MCUs, SoCs, and domain/zonal controllers, is required.
  • Familiarity with processor architectures, embedded software development including compilers, SDKs, and operating systems, and system-level design and integration is required.
  • Strong customer-facing communication and problem-solving skills are required.
  • Ability to operate independently in a field-based role is required.
  • A hands-on technical mindset with strong debugging capability is required.
  • Ability to bridge technical depth with customer business needs is required.
  • Fluency in English is required.
Responsibilities
  • Act as the primary technical interface for customers during pre-sales and early development phases.
  • Conduct customer presentations, architectural reviews, and product demonstrations.
  • Support customer engineering teams in evaluating and adopting MIPS solutions.
  • Provide technical guidance on processor IP integration, software toolchains and development environments, and system architecture considerations.
  • Drive design-in activities at assigned customers and design houses.
  • Support technical discussions to secure design wins for CPU IP licensing, custom silicon programs, and software solutions.
  • Assist customers in transitioning from evaluation to implementation.
  • Help customers understand and implement MIPS value proposition, including open RISC-V architecture flexibility, multi-threaded high-performance compute, high-performance scalable neural processors, and functional safety-ready solutions.
  • Support system-level optimization for performance, power, and cost.
  • Partner with Business Development to support opportunity creation and closure.
  • Provide technical input to proposals, RFIs, and customer presentations.
  • Translate customer requirements into actionable feedback for product and engineering teams.
  • Support engagement with ecosystem partners in software, EDA, and design services.
  • Participate in customer workshops, demos, and industry events.
  • Help position MIPS solutions within the broader semiconductor ecosystem in North America.
  • Perform all activities in a safe and responsible manner and support Environmental, Health, Safety & Security requirements and programs.
Desired Qualifications
  • Experience with the RISC-V ecosystem or CPU IP integration.
  • Prior experience supporting industrial, automotive, or IDM customers in North America.
  • Experience with SoC development and custom silicon implementation flows.
  • Understanding of functional safety standards or design requirements in industrial and automotive markets.

About the company

GlobalFoundries is a semiconductor foundry that manufactures chips for a broad range of customers, focusing on feature-rich, reliable technologies for cars, IoT, 5G, and other high-growth markets. It operates by fabricating silicon wafers for customer designs, offering mature, specialized processes rather than chasing the most advanced nodes. This makes it different from peers that prize the latest process nodes; GlobalFoundries emphasizes diversification across a global manufacturing footprint (U.S., Europe, Singapore) and stable supply for essential applications. Its goal is to be a leading supplier of high-volume, specialty manufacturing that enables reliable chips for everyday devices and growing tech markets.

Company Size

10,001+

Company Stage

IPO

Headquarters

Town of Malta, New York

Founded

2009

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Simplify's Take

What believers are saying

  • Marvell expanded SiGe capacity on September 17, 2026, signaling demand through 2027.
  • Commerce finalized a $375 million R&D award on September 8, 2026, plus a July $300 million framework.
  • SMART Photonics partnered with GF on September 21, 2026, widening its photonics platform and customer funnel.

What critics are saying

  • Smart mobile is 36% of revenue, and management expects low-teens decline in 2026.
  • Tower Semiconductor litigation in Texas and the ITC risks injunctions, distraction, and patent retaliation.
  • If AI photonics demand normalizes before 2027, GF's growth story reverts to commoditized mature-node fabs.

What makes GlobalFoundries unique

  • GlobalFoundries abandoned bleeding-edge nodes in 2018, specializing in feature-rich chips for autos and connectivity.
  • Its Malta, Burlington, Dresden, and Singapore footprint sells trusted regional supply to governments and enterprises.
  • GF owns uncommon SiGe, silicon photonics, and FDX process depth for optical and edge chips.

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Benefits

  • Professional Development Budget

Growth & Insights and Company News

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Yahoo Finance
Oct 15th, 2026
US doubles GlobalFoundries stake to about 8% in deal with up to $21B Japan-backed chip plants

The US government has doubled its equity stake in chipmaker GlobalFoundries to nearly 8%, President Donald Trump announced Wednesday. He said the stake is now "worth over 2 Billion Dollars" in a company with a market capitalisation of about $27.2 billion. The deal reallocates a $955 million award under the 2022 Chips and Science Act toward modernising the company's facilities. GlobalFoundries said the government is taking an additional stake of about 4%. A new vehicle co-owned by the US and Japanese governments will fund two fabrication plants, described as "up to $21 billion" in investment, with about $10 billion initially. GlobalFoundries will build and operate them, and expects about $3 billion in compensation over the next decade. The first plant is due online in 2029, the second in 2031.

Guggenheim Partners
Oct 14th, 2026
GlobalFoundries selected to operate two new semiconductor fabs in New York under landmark U.S.-Japan initiative | GlobalFoundries

GF has been selected as the technology provider and operator for two new fabs at its Malta, New York, site under a U.S.-Japan initiative.

Sohu
Oct 14th, 2026
GlobalFoundries to build two New York chip plants with up to $21B from Japan, US to take 4% stake

GlobalFoundries will build two new chip factories at its existing site in upstate New York, according to a deal announced on October 14. Japan's government will provide up to $21 billion in funding. The US government will buy about 4% of the company's shares. The two plants will be jointly held by the US and Japan. The new factories will make basic chips, reducing reliance on suppliers in East Asia.

Bloomberg
Oct 14th, 2026
GlobalFoundries to build two chip plants with up to $21B in Japanese backing

GlobalFoundries Inc. plans to build two new chip plants with backing of as much as $21 billion from the Japanese government. The arrangement is part of a US-Japan deal that also includes the US taking a 4% stake in the company.

Yahoo Finance
Oct 8th, 2026
TSMC signs $2B deal with GlobalFoundries for AI chip silicon interposers at New York plant

GlobalFoundries shares rose nearly 6% Thursday after announcing a $2 billion manufacturing deal with Taiwan Semiconductor Manufacturing Company to produce silicon interposers at its New York facility. The five-year agreement will support expanded manufacturing capacity, with volume production expected to begin in the first half of 2028. The facility is set to become the first US-based source of silicon interposers for advanced packaging technologies. These components are crucial for TSMC's Chip-on-Wafer-on-Substrate technology, which connects AI processors with high-bandwidth memory. The deal addresses constraints in TSMC's CoWoS packaging capacity, which has become a bottleneck for AI chip production. Counterpoint Research estimates the supply-demand gap could remain around 20% in 2026 before narrowing to roughly 10% in 2027.