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Black Semiconductor

Graphene photonics enable optical chip interconnects

Senior Group Accounting Manager

Financial AccountingConfirmed live in the last 24 hours
Full-timeAachen, Germany

About the Job

Requirements

  • Several years of experience in group accounting, consolidated financial statements, consolidation, or international reporting.
  • Strong knowledge of International Financial Reporting Standards (IFRS) and experience with international accounting structures.
  • Experience with international company structures and their accounting requirements.
  • Demonstrated experience developing and improving group-wide accounting, reporting, or consolidation processes.
  • Experience actively advancing finance transformations, change projects, or comparable build-up projects.
  • A hands-on approach, sense of responsibility, and willingness to build structures independently.
  • Very good German and English language skills.

Responsibilities

  • Further develop the company's group accounting and IFRS structures in the course of its international expansion.
  • Own central topics related to consolidation, group reporting, and the development of group-wide reporting structures.
  • Support the establishment and integration of international subsidiaries and develop the accounting structures they require.
  • Work closely with Finance Leadership, the CFO, executive management, and relevant stakeholders, contributing expertise where subject-matter depth and hands-on implementation are needed.

About the Company

Black Semiconductor

Graphene photonics enable optical chip interconnects

Black Semiconductor develops graphene-based photonics that integrate optical components into the outer layers of CMOS-like chips, enabling direct optical chip-to-chip communication. It works by using graphene as a translator to convert electronic signals to optical signals and back, so electrons on silicon can talk to photons through integrated photonic interconnects. This approach differs from traditional silicon photonics or pure electronic interconnects by being CMOS-compatible, wafer-scale, and capable of linking multiple chips as a single high-performance unit while reducing production steps by about 60%. The company aims to move from pilot production to mass manufacturing, building a 300mm wafer facility (FabONE) in Aachen, with pilot production by 2027 and mass production by 2031, backed by a large European funding round and investors.

Company size
51-200
Company stage
Series A
Total funding
$287.4M
Headquarters
Aachen, Germany
Founded
2020

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