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Micron Technology

Makes memory and storage chips for AI and PCs

Engineer – Product Development Engineering Key Equipment Group

Manufacturing EngineeringConfirmed live in the last 24 hours
Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

  • A PhD, master's, or bachelor's degree in electrical and electronic engineering, materials, mechanical engineering, physics, or applied physics, or equivalent work experience.
  • Basic knowledge of semiconductor manufacturing assembly, wafer bumping packaging technologies, and advanced packaging techniques.
  • Zero to two years of experience in the related semiconductor industry or a related manufacturing environment.
  • Strong communication and presentation skills in spoken and written English.
  • Understanding of business needs and customer requirements, with the ability to participate in a cross-functional team environment.
  • Strong project management skills to ensure execution to timelines.
  • Ability to perform hardware and software engineering assignments as required.
  • Ability to integrate AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness.
  • Ability to apply baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly and effectively for research, analysis, content creation, problem-solving, operational tasks, and achieving business outcomes.
  • Availability for seasonal travel based on business need.

Responsibilities

  • Identify, select, and evaluate new highly automated and computerized equipment and technology to support current and future advanced packaging technology requirements.
  • Support evaluation and qualification of new equipment platforms.
  • Define, develop, and establish new equipment design and capability requirements aligned with the Process and Packaging Roadmap.
  • Develop creative solutions for new equipment capabilities and constraints or future technology requirements.
  • Work with equipment suppliers to develop new capabilities.
  • Participate in Package Development Engineering activities.
  • Conduct equipment benchmarking to establish suppliers and platforms for future needs, and assist senior engineers with benchmarking and selection activities.
  • Plan and submit capital requests to acquire new equipment.
  • Create and own purchasing specification documents.
  • Establish equipment qualification criteria and activity roadmaps with functional teams.
  • Establish project handover requirements and procedures after machine qualification, and prepare handover documentation with site owners.
  • Gather data for low-volume production and train site representatives.
  • Collaborate with production and High-Volume Manufacturing teams on existing production equipment enhancements through continuous improvement projects, including feedback after mass-volume production.
  • Drive the Equipment Maturity Index system to standardize equipment maturity expectations, communicate tool manufacturing readiness metrics, and analyze requirements to advance tool maturity levels.
  • Maintain and regularly update the Tool of Records with input from local and other assembly sites.
  • Maintain general knowledge of process and material characteristics and translate them into equipment design requirements.
  • Continuously search for equipment or suppliers with improved or new capabilities aligned with process and packaging needs.
  • Conduct equipment characterization and identify and enable critical equipment parameter monitoring systems.
  • Work with Process Control System, IT, and Automation teams to enable tool control systems, including fault detection and classification, enterprise equipment engineering, advanced process control, tool alarm systems, Internet of Things, equipment constant management, and run-to-run systems, as applicable.
  • Enable equipment automation solutions for tool-micron host communication and factory Automated Material Handling System readiness and deployment, working with IT and Automation teams to deliver production automation support.
  • Participate in supplier engagement forums, including executive review meetings, technical review meetings, quarterly business reviews, and continuous improvement reviews, to align suppliers with business priorities.
  • Work with senior engineers and suppliers to support equipment improvement initiatives.
  • Collaborate with suppliers on technology direction, engineering improvement, manufacturing efficiency, roadmap and solution development, and partnership strategies.
  • Integrate AI-assisted tools and insights into daily work and identify, test, and share AI-enabled improvements within the role's scope.

Desired Qualifications

  • Experience with technical knowledge of assembly, wafer bumping, or advanced packaging technology.
  • Understanding of or experience with equipment automation solutions.
  • Internship or experience in the semiconductor industry.
  • Demonstrated leadership and a track record of impact.
  • Interest in and knowledge of the semiconductor industry and Micron.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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