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Soitec

Engineered substrates for silicon-on-insulator wafers

Technicien.ne Process Intégration POI

Process EngineeringUpdated on Nov 10
Full-timeBernin, FranceNo salary listedIn-person

About the Job

Requirements

  • Possess a Bac+2-level qualification, such as a BUT or DUT, in physical measurements, chemistry, materials, biology, or laboratory studies.
  • Experience in the microelectronics sector is desirable but not required.
  • Communicate with varied stakeholders and work on diverse technical topics.
  • Demonstrate commitment, autonomy, analytical ability, rigor, interest in technical work, and adaptability.

Responsibilities

  • Contribute to bringing new POI products to the required performance, quality, and cost levels within market timelines and manufacturing requirements.
  • Track POI products throughout the manufacturing process and characterize them to support industrialization, with guidance from experienced engineers and technicians.
  • Master production IT management systems and collaborate with production, process, yield, and supply-chain interfaces.
  • Analyze and understand product issues, capture learnings, and help achieve product quality and cost targets.
  • Ship products to customers on time.
  • With experience, test personal designs for new prototypes.

Desired Qualifications

  • Experience in the microelectronics sector is a plus but is not essential.

About the Company

Soitec

Engineered substrates for silicon-on-insulator wafers

Soitec designs and manufactures high-performance semiconductor materials, specializing in engineered substrates used to make chips for smartphones, data centers, and automotive applications. Its main products are silicon-on-insulator (SOI) wafers, which enable better performance and lower power consumption compared with traditional silicon wafers. Soitec’s Smart Cut technology bonds and transfers ultra-thin silicon layers onto insulating substrates to produce high-quality wafers with high yield. The company differentiates itself through its leadership in engineered substrates and its proprietary manufacturing process, supplying wafers to leading chipmakers under long-term agreements. Soitec’s goal is to provide advanced substrates that help customers build more powerful and energy-efficient electronic devices across industries.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Bernin, France
Founded
1992

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