ASM International

Semiconductor deposition equipment and ALD tech

Field Service Engineer 1 & 2

Equipment Field ServiceConfirmed live in the last 24 hours

Full-timeHillsboro, OR, USANo salary listed

About the Job

Requirements

Engineer I requires a bachelor's degree in Electromechanical Engineering or a related field.
Engineer I requires 1–3 years of technical experience in field service or manufacturing of original equipment manufacturer (OEM) capital equipment.
Engineer I requires the ability to read and interpret electronic and electromechanical schematics.
Engineer I requires basic knowledge of safety protocols and cleanroom guidelines.
Engineer I requires the ability to apply rules and procedures in their own activities.
Engineer I requires the ability to understand tool architecture and control algorithms and explain operating principles to peers.
Engineer I requires clear written and verbal communication skills and the ability to work independently and in a team.
Engineer I requires willingness to travel domestically and internationally as required.
Engineer I requires proficiency with Microsoft Office.
Engineer II requires a bachelor's degree in Electrical, Mechanical, or Electromechanical Engineering and 4 or more years of experience, or a master's degree with no years of experience.
Engineer II requires experience in field service or semiconductor capital equipment.
Engineer II requires the ability to interpret electronic and electromechanical schematics.
Engineer II requires experience with structured troubleshooting methodologies.
Engineer II requires knowledge of cleanroom and semiconductor safety protocols.
Engineer II requires strong written and verbal communication skills and the ability to work independently and within a team.
Engineer II requires willingness to travel domestically and internationally.
Engineer II requires proficiency with Microsoft Office.

Responsibilities

Engineer I installs, maintains, and repairs ASM semiconductor equipment at customer sites.
Engineer I troubleshoots tool and process issues using diagnostic tools, schematics, and structured methods.
Engineer I delivers timely, customer-focused support with a safety-first mindset.
Engineer I documents work performed and supports updates to service procedures.
Engineer I supports process improvements and contributes ideas to enhance tool performance.
Engineer I assists with customer escalations.
Engineer II installs, maintains, and repairs ASM semiconductor equipment with limited supervision.
Engineer II leads troubleshooting of complex tool and process issues using structured diagnostic methods.
Engineer II performs in-depth root-cause analysis and recommends data-driven corrective actions.
Engineer II analyzes tool performance data to anticipate issues and propose targeted improvements.
Engineer II provides training and on-the-job guidance to newcomers on routine service tasks.
Engineer II identifies operational risks and recommends minor process or procedure enhancements.
Engineer II documents service activities and contributes updates to procedures and best practices.
Engineer II provides detailed field feedback to engineering and design teams and supports beta testing.
Engineer II manages day-to-day customer engagements with a proactive, customer-first approach.
Engineer II supports escalations and collaborates with cross-functional experts to drive resolution.

Desired Qualifications

Engineer I: Semiconductor field service or capital equipment experience.
Engineer I: Knowledge of wafer fab operations, robotics, vacuum systems, plasma, or gas handling.
Engineer I: Experience writing procedures or process documentation.
Engineer I: Familiarity with structured problem-solving methods.
Engineer I: Experience supporting escalations or beta-site activities.
Engineer II: Hands-on semiconductor field service experience.
Engineer II: Working knowledge of wafer fab operations, robotics, vacuum systems, plasma, radio frequency, or gas handling.
Engineer II: Experience leading structured root-cause analysis.
Engineer II: Experience providing field data to engineering or design teams.
Engineer II: Background supporting beta-stage or early-option tools.
Engineer II: Familiarity with structured problem-solving techniques.

Step into a career with ASM, where cutting edge technology meets collaborative culture.

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.

** This position is not eligible for visa sponsorship for external candidates. Candidates cannot require sponsorship now or in the future**

Our Global Services and Spares teams are seeking Engineers I & II, Field Service (level will depend on experience, degree and responsibilities. Please review below) to join ASM at a customer site in Hillsboro, OR. Domestic and International travel of at least 75% will be required for this role.

Shifts:

Shift 4 (7pm-8am)- Sun-Tu and every other Saturday
Shift 6 (7pm-8am)- Wed- Fri and every other Saturday

Job’s mission

As a Engineer I, Field Service, you will help support ASM’s advanced semiconductor equipment at customer sites, ensuring that tools operate safely and at peak performance. Your work keeps fabs running and directly contributes to the technologies powering AI, 5G, and cloud computing. This role gives you hands-on experience, structured training, and the chance to grow alongside experts in the field.

As a Engineer II, Field Service, you will take the lead in supporting ASM’s advanced semiconductor equipment at customer sites, ensuring tools run safely and at peak performance in high‑tech fab environments. You will troubleshoot complex, multi‑factor issues, guide less‑experienced engineers, and provide insights that directly influence tool stability and next‑generation product improvements. This role gives you autonomy, technical depth, and the chance to make a meaningful impact on our customers and on the technology powering the world.

What you will be working on

Engineer I, Field Service

Install, maintain, and repair ASM semiconductor equipment at customer sites
Troubleshoot tool and process issues using diagnostic tools, schematics, and structured methods
Deliver clear, timely, customer‑focused support with a safety‑first mindset
Document work performed and support updates to service procedures
Support process improvements and contribute ideas to enhance tool performance
Assist with customer escalations.

Engineer II, Field Service

Install, maintain, and repair ASM semiconductor equipment with limited supervision
Lead troubleshooting of complex tool and process issues using structured diagnostic methods
Perform in‑depth root‑cause analysis and recommend data‑driven corrective actions
Analyze tool performance data to anticipate issues and propose targeted improvements
Provide training and on‑the‑job guidance to newcomers on routine service tasks
Identify operational risks and recommend minor process or procedure enhancements
Document service activities and contribute updates to procedures and best practices
Provide detailed field feedback to engineering and design teams and support beta testing
Manage day‑to‑day customer engagements with a proactive, customer‑first approach
Support escalations and collaborate with cross‑functional experts to drive resolution

What we are looking for

Engineer I, Field Service

Bachelor’s degree in Electromechanical Engineering or related field
1–3 years of technical experience in field service, or manufacturing of OEM capital equipment
Ability to read and interpret electronic and electromechanical schematics
Basic knowledge of safety protocols and cleanroom guidelines
Ability to apply rules and procedures in own activities
Ability to fully understand tool architecture and control algorithms and explain operating principals to peers
Clear written and verbal communication skills
Ability to work independently and in a team
Willing to travel as required for the role domestically and internationally
Knowledge of safety procedures and cleanroom guidelines
Proficiency with MS Office

Engineer II, Field Service

Bachelor’s degree in Electrical, Mechanical, Electromechanical Engineering or related field with 4+ years of experience, or a Master’s degree with 0 years of experience
Experience in field service or semiconductor capital equipment
Ability to interpret electronic and electromechanical schematics
Experience with structured troubleshooting methodologies
Knowledge of cleanroom and semiconductor safety protocols
Strong communication skills, both written and verbal
Ability to work independently and within a team
Willingness to travel domestically and internationally
Proficiency with MS Office

What sets you apart

Engineer I, Field Service

Semiconductor field service or capital equipment experience
Knowledge of wafer fab operations, robotics, vacuum systems, plasma, or gas handling
Experience writing procedures or process documentation
Strong customer‑service mindset and organizational skills
Familiarity with structured problem‑solving methods
Experience supporting escalations or beta‑site activities

Engineer II, Field Service

Hands‑on semiconductor field service experience
Working knowledge of wafer fab operations, robotics, vacuum systems, plasma, RF, or gas handling
Experience leading structured root‑cause analysis
Experience providing field data to engineering or design teams
Background supporting beta‑stage or early‑option tools
Familiarity with structured problem‑solving techniques
Strong customer‑service mindset and organizational skills

Apply today to be part of what’s next.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

About the Company

ASM International

Semiconductor deposition equipment and ALD tech

ASM International designs and supplies equipment and technologies for semiconductor fabrication, focusing on thin-film deposition processes such as chemical vapor deposition (CVD) and atomic layer deposition (ALD). Its products are used in making microchips by depositing ultra-thin material layers with precise control at the atomic level, enabling smaller and more powerful devices. The company built a global footprint through operations in the Netherlands, the US, Hong Kong, and Japan, and separated ASML Lithography (a joint venture with Philips) to focus on deposition while ASML develops photolithography systems. In recent years, ASM has sharpened its strategy around ALD, a process that creates uniformly thin layers one atomic layer at a time, allowing continued scaling of semiconductor devices. The goal is to be a core supplier of deposition technology and tools that enable chip manufacturers to produce smaller, faster, and more energy-efficient semiconductors.

Company size: 1,001-5,000
Company stage: IPO
Headquarters: Almere, Netherlands
Founded: 1968

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