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ASM International

Semiconductor deposition equipment and ALD tech

Director, Process Engineering – PEALD

Engineering LeadershipConfirmed live in the last 24 hours
Full-timeHwaseong-si, Gyeonggi-do, South KoreaNo salary listed

About the Job

Requirements

  • A Ph.D. degree in Physics, Physical Chemistry, Chemical Engineering, Materials Science, or a related field is required.
  • 10–15+ years of experience in the semiconductor or semiconductor capital equipment industry, including senior-level technical leadership roles.
  • A proven track record of developing and delivering new semiconductor process technologies to customers is required.
  • Strong working knowledge of semiconductor device physics and manufacturing processes is required.
  • Experience leading and motivating teams of 10 or more highly skilled engineers is required.
  • Demonstrated credibility working with semiconductor fab managers, senior engineers, and executive stakeholders is required.
  • Ability to operate effectively in a fast-paced, results-oriented, highly competitive environment is required.
  • Excellent English communication skills are required.
  • Willingness to travel approximately 10–20% is required.

Responsibilities

  • Lead and develop a team of process development engineers focused on PEALD technologies, fostering innovation and technical excellence.
  • Drive development of next-generation PEALD processes, materials, and applications aligned with customer requirements and market needs.
  • Define and influence new hardware requirements to support advanced PEALD process specifications.
  • Identify, develop, and qualify new chemistries and materials for future device architectures.
  • Collaborate with customers, Account Technology Directors, Global Product Management, and Business Development teams to align on technical roadmaps.
  • Partner with corporate R&D organizations to deliver new applications and materials supporting customer technology inflections.
  • Ensure generation of intellectual property and technical publications as outcomes of advanced process development work.
  • Contribute ideas to process development, equipment design, and continuous improvement initiatives.
  • Stay current with state-of-the-art semiconductor processing technologies and maintain technical communication with industry peers.
  • Define critical skill requirements and staffing needs to support business objectives and long-term growth.
  • Build, motivate, and retain a high-performing team to drive sustained and profitable growth for ASM’s PEALD business.
  • Communicate at a highly technical level with end customers to build trust in ASM’s ability to solve advanced device challenges.

Desired Qualifications

  • Deep expertise in PEALD or related thin-film deposition technologies.
  • A strong reputation for building high-performance, collaborative engineering cultures.
  • Experience influencing product direction through process innovation, materials engineering, and hardware collaboration.
  • Recognized thought leadership through patents, publications, or industry contributions.
  • Ability to balance technical innovation, customer satisfaction, and business priorities.
  • Executive presence and ability to influence and inspire across organizational and cultural boundaries.

About the Company

ASM International

Semiconductor deposition equipment and ALD tech

ASM International designs and supplies equipment and technologies for semiconductor fabrication, focusing on thin-film deposition processes such as chemical vapor deposition (CVD) and atomic layer deposition (ALD). Its products are used in making microchips by depositing ultra-thin material layers with precise control at the atomic level, enabling smaller and more powerful devices. The company built a global footprint through operations in the Netherlands, the US, Hong Kong, and Japan, and separated ASML Lithography (a joint venture with Philips) to focus on deposition while ASML develops photolithography systems. In recent years, ASM has sharpened its strategy around ALD, a process that creates uniformly thin layers one atomic layer at a time, allowing continued scaling of semiconductor devices. The goal is to be a core supplier of deposition technology and tools that enable chip manufacturers to produce smaller, faster, and more energy-efficient semiconductors.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Almere, Netherlands
Founded
1968

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