A degree or equivalent qualification in Electronic/Electrical Engineering, Test Engineering or a related discipline.
At least 3 years of experience in semiconductor test or electronics manufacturing, with practical troubleshooting and debugging skills.
A good understanding of wafer test, measurement techniques, test data analysis and yield, and the ability to distinguish product, test-system and equipment issues.
Some programming or scripting experience.
A good understanding of electronic test hardware and instrumentation.
Analytical, problem-solving, communication and documentation skills.
A proactive, practical approach, and the ability to work independently and take ownership of technical issues.
Responsibilities
Provide day-to-day technical support for wafer test systems, including setup, configuration and troubleshooting of testers, probers and associated instrumentation.
Investigate test failures and anomalous results, find root causes and support corrective actions.
Analyse test data and wafer-level yield to identify trends, anomalies and opportunities to improve yield and process.
Support the introduction, commissioning and correlation of new test systems, hardware and methods, working with Test Development and Product Engineering.
Develop or modify test methods, scripts and software tools for test analysis, automation and troubleshooting.
Support test hardware and interfaces, including fixtures, load boards, cables and tester/prober interfaces, and help improve test time and equipment utilisation.
Desired Qualifications
RF test and measurement experience.
Python, or experience with other programming languages, test automation tools or environments.
Knowledge of MicroLED, semiconductor backplane technology or optical device testing.
Exposure to optical interconnect, photonics or optoelectronic device characterisation.
Plessey are building next-generation MicroLED and optical interconnect technology. Join our Test Engineering team in Plymouth and give hands-on technical support for wafer test in an advanced manufacturing environment.
You will set up, troubleshoot and debug test systems, drive yield improvement, and help bring new test systems and products into production. You will work closely with the Test Development, Product and Process Engineering teams, keeping our test operations reliable and efficient.
Provide day-to-day technical support for wafer test systems, including setup, configuration and troubleshooting of testers, probers and associated instrumentation.
Investigate test failures and anomalous results, find root causes and support corrective actions.
Analyse test data and wafer-level yield to identify trends, anomalies and opportunities to improve yield and process.
Support the introduction, commissioning and correlation of new test systems, hardware and methods, working with Test Development and Product Engineering.
Develop or modify test methods, scripts and software tools for test analysis, automation and troubleshooting.
Support test hardware and interfaces, including fixtures, load boards, cables and tester/prober interfaces, and help improve test time and equipment utilisation.
A degree or equivalent qualification in Electronic/Electrical Engineering, Test Engineering or a related discipline.
3+ years' experience in semiconductor test or electronics manufacturing, with practical troubleshooting and debugging skills.
A good understanding of wafer test, measurement techniques, test data analysis and yield, and the ability to tell product, test-system and equipment issues apart.
Some programming or scripting experience.
A good understanding of electronic test hardware and instrumentation.
Strong analytical, problem-solving, communication and documentation skills.
A proactive, practical approach, and the ability to work independently and take ownership of technical issues.
Advantage
RF test and measurement experience.
Python, or experience with other programming languages, test automation tools or environments.
Knowledge of MicroLED, semiconductor backplane technology or optical device testing.
Exposure to optical interconnect, photonics or optoelectronic device characterisation.