M

Micron Technology

Makes memory and storage chips for AI and PCs

Metals/Films Process Development Engineer

Process EngineeringConfirmed live in the last 24 hours
Full-timeBoise, ID, USANo salary listedIn-person

About the Job

Requirements

  • The role requires a PhD in Materials Science, Physics, Chemistry, Chemical Engineering, Electrical Engineering, or a related field.
  • The candidate must have experience with thin film deposition techniques such as atomic layer deposition, chemical vapor deposition, or physical vapor deposition.
  • The candidate must have knowledge of surface analysis methods including X-ray photoelectron spectroscopy, atomic force microscopy, X-ray diffraction, Auger electron spectroscopy, electron backscatter diffraction, and secondary ion mass spectrometry.
  • The candidate must understand solid-state physics, materials, surfaces, and interfaces.
  • The candidate must be able to collaborate and communicate in cross-functional teams.

Responsibilities

  • Diagnose and resolve assembly process issues using failure analysis, failure mode and effects analysis, 8D, and statistical process control/fault detection and classification methodologies.
  • Execute process, equipment, and material evaluations and implement process-step improvements.
  • Lead yield-improvement and cost-reduction initiatives.
  • Qualify and scale new processes, tools, and materials for production.
  • Manage supplier quality, audits, and risk-mitigation activities.

Desired Qualifications

  • Understand chemical kinetics as applied to deposition processes.
  • Apply strong data-analysis and statistical skills to large datasets.
  • Design experiments and deliver clear technical reports.
  • Lead technical projects effectively.
  • Use artificial-intelligence-assisted analytics to enhance data interpretation, anomaly detection, and yield-improvement initiatives.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

Recently Posted Jobs

Explore more opportunities at Micron Technology

See more jobs