Senior PCB Layout Engineer

What you will do

• Technical Leadership
· Lead PCB layout architecture for complex multi-layer designs (10–20+ layers) including high-speed digital, RF, analog, and power circuitry
· Define and own stackups, impedance models, and via strategies (through, blind, buried, microvias, backdrilling)
· Serve as the DFM authority for layout decisions, balancing electrical performance, cost, yield, and reliability
Advanced PCB Design & Layout
· Perform and guide component placement optimizing signal integrity, power integrity , EMI/EMC, thermal, and mechanical performance
· Route high-speed serial interfaces, differential pairs, controlled-impedance nets, and sensitive RF/analog signals
· Design robust power distribution networks and grounding structures
· Apply advanced shielding and isolation techniques for EMI/EMC control
Fabrication & Assembly Interface
· Lead DFM/DFA reviews with PCB fabrication and assembly partners
· Resolve complex DFM issues related to:
o HDI structures and sequential lamination
o Via consolidation, backdrilling, and drill count reduction
o Stackup optimization for yield and cost
· Optimize designs for manufacturability, reliability, and volume production
Cross-Functional Collaboration
· Work closely with electrical, mechanical, test, and manufacturing engineers throughout the product lifecycle
· Support board bring-up, debug, ECOs, and production transitions
· Mentor and technically guide junior PCB layout engineers
Documentation & Process Ownership
· Create and review stackup drawings, fabrication notes, assembly notes, and manufacturing data packages (Gerber / ODB++)
· Establish, maintain, and enforce PCB layout standards and best practices
· Drive continuous improvement in layout quality, DFM compliance, and cost efficiency
 

What you bring to this role

• 10+ years of hands-on PCB layout experience delivering complex designs from concept to production
• Expert-level proficiency in PCB layout tools such as Altium Designer, Cadence Allegro
• Deep understanding of:
• Controlled-impedance routing and signal integrity fundamentals
• Power integrity, grounding, and EMI/EMC best practices
• PCB materials, stackups, and fabrication processes
• HDI PCB design, advanced via structures, and manufacturing constraints
• Experience with:
• High-speed interfaces (PCIe, Ethernet, DDR, JESD, SERDES)
• RF and mixed-signal PCB layouts
• Aerospace, data center, or high-reliability hardware designs

Bonus points for the following

• Bachelor’s degree in electrical engineering, Computer Engineering, or a related field (Master’s degree is a plus).
• Familiarity with advanced PCB fabrication technologies such as mSAP (Modified Semi-Additive Process) and SLP (Substrate-Like PCB), including fine-line routing, small via structures, and associated DFM constraints
• Working knowledge of Signal and power integrity simulation tools and DFM analysis workflows