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Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Principal Product Engineer

Hardware Validation & TestingConfirmed live in the last 24 hours
Full-timeBengaluru, Karnataka, IndiaNo salary listedIn-person

About the Job

Requirements

  • A bachelor's degree in electronic engineering or industrial engineering is required.
  • At least 15 years of relevant semiconductor experience spanning product engineering, new product introduction, manufacturing, and test is required.
  • Practical understanding of semiconductor wafer fabrication, assembly, test, qualification, and production-release flows is required.
  • Experience managing engineering wafer starts, prototype builds, customer samples, inventory, and product bills of materials is required.
  • Working knowledge of system-on-chip and mixed-signal device testing, common circuit building blocks, device behavior, and semiconductor test methodology is required.
  • Familiarity with automatic test equipment platforms such as Teradyne J750 or Advantest V93000, and laboratory equipment such as oscilloscopes, power supplies, and digital multimeters is required.
  • Familiarity with JEDEC/AEC qualification standards, qualification hardware and software, and semiconductor failure analysis is required.
  • Experience with product lifecycle management and yield-management tools such as Agile, PDF Exensio, or JMP is required.
  • Experience working with external foundries, outsourced semiconductor assembly and test providers, subcontractors, and globally distributed product teams is required.
  • Experience with failure analysis methods is required.
  • Experience using data and statistical methods to manage yield, quality, cycle time, and operational priorities is required.
  • Strong analytical, planning, coordination, and problem-solving skills, attention to detail, and the ability to work under schedule pressure are required.
  • Clear written and verbal communication skills and the ability to influence cross-functional teams without direct authority are required.

Responsibilities

  • Own the assigned product lifecycle from concept and first silicon through qualification, production release, sustaining, and end of life.
  • Drive first-silicon bring-up and debugging with Design, Test, and Applications teams.
  • Plan and coordinate voltage, temperature, and process characterization, including production limit setting and guard-banding.
  • Create and maintain product bills of materials and product lifecycle data in product lifecycle management systems such as Agile.
  • Work with planning, manufacturing, subcontractors, and operations teams to remove material-flow obstacles and recover schedule gaps.
  • Own qualification planning and execution in accordance with applicable JEDEC and AEC requirements.
  • Prepare product-release documentation, datasheet compliance evidence, and automotive compliance reports as applicable.
  • Monitor production data and use statistical analysis to identify and correct yield, quality, and test-time deficiencies, and drive yield improvement.
  • Optimize PAT, SYL, SBL, statistical process control, and disposition limits to protect outgoing quality.
  • Support fab transfer and bill-of-materials change activities.
  • Support customer-return and return merchandise authorization investigations by reproducing failures and assessing production test coverage.
  • Provide technical direction and sign-off reviews.
  • Lead technical decisions and risk resolution across Design, Product Engineering, Operations, suppliers, and outsourced semiconductor assembly and test teams, including design-for-X topics.
  • Influence cross-functional teams without direct authority and communicate clearly to stakeholders.

About the Company

Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Renesas manufactures and sells MCUs, SoCs, and analog/power semiconductor devices to OEMs, focusing on automotive, industrial, infrastructure, and IoT markets. Its chips are building blocks that run embedded software and manage power and signals, and its Winning Combinations offer pre-tested system architectures to speed up design. It differentiates itself by growing through acquisitions to offer a broad, integrated portfolio and by moving toward a unified digital design platform to reduce integration work. Its goal is to become a leading supplier of these components and provide a single platform for electronics design that speeds time-to-market.

Company size
10,001+
Company stage
IPO
Headquarters
Tokyo, Japan
Founded
2002

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