Mirafra Technology

Turnkey ASIC design and semiconductor engineering

LTE L3 Development

Systems Software EngineeringConfirmed live in the last 24 hours

Full-timeHyderabad, Telangana, IndiaNo salary listedIn-person

About the Job

Requirements

Ability to develop Linux telecommunications software in a multithreaded environment.
Ability to provide customer and customer-engineering support.
Ability to understand and implement high-level customer requirements and translate them into software designs and implementations.
Ability to troubleshoot software issues with system integration and test teams.
Ability to work independently and as part of a larger team.
Ability to follow development standards, processes, procedures, and configuration-management practices.

Responsibilities

Design, develop, unit-test, and integrate upper-layer Linux telecommunications software in a multithreaded environment.
Support the customer-engineering team and end customers.
Understand and implement high-level customer requirements and translate them into high-quality designs and implementations in a time-critical manner.
Work with system integration and test teams to explain implementations and troubleshoot issues.
Adhere to development standards, processes, procedures, and configuration management.

Job Description

- Design, develop, unit-test, and integrate upper-layer, Linux telecommunications software in a multi-threaded environment.
- Provide support to customer-engineering team and end customers. Understand and implement high-level customer requirements and translate those into high-quality design and implementation in a time-critical fashion.
- Work with SIT teams to explain implementation and troubleshoot issues. Be able to function both independently as well as function as part of a larger team
- Adhere to all development standards, processes, and procedures, including configuration management.

Qualifications

Additional Information

All your information will be kept confidential according to EEO guidelines.

About the Company

Mirafra Technology

Turnkey ASIC design and semiconductor engineering

Mirafra Technologies delivers end-to-end turnkey ASIC design and semiconductor engineering services to help global tech companies move from concept to silicon to system. It covers the full lifecycle: architecture, design, verification, physical implementation, package/board design, embedded software, post-silicon validation, test and product engineering, and system solutions. With 2,200+ engineers and delivery centers worldwide, Mirafra has completed 650+ tape-outs for over 50 semiconductor customers, from startups to established firms. Its edge comes from a one-stop engineering partner model that combines deep domain expertise with scalable AI, cloud, data engineering, and software capabilities to speed time-to-market and reduce engineering complexity.

Company size: 1,001-5,000
Company stage: Not listed
Total funding: Not listed
Headquarters: Bengaluru, India
Founded: 2004

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