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Black Semiconductor

Graphene photonics enable optical chip interconnects

Senior Hardware Compute Architect

Hardware Systems IntegrationConfirmed live in the last 24 hours
Full-timeAachen, GermanyIn-person

About the Job

Requirements

  • A Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field, or equivalent experience.
  • At least 5 years of experience designing compute hardware architecture at the system-on-chip or system level, ideally involving heterogeneous computing, accelerators, or specialized compute architectures.
  • Deep expertise in compute architecture, including scalar, vector, and tensor/matrix execution units, workload mapping, memory hierarchy, and system-level architecture trade-offs.
  • Strong experience architecting high-performance interconnects, data fabrics, and heterogeneous compute systems, including UCIe, CXL, UALink, NVLink-class, or comparable architectures.
  • Experience with architectural modeling and quantitative analysis of performance, power, area, and system scalability to guide hardware architecture decisions.
  • Ability to collaborate across hardware and software teams to define interfaces, requirements, and system-level design decisions.
  • Experience with architecture modeling and simulation tools, interconnect protocols, and system design workflows, including performance/power modeling environments, CXL, UALink, NVLink-class fabrics, UCIe, Python, C++, SystemC, and architecture specification tools used to develop implementable designs for RTL, physical design, and packaging teams.

Responsibilities

  • Define the hardware architecture of a hybrid compute engine, including scalar, vector, and tensor/matrix execution units, memory hierarchy, memory tiering strategies, and interfaces enabling cooperation between electronic and photonic compute domains.
  • Architect the system data fabric and interconnect infrastructure, including bandwidth, latency, coherency, and die-to-die communication requirements using UCIe-class links, CXL, UALink, and NVLink-class fabrics.
  • Partner with the Software Compute Architect to define hardware/software interfaces and workload mapping strategies, determining when operations should execute through electronic versus photonic compute paths.
  • Evaluate architectural options through quantitative modeling, analyzing performance, power, area, and scalability trade-offs to guide system-level decisions before silicon implementation.
  • Collaborate with photonics architecture, circuit design, RTL, physical design, and packaging teams to translate compute primitives into implementable system-level architectures.
  • Own the hardware architecture specification through sign-off, ensuring alignment between system requirements and downstream implementation teams.

Desired Qualifications

  • Familiarity with photonic or optical compute concepts and their integration with electronic compute architectures.
  • Experience with heterogeneous compute architectures involving GPUs, DPUs, FPGAs, custom accelerators, or AI accelerator platforms.
  • Experience contributing to industry interconnect standards such as CXL Consortium, UALink, or UCIe Consortium.

About the Company

Black Semiconductor

Graphene photonics enable optical chip interconnects

Black Semiconductor develops graphene-based photonics that integrate optical components into the outer layers of CMOS-like chips, enabling direct optical chip-to-chip communication. It works by using graphene as a translator to convert electronic signals to optical signals and back, so electrons on silicon can talk to photons through integrated photonic interconnects. This approach differs from traditional silicon photonics or pure electronic interconnects by being CMOS-compatible, wafer-scale, and capable of linking multiple chips as a single high-performance unit while reducing production steps by about 60%. The company aims to move from pilot production to mass manufacturing, building a 300mm wafer facility (FabONE) in Aachen, with pilot production by 2027 and mass production by 2031, backed by a large European funding round and investors.

Company size
51-200
Company stage
Growth Equity (Non-Venture Capital)
Total funding
$287.4M
Headquarters
Aachen, Germany
Founded
2020

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