I

Intel

Pioneers microprocessors, CPUs for PCs

Factory Construction Program Manager

Full-TimePosted on 7/4/2026
$166.4k - $234.9k/yr+ Stock bonuses
Expert
Bachelor's, MBA, PhD
New Albany, OH, USA
In PersonRelocation or travel may be required to support business growth.
Business & StrategyProgram Management
No H1B Sponsorship

About the job

Requirements
  • Bachelor's degree in Engineering, Architecture, Construction Management or a related field and 9+ years' experience as an engineer, construction manager, project manager, or equivalent leadership role in large-scale organizations and project management processes; 12+ years of demonstrated strategic leadership and program management in semiconductor factory construction or semiconductor operations may be considered in lieu of a degree.
  • Skills to manage and lead discussions with executive management, drill down to details, and manage an effort hands-on as needed.
  • Ability to manage and lead across diverse groups and stakeholders while optimizing solutions for Intel.
  • Knowledge of large-scale operations, programs, and project management.
  • Strategic leadership and communication skills.
  • Demonstrated ability to drive decision-making and change at the required cadence and partner and influence in a highly matrixed environment.
  • Problem-solving skills using a structured process, constraint management, and site operations.
  • Willingness and flexibility to travel or relocate to support business growth.
  • Ability to champion and value a safety culture of caring throughout the project lifecycle.
  • This position is not eligible for Intel immigration sponsorship.
Responsibilities
  • Create synergy with the enterprise ecosystem by engaging key customers and stakeholders to achieve shared program results.
  • Continuously shape the environment by anticipating and solving complex problems.
  • Shape an organization that enables trust, understanding, and empowerment while retaining effectiveness, agility, simplicity, and efficiency.
  • Develop and enable a bias for action with unity of effort and purpose.
  • Create clearly defined connections and flows that translate business and technical requirements into high-quality, constructible solutions.
  • Integrate enterprise capabilities to maximize effects on key program indicators.
  • Frame risk and share understanding to enable agility and momentum across programs.
  • Develop supplier partnerships with sourcing and procurement solutions and deliver continuous improvements in business results, quality, schedule, and cost.
  • Lead and manage construction projects, including new fab modules, fab conversions, and special building projects.
  • Drive new construction methods and engineering solutions by leveraging industry insights.
  • Build a lean, efficient, and collaborative organization.
  • Transform the culture and set the pace for safety, operational excellence, innovation, partnership, and customer service.
  • Build and drive a Culture of Care for safety across offices and construction sites and from front-end planning through construction execution.
Desired Qualifications
  • Master of Business Administration or PhD.
  • Expertise in program management.
  • Knowledge of the construction life cycle.
  • Knowledge of semiconductor facilities systems and operations.
  • Project Management Professional certification.

About the company

Intel designs and manufactures semiconductor chips, with a focus on microprocessors for personal computers, servers, and other devices. Its core product is the CPU on a single silicon chip, which executes instructions, handles arithmetic and logic operations, and coordinates the work of other computer components. Intel originated in memory chips but shifted decisively to microprocessors in the 1980s, becoming a central supplier for the PC era after the IBM partnership and its famous x86 processor line. This shift, large-scale manufacturing, and close ties with computer makers set Intel apart from competitors who remained focused on memory or other components. The company aims to power computing by delivering high-performance, energy-efficient silicon solutions that drive a wide range of computing devices and applications.

Company Size

10,001+

Company Stage

IPO

Headquarters

Santa Clara, California

Founded

1999

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Simplify's Take

What believers are saying

  • July 23, 2026 Q2 revenue hit $16.1 billion, up 25% year over year.
  • Intel raised 2026 capex above $20 billion after stronger customer demand signals.
  • September 29, 2026 OpenShell expanded Intel's enterprise AI toolkit with policy enforcement.

What critics are saying

  • Intel's 10% government stake faces shareholder litigation in Delaware and Supreme Court filings.
  • Intel Foundry still depends on a few customers; external revenue remains only 5%.
  • AMD's 2026 data-center momentum and TSMC process lead pressure Intel's turnaround and margins.

What makes Intel unique

  • Intel's x86 installed base still anchors PC and server software compatibility in 2026.
  • Intel's 2026 Open Edge Platform bundles industrial AI software around Intel silicon.
  • Intel 18A tooling supports integrated design, manufacturing, and foundry control unmatched by fabless rivals.

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Benefits

We Invest in Your Life and Career: Intel offers a complete and competitive package of benefits1 that demonstrates how much we care for employees and their families through every stage of life.

Great Minds Deserve Great Rewards: We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, and benefit programs.

Intel Fuels Career Acceleration: Curiosity drives us to change the world. We provide employees opportunities to expand their knowledge, leadership abilities, and skill set.

Vacation, Holidays, and More: We offer opportunities for employees to refresh and recharge—from paid vacation time and holidays to flexible time off programs.

Health Benefits for the Whole You: We provide multiple benefits and resources to help employees take care of themselves and their families.

Growth & Insights and Company News

Headcount

6 month growth

-1%

1 year growth

0%

2 year growth

-2%
Associated Press
Oct 15th, 2026
Intel brief details ZUUZ agentic AI CRM layer, optimised on Xeon 6 for up to 5.3x throughput

Intel has published a co-branded partner brief on ZUUZ, a Sunnyvale, California startup whose AI layer sits on top of a company's CRM. The brief, dated October 13, 2026, appears on intel.com. ZUUZ connects to sales inboxes, calendars, messaging and meeting platforms, and call transcripts. It finds missed leads and renewals, then updates the CRM once a rep approves. It works with Salesforce, HubSpot, Zoho, Attio, and Pipedrive. The brief says ZUUZ was optimised on Intel Xeon 6 processors with the OpenVINO toolkit. Intel reports up to 5.3x higher inference throughput versus the baseline model, based on July 2026 testing. It is not a customer result. ZUUZ offers a free 30-day self-service trial.

Yahoo Finance
Oct 15th, 2026
Intel vs Qualcomm: $44.3B revenue and $5.5B profit beat Intel's $52.9B sales and loss

A Motley Fool analysis compares Intel and Qualcomm as 2026 buys and leans towards Qualcomm, though the author would rather own the Vanguard S&P 500 ETF. Intel's fiscal 2025 revenue was nearly $52.9 billion, down about 0.5%, with a net loss of roughly $267 million. Free cash flow was negative at nearly $4.9 billion. The company is expanding its foundry business and has suspended its dividend. Qualcomm's revenue rose nearly 13.7% to about $44.3 billion, with net income of roughly $5.5 billion and free cash flow of nearly $12.8 billion. Its stock is cheaper and yields about 2%. Over 10 years, neither stock has matched the S&P 500.

Tech in Asia
Oct 15th, 2026
Applied Materials opens $5B AI chip research hub with TSMC, Intel, Samsung, Micron and SK hynix

Applied Materials has unveiled an AI chip research hub that brings together chipmakers, equipment suppliers, and university researchers to develop chipmaking technologies for AI. The centre spans 600,000 square feet and includes nearly four acres of cleanroom space for semiconductor process technology and equipment research. Founding partners are TSMC, Intel, Samsung, Micron, and SK hynix. Research partners include Arizona State University, Stanford University, the University of California, Berkeley, the UCLA Samueli School of Engineering, and Rensselaer Polytechnic Institute. Applied Materials expects capital spending to reach about $5 billion over time as customer projects begin.

Yahoo Finance
Oct 14th, 2026
Applied Materials vs Intel: why the $9.1B-quarter equipment maker beats the foundry turnaround

A Motley Fool comparison of chip equipment maker Applied Materials and chipmaker Intel favours Applied Materials as the better 2026 buy, though the author suggests buying shares gradually. Applied Materials' revenue rose 25% to $9.1 billion in the quarter ended July 26, 2026, and net income rose 43% to $2.5 billion. Risks include cyclical demand and China, which made up 28% of revenue. In February 2026 it agreed to pay $252.5 million to settle US export allegations. Intel's second-quarter revenue also rose 25%, to $16.1 billion. It posted an $11.0 billion net loss, driven by a $12.5 billion noncash charge tied to its US government deal. Its foundry unit lost $2.1 billion, and an August share sale raising about $23 billion diluted existing owners. On valuation, Applied trades at 42.2x forward earnings against Intel's 77.7x.

TweakTown
Oct 13th, 2026
Decenta lists first Intel Nova Lake-S LGA 1954 motherboard with B960 and Q970 variants.

Decenta lists first Intel Nova Lake-S LGA 1954 motherboard with B960 and Q970 variants. Decenta has published the first motherboard listing of an LGA 1954 motherboard featuring support for Intel's Q970 and B960 chipsets. Tech Reporter Published Oct 13, 2026 12:55 PM CDT 1 minute & 45 seconds read time Decenta's M26-NVLS-ATX09 is the first listed Nova Lake-S motherboard for Intel's LGA 1954 platform, with B960 and Q970 versions. The Q970 model offers more PCIe and M.2 connectivity, while LGA 1954 is expected to launch in Q1 2027 alongside Nova Lake-S Core Ultra 400 CPUs. Voice: Default 0:00 / 3:26 The first official listing of a Nova Lake-S motherboard has appeared from a Chinese manufacturer called Decenta. The new board, the M26-NVLS-ATX09, is geared towards the industrial space, featuring a standard ATX format that comes in two SKUs featuring either Intel's B960 or Q970 chipsets. The new board features four DDR5 slots with support for DIMMs operating at up to 6400MT/s, an 8+1+1 power delivery system, an M.2 slot for a Wi-Fi 7 card, three Intel NICs (i219, i210, and i226V), rear HDMI, DP, and VGA for display output, and up to eight USB 3.2 ports (six for B960). PCIe connectivity varies between the B960 and Q970 versions of the board: the Q970 model features two PCIe 5.0 x16 slots, one wired with the full 16 lanes and the other with 8 lanes, two PCIe 5.0 x4 slots, and two more PCIe 5.0 x4 slots wired with only two lanes. For storage, the Q970 version features four PCIe 5.0 x4 M.2 slots, with half wired with the full four lanes and the other two wired with two lanes. The B960 version drops the secondary PCIe slots to Gen 4, featuring a single PCIe 5.0 x16 slot, three PCIe 4.0 x4 slots, one with four lanes and two with two lanes active. For storage, the B960 board features a single PCIe 5.0 x4 M.2 slot and a single SATA 3.0 M.2 slot. The new board confirms the various PCIe differences between the B960 and Q970 chipsets for Intel's upcoming LGA1954 platform. Several months ago, the lane count for Intel's five 900 series chipsets was leaked, including B960 with 34 total PCIe lanes and Q970 with 44 PCIe lanes (not counting CPU lanes). Just like past generations, Intel's B-series chipset is geared towards mid-range mainstream Intel motherboards, and Intel's Q series chipset is geared towards enterprise/industrial focused motherboards. Story Q&A. Powered by TweakBot From TweakTown's coverage of this story. Which Intel Nova Lake-S Core Ultra 400 processors will the M26-NVLS-ATX09 support, and will BIOS updates be required? What memory capacities and DIMM configurations does the Decenta M26-NVLS-ATX09 support? Which Intel CPU generations are expected to work with the LGA 1954 socket after Nova Lake? Can the M26-NVLS-ATX09 use its HDMI, DisplayPort, and VGA outputs simultaneously, and what display limits apply? Want something else? Ask TweakBot. LGA 1954 is expected to debut in Q1 of 2027 and will arrive with support for Intel's upcoming Nova Lake-S Core Ultra 400 series CPUs. Rumors suggest that LGA 1954 could be one of Intel's longest-running chipsets, with support for Nova Lake, Razor Lake, and even Hammer Lake.

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