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Micron Technology

Makes memory and storage chips for AI and PCs

Principal Engineer - IO Design

Silicon & ASIC DesignUpdated on Nov 4
Full-timeBoise, ID, USANo salary listedIn-person

About the Job

Requirements

  • A minimum of a Master of Science in Electrical Engineering and 10 years of industry experience, or a Bachelor of Science in Electrical Engineering and 12 years of industry experience in analog and mixed-signal circuit design.
  • Proficiency with UNIX and the Cadence design environment, including simulation, schematic entry, and SPF extraction.
  • Understanding of device physics and basic CMOS processing techniques.
  • Ability to supervise layout work and understand good layout practices for high-speed circuits to minimize parasitic impacts.
  • Ability to convey sophisticated technical concepts verbally and in writing to design peers.
  • Ability to work with all product types and product teams in parallel with silicon validation efforts.

Responsibilities

  • Innovate, design, optimize, and verify high-speed IO and clocking circuits used in new DRAM products.
  • Apply proven high-speed circuit design techniques and enhance critical performance evaluation of the IO data path and clocking path at circuit level.
  • Develop accurate modeling, analysis, and simulation methodology to capture key circuit performance metrics and their impact to product specifications at full-chip and system level.
  • Work with Product Engineering and the SI team to compare silicon performance with simulation results and support correlation activities.
  • Collaborate with process integration and transistor modeling teams on the next process node.

Desired Qualifications

  • 7+ years of experience in high-speed transmitter, receiver, and clocking circuit design and optimization with proven silicon successes.
  • Prior experience in channel modeling and characterization, transceiver noise and timing budget analysis, equalization techniques, and SI knowledge.
  • Ability to mentor and coach engineers early in their careers.
  • Ability to use AI/ML and fluency in scripting languages such as Perl and Python.
  • Use of Agentic AI.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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