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Invisix Measuring Systems

Non-destructive 3D nanoscale chip imaging

Application Engineer - Device Expert

Hardware EngineeringUpdated on Nov 15
Full-timeEindhoven, Netherlands

About the Job

Requirements

  • A Master's degree or PhD in physics, materials science, or electrical engineering.
  • At least 3 years of experience at a tier-1 semiconductor manufacturer or a major metrology supplier.
  • Comprehensive knowledge of semiconductor device architecture and manufacturing processes, sufficient to describe advanced structures from memory.
  • Strong Python skills and the ability to write functional code under pressure.
  • The ability to perform under time pressure and communicate with high-visibility stakeholders.
  • Fluent English suitable for customer interaction at every level.

Responsibilities

  • Model semiconductor devices by analyzing process flows, layer structures, and technical specifications.
  • Extract customer requirements through direct engagement and convert them into modeling assignments.
  • Develop and refine device models and data recipes for demonstrations with the Application Team Lead and data analysts.
  • Take primary responsibility for device architecture discussions in customer meetings and demonstrations.
  • Guide algorithm and software teams on new modeling methods and recipe optimization.
  • Adapt to emerging process technologies and evolving software capabilities.
  • Travel to customer sites roughly once a quarter.

Desired Qualifications

  • Experience with optical CD metrology recipe setup.
  • Inverse problem-solving experience.
  • Korean and/or Mandarin Chinese.

About the Company

Invisix Measuring Systems

Non-destructive 3D nanoscale chip imaging

Invisix Measuring Systems builds a soft X-ray metrology platform for non-destructive 3D imaging of buried nanoscale chip structures, designed for high-volume semiconductor manufacturing. It uses High Harmonic Generation to produce soft X-ray signals and applies proprietary reconstruction algorithms and machine learning to turn that data into 3D images. This enables viewing buried features that optical tools can’t resolve, with a focus on throughput suitable for complex 3D devices. The company has validated its approach with Intel and imec and recently closed a €20 million seed round with strategic investors to accelerate commercial systems and scale customer demonstrations.

Company size
11-50
Company stage
Seed
Total funding
$22M
Headquarters
Veldhoven, Netherlands
Founded
2025

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