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Micron Technology

Makes memory and storage chips for AI and PCs

Product Yield Enhancement Engineer

Quality EngineeringUpdated on Nov 3
Full-timeBoise, ID, USANo salary listedIn-person

About the Job

Requirements

  • A Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related technical field.
  • At least 2 years of experience in semiconductor failure analysis, yield enhancement, or a closely related field.
  • Hands-on experience with fault isolation techniques, including emission microscopy, laser-based methods such as OBIRCH and TIVA, and EOTPR.
  • Working knowledge of CMOS fabrication processes and package assembly flows.
  • Proficiency in reading and interpreting semiconductor layout and schematic designs.
  • Experience with Physical Failure Analysis (PFA) tools and de-processing techniques such as FIB, cross-sectioning, and delayering.
  • Ability to perform data extractions and analysis from fab, probe, and backend test systems.
  • Strong written and verbal communication skills and ability to generate clear, organized failure analysis reports.

Responsibilities

  • Perform Electrical Failure Analysis and fault isolation using emission microscopy, laser techniques, EOTPR, and PFA/de-processing methods.
  • Characterize and model backend test, internal qualification, and RMA fail signatures using layout, schematic, and data analysis tools.
  • Apply in-depth knowledge of CMOS fabrication processes and package assembly flows to identify process- and assembly-related defects, root causes, and downstream effects.
  • Evaluate reliability concerns and delayed breakdown failure mechanisms across test insertions.
  • Perform fab, probe, and backend data extractions to provide supplemental data supporting failure analysis conclusions.
  • Generate organized and timely failure analysis reports with clearly communicated causes, effects, and recommended actions.
  • Present and coordinate findings with Management, Product, Process, Assembly, and Global Quality teams.
  • Employ Artificial Intelligence.

Desired Qualifications

  • A Master's degree or Ph.D., or equivalent experience, in Electrical Engineering, Materials Science, Physics, or a related field.
  • Over 4 years of dedicated electrical failure analysis experience in a high-volume semiconductor manufacturing environment.
  • Experience with memory products such as DRAM, NAND, or HBM.
  • Advanced proficiency with EFA tools and techniques such as photon emission, laser voltage probing (LVP), and thermal laser stimulation.
  • Familiarity with reliability failure modes such as electromigration, TDDB, HCI, and delayed breakdown mechanisms.
  • Experience modeling or characterizing complex fail signatures across test insertions.
  • Ability to collaborate cross-functionally with Process, Product, Assembly, and Quality Engineering teams.
  • Experience with data analysis tools or scripting languages such as Python, JMP, or MATLAB for supplemental data extraction and analysis.
  • Presentation skills and experience communicating technical findings to senior leadership.
  • AI proficiency or AI-enabled experience.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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