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Polar Semiconductor

Automotive-grade power and sensor IC foundry

MTS Technology Development Engineer

Process EngineeringConfirmed live in the last 24 hours
Full-timeBloomington, MN, USAIn-person

About the Job

Requirements

  • Strong knowledge of key front-end process modules, including silicon, epitaxy, diffusion, etch, photo, and thin films.
  • Process integration experience in CMOS/BCDMOS or discrete IGBTs/MOSFETs is required.
  • Strong knowledge of silicon semiconductor device physics.
  • Experience designing process flows to achieve manufacturability metrics and meet electrical test targets.
  • Experience interpreting electrical test data and correlating it with process and cross-sectional data.
  • Experience interpreting failure analysis results and familiarity with failure analysis techniques.
  • Experience with power packaging, including assembly and reliability issues.
  • Typically requires a Master's or PhD in Electrical Engineering, Physics, or Material Science and 10+ years of experience in a relevant job function.
  • Ability to work with and interpret information and data between design and process teams.
  • Ability to drive solutions and collaborate on cross-functional teams.
  • Technical leadership ability, including education, experience, mentoring, and communication skills.
  • Ability to work under conditions involving exposure to hazardous chemicals, high voltages, and high equipment temperatures.

Responsibilities

  • Contribute to the development, transfer, optimization, and documentation of process flows and macro modules required to fabricate reliable, manufacturable Power Trench MOSFETs and BCD devices that meet parametric and performance goals.
  • Characterize, evaluate, and document semiconductor devices to ensure reliability and performance to quality standards.
  • Evaluate opportunities to develop or transfer new semiconductor technology and processes.
  • Set up and perform process and device simulations to determine initial process parameters, capabilities, and optimization direction for new process flows.
  • Design and perform experiments and analyze results to determine process sequences and parameters that achieve target device parameters, using process simulations or initial test lots as a starting point.
  • Analyze electrical, in-process measurement, and visual inspection data from fabrication test lots to determine which parameters require additional optimization.
  • Mentor and oversee 2–3 junior engineers as needed.
  • Work with Process Engineering to develop, characterize, and optimize process modules.
  • Support processing of the initial test chip and transfer lots fabricated with the new process to identify and correct problem areas and achieve first-pass success.
  • Provide input to and work with Device Engineers to develop layout rules for the process using equipment specifications and experimental data.
  • Recommend test structures and contribute to test chip mask-set layouts to aid process development and evaluate process dependencies of device parameters.
  • Provide weekly, monthly, and quarterly development updates to upper management and external customers.
  • Support company initiatives such as quality, safety and environmental management, continuous quality improvement, 5S, yield management, and cost containment.
  • Perform other duties as required.

Desired Qualifications

  • Experience in contact/metallization and backend processes, including BGBM and STM.
  • Experience developing process, technology, and design failure mode and effects analyses.
  • Experience with design of experiments and data analysis tools such as JMP and Spotfire.
  • Experience with technology computer-aided design process simulations.
  • Ability to read and interpret design layouts.

About the Company

Polar Semiconductor

Automotive-grade power and sensor IC foundry

Polar Semiconductor is a U.S.-owned semiconductor foundry that manufactures high-performance automotive-grade power and sensor chips. It runs wafer fabrication plants that turn customers’ chip designs into physical silicon through processes like fabrication, testing, and packaging. The company differentiates itself by its long history as an advanced wafer fab, its focus on automotive-grade power and sensors, and a fortified U.S. ownership and capacity footprint supported by government funding under the CHIPS Act, which helps it expand domestic production. Its goal is to grow domestic fabrication capacity and strengthen the American semiconductor ecosystem to improve supply chain resilience.

Company size
201-500
Company stage
Growth Equity (Non-Venture Capital)
Total funding
$548M
Headquarters
Bloomington, MN
Founded
1962

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