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Teledyne

Manufactures sensors, imaging systems, and avionics

Process Development Engineer

Manufacturing EngineeringConfirmed live in the last 24 hours
Full-timeMountain View, CA, USA$58.7k - $78.3kIn-person

About the Job

Requirements

  • A bachelor's degree in engineering or equivalent and at least 1 year of experience in electronics manufacturing are required.
  • Familiarity with AS9100/ISO 9001 standards and lean manufacturing principles is required.
  • Proficiency in Microsoft Office is required.
  • Strong analytical and problem-solving skills are required.
  • U.S. citizenship is required, and the candidate must be able to obtain and maintain a government security clearance.

Responsibilities

  • Provide process engineering support for thin-film hybrid assembly and microwave integrated circuit processes.
  • Support assembly methods including eutectic attach, epoxy attach, bond pull, gap welding, sealing, and painting.
  • Troubleshoot new assembly processes and resolve in-process technical issues using root cause analysis.
  • Participate in process development, research, and continuous improvement initiatives.
  • Generate engineering change orders and maintain accurate assembly documentation.
  • Assist in new product development, with emphasis on automatic wire bonding and die attach.
  • Lead process transfers from new product introduction to production and design tooling using computer-aided design software.
  • Analyze production data and implement solutions using Lean, process failure mode and effects analysis, and statistical process control methodologies.

Desired Qualifications

  • Background in electronics assembly processes such as wire bonding and die attach.
  • Knowledge of process tooling design and application.
  • Experience with SolidWorks.

About the Company

Teledyne

Manufactures sensors, imaging systems, and avionics

Teledyne Technologies designs and makes sensors, cameras, and electronics used in aerospace, environmental monitoring, medical imaging, and defense. Its products include digital imaging sensors, high-reliability cameras, instrumentation, aerospace and defense electronics, and engineered systems that provide integrated sensing solutions for demanding environments. The company grows by acquiring specialized high-tech firms, building a diversified portfolio that serves markets with high barriers to entry. Its goal is to expand capabilities and market reach through targeted acquisitions while delivering reliable sensing and imaging technology for critical industries.

Company size
11-50
Company stage
IPO
Headquarters
Thousand Oaks, CA
Founded
1960

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