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Mirafra Technology

Turnkey ASIC design and semiconductor engineering

Linux Device Driver

Systems Software EngineeringConfirmed live in the last 24 hours
Full-timeChennai, Tamil Nadu, IndiaNo salary listedIn-person

About the Job

Requirements

  • Three to five years of industry experience in real-time embedded telecommunications systems.
  • Proficiency in C.
  • Understanding of 802.11 wireless protocols, including 802.11b/g/n.
  • Understanding of real-time operating system concepts, data structures, and the software development lifecycle.
  • Experience with middleware development for Wi-Fi.
  • Experience with peer-to-peer technologies using Wi-Fi.
  • Experience with the Android framework and wpa_supplicant.
  • Familiarity with graphical user interfaces on Android.
  • Debugging skills to analyze and resolve interoperability issues.

Responsibilities

  • Develop middleware for Wi-Fi.
  • Analyze and fix interoperability issues through debugging.
  • Work with 802.11 wireless protocols and real-time embedded telecommunications systems.

Desired Qualifications

  • Experience with Wi-Fi Direct.
  • Experience implementing MAC protocols, preferably wireless MAC protocols.
  • Hands-on Linux device driver development experience.

About the Company

Mirafra Technology

Turnkey ASIC design and semiconductor engineering

Mirafra Technologies delivers end-to-end turnkey ASIC design and semiconductor engineering services to help global tech companies move from concept to silicon to system. It covers the full lifecycle: architecture, design, verification, physical implementation, package/board design, embedded software, post-silicon validation, test and product engineering, and system solutions. With 2,200+ engineers and delivery centers worldwide, Mirafra has completed 650+ tape-outs for over 50 semiconductor customers, from startups to established firms. Its edge comes from a one-stop engineering partner model that combines deep domain expertise with scalable AI, cloud, data engineering, and software capabilities to speed time-to-market and reduce engineering complexity.

Company size
1,001-5,000
Company stage
Not listed
Total funding
Not listed
Headquarters
Bengaluru, India
Founded
2004

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