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Zeiss

Supplies lithography optics for semiconductor manufacturing

Lead Developer SAP Integration

Backend EngineeringConfirmed live in the last 24 hours
Full-timeOberkochen, GermanyNo salary listedIn-person

About the Job

Requirements

  • Completed studies in business informatics, informatics, engineering sciences, physics, or a comparable field.
  • Several years of experience connecting various SAP processes with third-party systems through middleware.
  • Ability to provide sustainable value to user departments through consultation and solution designs.
  • Ability to distinguish communicated customer requirements from actual customer needs and moderate the resulting differences within the area of expertise.
  • Ability to manage multiple concurrent professional priorities.
  • Very good German and English language skills.

Responsibilities

  • Connect external systems to S/4HANA and monitor interface activity.
  • Advise SAP-using business departments when creating new interfaces.
  • Prepare interface errors for business departments, communicate them, and monitor their resolution.
  • Support process adjustments, master-data requirements, user interaction, and technical implementation.
  • Act as the technically oriented link between business departments and implementation service providers during the S/4HANA migration.
  • Gather requirements from business departments.
  • Review the results of external service providers.
  • Conduct functional tests.
  • Technically configure various interfaces.
  • Prioritize business continuity.

Desired Qualifications

  • Experience from SAP consulting, working as an SAP key user, or working as an ABAP developer.
  • Experience gained in a production-intensive work environment.
  • Relevant knowledge acquired in an S/4HANA migration project.

About the Company

Zeiss

Supplies lithography optics for semiconductor manufacturing

Zeiss SMT designs and makes high-precision optical systems for semiconductor manufacturing, including lithography optics, photomask solutions, and process-control components. Its products are used in lithography equipment to project circuit patterns onto silicon wafers, with responsibilities spanning advanced optics, mask technology, and monitoring tools that ensure precise, repeatable imaging.

Company size
1,001-5,000
Company stage
Growth Equity (Non-Venture Capital)
Total funding
$1.1B
Headquarters
Oberkochen, Germany
Founded
2001

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