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Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Senior Staff Device Characterization Engineer

Hardware Validation & TestingConfirmed live in the last 24 hours
Full-timePalm Bay, FL, USANo salary listedIn-person

About the Job

Requirements

  • A Bachelor's or Master's degree in Electrical Engineering is required.
  • A minimum of 10 years of hands-on experience in semiconductor device characterization is required.
  • Familiarity with HP RMB or SPECS is required.
  • Familiarity with Unix systems is required.
  • Proficiency using electronic lab equipment, including automated probers, semiconductor parameter analyzers, and S-parameter systems, is required.
  • Experience in semiconductor layout using tools such as Cadence Virtuoso is required.
  • Knowledge of the underlying device physics of the tested devices is required.

Responsibilities

  • Oversee and maintain test equipment, including HP4062/4073 testers with EG2080, EG4090, and TEL Precio XL probers, leveraging custom RMB code.
  • Work with HP8753 and Cascade full-temperature probers using HP IC-CAP software.
  • Manage an Agilent B1500 with a manual probe station.
  • Perform wafer-level and package-part measurements, including process and device characterization testing, EPROM testing, device raw I-V curves, and reliability tests such as HCI and HTRB.
  • Conduct transient manual measurements such as gate charge and reverse recovery.
  • Perform S-parameter measurements using an HP8753D with a manual probe station and IC-CAP software.
  • Develop new software as needed by the device development and modeling team.
  • Work with other team members to debug test chip programs.
  • Upgrade hardware and software as testing requirements change.

Desired Qualifications

  • Familiarity with Splus/R, Python, MATLAB, or JMP is a plus.

About the Company

Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Renesas manufactures and sells MCUs, SoCs, and analog/power semiconductor devices to OEMs, focusing on automotive, industrial, infrastructure, and IoT markets. Its chips are building blocks that run embedded software and manage power and signals, and its Winning Combinations offer pre-tested system architectures to speed up design. It differentiates itself by growing through acquisitions to offer a broad, integrated portfolio and by moving toward a unified digital design platform to reduce integration work. Its goal is to become a leading supplier of these components and provide a single platform for electronics design that speeds time-to-market.

Company size
10,001+
Company stage
IPO
Headquarters
Tokyo, Japan
Founded
2002

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