M

Micron Technology

Makes memory and storage chips for AI and PCs

Advanced Packaging Equipment Engineering Engineer

Manufacturing EngineeringConfirmed live in the last 24 hours
Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

  • A bachelor's or advanced degree in Engineering or Science is required.
  • Strong analytical, logical, and critical thinking skills are required.
  • Effective communication and the ability to collaborate across all levels are required.

Responsibilities

  • Develop and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking.
  • Improve equipment capability, enable process improvements, reduce costs, and enhance productivity.
  • Establish and improve equipment management projects to deliver technode requirements.
  • Evaluate and promote new equipment and materials to enhance process capabilities.
  • Establish hardware strategic roadmaps for 5+ years in post-probe wafer and die processing.
  • Develop wafer and assembly equipment to meet the physical and electrical requirements of Micron’s products, considering cost and availability and improving hardware and process capability.
  • Ensure defense coverage through process, measurement, inspection, and testing.
  • Establish correlations between defense mechanisms to identify improvement opportunities.
  • Conduct continuous data analysis to establish advanced controls and identify improvement opportunities.
  • Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives.
  • Work closely with Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality teams to integrate manufacturing processes for optimal performance and quality control.
  • Ensure smooth transition from new product development and qualification through small-volume and high-volume production.

Desired Qualifications

  • Internship or experience in the semiconductor industry.
  • A demonstrated leadership record and track record of impact.
  • Interest in and knowledge of the semiconductor industry and Micron.
  • Proficiency in Python, R, and SQL for statistical analysis, process modeling, and data analytics.
  • Experience with Visual Basic for automation and tool integration.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

Recently Posted Jobs

Explore more opportunities at Micron Technology

See more jobs