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Micron Technology

Makes memory and storage chips for AI and PCs

PDE CEM Engineer

Manufacturing Engineering +1Confirmed live in the last 24 hours
Full-timeGeorge Town, Penang, MalaysiaNo salary listedIn-person

About the Job

Requirements

  • A Master's or bachelor's degree in an engineering discipline.
  • Experience in backend engineering process or assembly package technology development is preferred.
  • Fresh graduates and highly motivated individuals with 1–2 years of work experience are encouraged to apply.
  • Strong problem-solving, data analysis, statistical analysis, and data interpretation skills are required.
  • The candidate should be able to work effectively as a teammate and communicate interpersonally.
  • The candidate should be results-driven, self-motivated, and able to manage multiple priorities.

Responsibilities

  • Develop and optimize processes to meet business-case schedules.
  • Support new product introduction and improve yield, quality, and reliability through process characterization and optimization, and the introduction of new materials, machines, and technologies.
  • Perform Design of Experiments and manage NPI runs for recipe creation and verification; verify process performance and collect data for reports.
  • Identify, diagnose, and resolve assembly-process problems.
  • Transfer new products and packages smoothly from NPI to the high-volume manufacturing site, collaborating with multifunctional teams and sites.
  • Validate and document the baseline Process of Record, Transfer of Record, and Bill of Materials for transferred products and packages.
  • Execute qualification builds of NPI packages proliferated from pilot products and packages according to the planned timeline.
  • Execute NPI customer-sample and engineering-sample builds for new products and packages according to the planned timeline.
  • Evaluate and improve assigned assembly processes, materials, and/or equipment.
  • Participate in process, tool, and material optimization to develop packaging solutions, achieve first-pass NPI qualification, and identify cost-reduction ideas.
  • Maintain in-depth assembly-process and packaging knowledge, including integration knowledge of materials and equipment.
  • Identify process variables and optimize process and/or equipment variables.
  • Contain process and equipment deviations, lead root-cause investigations, and implement corrective actions.
  • Develop the Process of Record, define process edges, center the process (CPK), and apply Design of Experiments techniques for process characterization.
  • Develop a process capability roadmap and evaluate equipment and/or material technologies.

Desired Qualifications

  • AI proficiency or AI-enabled ways of working is essential where applicable; use of AI is compulsory.
  • Experience in backend engineering process or assembly package technology development.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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