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Nexperia

Manufactures discrete semiconductors, logic devices, MOSFETs

Mold Process Chief Engineer - Process

Manufacturing EngineeringConfirmed live in the last 24 hours
Full-timeNo salary listed

About the Job

Requirements

  • A Bachelor's degree in Engineering and 8+ years of semiconductor assembly manufacturing experience, including extensive exposure to both auto-molding and manual molding in Mold Process Engineering.
  • Strong expertise in Transfer Molding processes, Mold equipment platforms, mold tooling design, tooling qualification, tooling maintenance strategies, and Epoxy Molding Compound materials.
  • Hands-on experience with leading Mold equipment suppliers and platforms, including equipment setup, optimization, troubleshooting, and process characterization.
  • Experience in tooling development, cavity balancing, mold chase optimization, runner/gate design evaluation, and defect reduction initiatives.
  • Proficiency in Minitab, JMP, statistical process control, design of experiments, failure mode and effects analysis, measurement system analysis, design for manufacturability, Six Sigma, and root cause analysis methodologies.
  • Extensive knowledge of problem-solving methodologies such as 8D reporting, DMAIC, and Phenomena Mechanism approach.
  • A proven track record delivering yield improvement, cost reduction, process optimization, and manufacturing excellence programs.
  • Strong analytical and troubleshooting capabilities to resolve complex process, equipment, and tooling-related challenges.
  • Project management, leadership, and stakeholder management skills in cross-functional and global environments.
  • Communication and presentation skills to influence technical and business decisions.
  • Proficiency in Microsoft Office applications, including data analytics tools such as Spotfire.

Responsibilities

  • Lead and drive Mold process, tooling, and equipment improvement initiatives to enhance yield, quality, productivity, cost performance, and process capability.
  • Serve as the technical expert for Mold tooling design, qualification, optimization, maintenance strategy, and troubleshooting across manufacturing operations.
  • Develop, optimize, and implement robust Mold processes using statistical and engineering methodologies, including SPC, DOE, FMEA, MSA, and structured problem-solving techniques.
  • Drive process characterization, equipment evaluations, tooling qualifications, and technology transfers for new products and process enhancements.
  • Lead investigations and corrective actions for customer complaints, production excursions, OQA findings, and Mold-related quality issues.
  • Own Mold yield performance by identifying and eliminating defect mechanisms through data-driven analysis and continuous process optimization.
  • Define equipment specifications and collaborate with suppliers on Mold equipment and tooling improvements, upgrades, and technology roadmaps.
  • Develop and maintain process documentation, including FMEA, Control Plans, Work Instructions, Best Known Methods, and standardized manufacturing practices.
  • Partner with global engineering, operations, quality, maintenance, and supply chain teams to drive process standardization and operational excellence.
  • Mentor and develop Mold Process Engineers through technical coaching, training, and best-practice sharing.

About the Company

Nexperia

Manufactures discrete semiconductors, logic devices, MOSFETs

Nexperia operates as a global supplier of semiconductor components, focusing on discrete semiconductors, logic devices, and MOSFETs. It serves automotive and industrial customers, providing parts that help electronic systems manage power, process signals, and protect data. The company designs, manufactures, and distributes these high-performance components, which are used in applications such as power management, autonomous driving, and data protection. Compared with competitors, Nexperia emphasizes reliability, quality, and targeted expertise in automotive and industrial markets, supported by ongoing improvement and product development. Its goal is to maintain leadership in supplying essential semiconductor parts that enable safer, more efficient, and more capable electronic systems.

Company size
1,001-5,000
Company stage
Acquired
Total funding
$880M
Headquarters
Nijmegen, Netherlands
Founded
1953

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