Foxconn Industrial Internet

Designs and manufactures intelligent manufacturing solutions

Advanced Repair Technician

Hardware EngineeringUpdated on Nov 13

Full-timeMt Pleasant, WI, USANo salary listedIn-person

About the Job

Requirements

A 2-year technical degree or equivalent experience in advanced electronics repair.
Extensive experience with BGA and fine-pitch component repair.
Proficiency in IPC-A-610, IPC-7711/7721, and J-STD-001 standards.
Familiarity with BGA rework tools and thermal profiling techniques.
Demonstrated ability to troubleshoot and repair to the component level.
Ability to mentor peers and provide training on advanced equipment.
Attention to detail and documentation accuracy.

Responsibilities

Perform advanced diagnostics and root cause analysis on complex PCB failures.
Execute advanced soldering and de-soldering, including BGA, SMT, and fine-pitch components.
Operate high-end rework equipment, including BGA rework stations such as ERSA and SUMMIT systems.
Interpret and work from circuit schematics and engineering documentation.
Maintain detailed records of repair actions and results for traceability.
Train junior technicians on advanced repair methods and standards.
Ensure compliance with IPC-7711/21 and quality management systems.
Support process improvement initiatives within the repair department.
Perform other duties as assigned.

Desired Qualifications

Experience with Lean Manufacturing and continuous improvement.

FII USA, Inc., a Foxconn Technology Group Company, is seeking an Advanced Repair Technician with expert-level skills in BGA and advanced component rework. This role supports high-complexity board repairs and utilizes advanced diagnostic and rework tools in a precision repair environment.

The Advanced Repair Technician will be responsible for repairs involving Ball Grid Array components and other high-density board technologies, using equipment such as ERSA or SUMMIT rework systems.

Perform advanced diagnostics and root cause analysis on complex PCB failures
Execute expert-level soldering and de-soldering, including BGA, SMT, and fine-pitch components
Operate high-end rework equipment, including BGA Rework Stations (ERSA, SUMMIT, etc.)
Interpret and work from circuit schematics and engineering documentation
Maintain detailed records of repair actions and results for traceability
Train junior technicians on advanced repair methods and standards
Ensure compliance with IPC-7711/21 and quality management systems
Support process improvement initiatives within the repair department
Other duties as assigned

2-year technical degree or equivalent experience in advanced electronics repair
Extensive experience with BGA and fine-pitch component repair
Proficient in IPC-A-610, IPC-7711/7721, and J-STD-001 standards
Familiarity with BGA rework tools and thermal profiling techniques
Demonstrated ability to troubleshoot and repair to the component level
Ability to mentor peers and provide training on advanced equipment
Excellent attention to detail and documentation accuracy
Experience with Lean Manufacturing and continuous improvement is a plus

About the Company

Foxconn Industrial Internet

Designs and manufactures intelligent manufacturing solutions

Foxconn Industrial Internet designs and manufactures technology infrastructure for large tech firms, focusing on intelligent manufacturing and the industrial internet. It combines hardware design and production with software-enabled solutions, including AI and automation platforms like Lighthouse Factory, the FII Cloud (with Tencent Cloud), and Fog Cerebellum, to help clients digitize data and optimize production lines. It differentiates itself through large-scale integration as a design-to-manufacture partner, exclusive assembly of premium Nvidia GB200 AI servers, and a strong push into higher-margin cloud, networking, and industrial AI services backed by Foxconn. Its goal is to move from traditional contract manufacturing to high-value technology services, expanding its AI-server, data-center, EV, and semiconductor test automation businesses with scalable intelligent manufacturing solutions.

Company size: 1,001-5,000
Company stage: IPO
Headquarters: Shenzhen, China
Founded: 2015

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