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Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Assembly Equipment & Maintenance Engineer

Mechanical Maintenance and Reliability EngineeringConfirmed live in the last 24 hours
Full-timeTelok Panglima Garang, Selangor, MalaysiaNo salary listedIn-person

About the Job

Requirements

  • A bachelor's degree in engineering—Mechanical, Electrical, Electronics, Mechatronics, or Semiconductor Technology—or equivalent.
  • One to two years of experience in semiconductor manufacturing, equipment engineering, or maintenance is advantageous; fresh graduates are encouraged to apply.
  • Basic knowledge of mechanical, electrical, and automation systems.
  • Understanding of Overall Equipment Effectiveness, preventive maintenance, and problem-solving methodologies.
  • Strong analytical and troubleshooting skills.
  • A proactive, hands-on approach and communication and teamwork skills.

Responsibilities

  • Maintain and improve equipment stability, uptime, and reliability to meet production targets.
  • Perform preventive and corrective maintenance, troubleshoot equipment issues, and conduct root cause analysis.
  • Monitor and improve Overall Equipment Effectiveness performance through data analysis and continuous improvement activities.
  • Identify and implement automation, digitalization, and Robotic Process Automation solutions to improve operational efficiency.
  • Support equipment installation, qualification, maintenance, technical documentation, and engineering projects.
  • Collaborate with Production, Process, and Quality teams to ensure smooth manufacturing operations.

Desired Qualifications

  • Exposure to programmable logic controllers, robotics, machine vision, Python, Power BI, VBA, or Robotic Process Automation tools is an added advantage.
  • Passion for automation, Industry 4.0, and smart manufacturing.

About the Company

Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Renesas manufactures and sells MCUs, SoCs, and analog/power semiconductor devices to OEMs, focusing on automotive, industrial, infrastructure, and IoT markets. Its chips are building blocks that run embedded software and manage power and signals, and its Winning Combinations offer pre-tested system architectures to speed up design. It differentiates itself by growing through acquisitions to offer a broad, integrated portfolio and by moving toward a unified digital design platform to reduce integration work. Its goal is to become a leading supplier of these components and provide a single platform for electronics design that speeds time-to-market.

Company size
10,001+
Company stage
IPO
Headquarters
Tokyo, Japan
Founded
2002

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