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Kulicke & Soffa

Manufactures semiconductor packaging equipment and tools

Senior Engineer 1 - Software, Systems

Software EngineeringConfirmed live in the last 24 hours
Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

  • A bachelor's or master's degree in Software, Computer, or Electrical Engineering, or a related field.
  • At least 5 years of large-scale software development experience, preferably in system-level or embedded software.
  • Proficiency in C# and C++ programming and object-oriented design principles.
  • Experience with real-time systems and multithreaded application development.
  • Experience with software lifecycle tools such as version control, Git, and Jira.
  • Strong analytical, debugging, and problem-solving skills.
  • Effective communication and collaboration skills.

Responsibilities

  • Design and develop software for real-time applications and automation.
  • Translate functional requirements into technical specifications and system designs.
  • Participate in software design reviews and contribute to platform evolution.
  • Perform unit testing, debugging, and performance tuning to ensure robust system behavior.
  • Investigate and resolve software defects, proposing design improvements where applicable.
  • Collaborate with cross-functional and cross-geographical teams throughout the development lifecycle.
  • Document software specifications, changes, and releases clearly and accurately.
  • Support continuous improvement of software tools, workflows, and development practices.
  • Drive the architecture and implementation of software solutions that enhance equipment performance and reliability.
  • Mentor junior engineers through code reviews and design discussions.

Desired Qualifications

  • Experience in equipment control systems or the semiconductor industry.

About the Company

Kulicke & Soffa

Manufactures semiconductor packaging equipment and tools

Kulicke & Soffa designs, manufactures, and sells capital equipment and tools for assembling semiconductor devices. Its product line includes ball bonders that ultrasonically attach fine wires to a semiconductor die, thermo-compression bonding systems for high-density interconnects, and equipment for surface-mount technology and die attach. The company differentiates itself with a long history dating back to 1951, a broad portfolio across wire bonding, advanced packaging, and die attach, and a strong Asia-Pacific presence plus an active after-market parts and services business. Its goal is to enable mass production of semiconductors by providing reliable, high-precision packaging and assembly solutions that help customers scale manufacturing and keep equipment running smoothly.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Singapore, Singapore
Founded
1951

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