IC Package Development Engineer

Key Responsibilities

Package Development & Engineering

• Support package feasibility studies, architecture evaluations, design optimization, and technical risk assessments.

• Apply mechanical, electrical, materials, thermal, and manufacturing fundamentals to package-engineering problems.

• Support development activities for memory and semiconductor package technologies from concept through qualification and manufacturing readiness.

• Analyze engineering data,identifyrisks, document findings, and recommend technically sound actions.

• Contribute to design-for-manufacturing, design-for-reliability, design quality, and first-pass qualificationobjectives.

Design, CAD & EDA

• Create, review, or analyze package layouts, substrate structures, stack-ups, drawings, design inputs, and engineering deliverables.

• Use CAD/EDA tools to support physical design, routing, logical design, design-rule validation, documentation, and release activities.

• Work with multidisciplinary teams to resolve design, manufacturability, performance, and data-quality issues.

• Support engineering standards, reusable design methods, templates, and best-known methods.

AI, ML & Automation

• Develop automation for repetitive design, simulation, data-processing, validation, reporting, and engineering workflow activities.

• Build or contribute to AI/ML models for design validation, optimization, prediction, anomaly detection, and simulation acceleration.

• Create engineering assistants, copilot agents, dashboards, and data pipelines that improve decision speed and traceability.

• Translate engineering challenges into scalable digital solutions withappropriate validation, documentation, security, and human oversight.

• Measure solution effectiveness using clear engineering, quality, adoption, and cycle-time indicators.

Collaboration & Execution

• Work effectively with global teams across PDE, product engineering, technology development, manufacturing, quality, suppliers, and business stakeholders.

• Communicate technical information clearly through analyses, presentations, design reviews, and engineering documentation.

• Participate in training, rotational assignments, mentoring, technical reviews, andcontinuous improvementinitiatives.

• Demonstrate ownership, learning agility, disciplined execution, and commitment to safe and ethical engineering practices.

Minimum Qualifications

• Bachelor's ormaster's degree in mechanical engineering, Electrical Engineering, Electronics Engineering, Mechatronics, Materials Engineering, Semiconductor Engineering, Computer Science, Data Science, or a closely related discipline.

• Strong foundationin engineering mathematics, physics, problem solving, and data interpretation.

• Ability to learn semiconductor packaging concepts, design methods, manufacturing processes, and engineering systems.

• Programming or scripting exposure in Python, MATLAB, C/C++, or equivalent language.

• Ability to communicate clearly, collaborate across functions, and manage assigned work with discipline.

Preferred Qualifications and Differentiators

• Semiconductor packaging exposure

• Simulation exposure

• Experience working on AI/ML solutions

• Strong generative AI usage

• Data analytics and visualization

• PLM/ALM exposure, including Teamcenter, change management, and master data