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Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Module Product Engineer

Hardware Systems IntegrationUpdated on Nov 14
Full-timeAustin, TX, USANo salary listed

About the Job

Requirements

  • A bachelor's degree in Electrical Engineering, Computer Engineering, or a related field is required.
  • At least 8 years of experience in semiconductor product engineering, manufacturing engineering, or test engineering, with demonstrated ownership from new product introduction through high-volume production.
  • Strong technical depth in semiconductor power products and advanced power module manufacturing.
  • Strong data analysis skills and the ability to interpret statistical results and drive decisions.
  • Working knowledge of new product development, qualification, and high-volume manufacturing transfer.
  • Strong written and verbal communication skills with customers and cross-functional teams.
  • Proven ability to lead complex technical decisions, escalations, and execution across organizations.
  • Must be currently authorized to work in the United States on a full-time basis; visa sponsorship is unavailable.

Responsibilities

  • Own product engineering execution for advanced power modules from new product introduction through high-volume production and sustaining.
  • Own the manufacturability of advanced power modules and drive robust assembly processes across outsourced semiconductor assembly and test providers and internal manufacturing sites.
  • Establish and enforce assembly workmanship standards and ensure compliance with IPC-A-610 (Acceptability of Electronic Assemblies).
  • Drive cross-functional alignment across Design, Test, Quality, and Manufacturing to enable scalable, high-yield module production.
  • Lead resolution of assembly-related excursions, including die attach, clip attach, solder integrity, and module-level defects.
  • Lead product bring-up, characterization, and silicon readiness in partnership with Design, Test, and Applications teams.
  • Define and maintain product specifications, limits, and guard bands based on silicon behavior and manufacturing capability.
  • Lead yield analysis, parametric trend monitoring, and root-cause investigations.
  • Drive cost, yield, and cycle-time improvement through data-driven analysis.
  • Own manufacturing release, qualification execution, and product change management (PCNs).
  • Serve as the technical escalation owner for production issues, customer returns, and corrective actions.
  • Support critical customer engagements on product, quality, and manufacturing topics as needed.

Desired Qualifications

  • A master's degree in a relevant engineering discipline is preferred.
  • A Mechanical Engineering degree is preferred, particularly for roles involving module packaging, thermomechanical behavior, and assembly optimization.

About the Company

Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Renesas manufactures and sells MCUs, SoCs, and analog/power semiconductor devices to OEMs, focusing on automotive, industrial, infrastructure, and IoT markets. Its chips are building blocks that run embedded software and manage power and signals, and its Winning Combinations offer pre-tested system architectures to speed up design. It differentiates itself by growing through acquisitions to offer a broad, integrated portfolio and by moving toward a unified digital design platform to reduce integration work. Its goal is to become a leading supplier of these components and provide a single platform for electronics design that speeds time-to-market.

Company size
10,001+
Company stage
IPO
Headquarters
Tokyo, Japan
Founded
2002

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