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Micron Technology

Makes memory and storage chips for AI and PCs

Principal Firmware Developer - HBM

Embedded EngineeringConfirmed live in the last 24 hours
Full-timeRichardson, TX, USAIn-person

About the Job

Requirements

  • Strong experience in embedded systems or firmware development, including low-level programming and system control.
  • Ability to architect complex firmware systems, interfaces, and system-level enablement features for GPUs, CPUs, or TPUs in large-scale AI datacenter environments.
  • Background in memory technologies such as DRAM, HBM, NAND, or related subsystem architectures.
  • Hands-on experience with low-level firmware, hardware bring-up, and silicon debug workflows.
  • Exposure to RAS, diagnostics, telemetry, testing, or reliability-focused firmware.
  • Familiarity with high-speed interfaces and protocols, including memory controllers, PHY interaction, or SoC-level firmware integration.
  • Experience working in multifunctional silicon development teams and collaborating across hardware, firmware, and architecture groups.
  • Understanding of DRAM operation and JEDEC standards, preferably HBM, and exposure to AI/ML workloads or datacenter-scale memory systems.
  • Proficiency with applying AI and AI-enabled development workflows.
  • BSEE or greater.
  • 10+ years of relevant Engineering or Design Engineering experience.

Responsibilities

  • Analyze firmware architecture and requirements, design requirements, and customer requirements to create implementation plans.
  • Deliver firmware solutions for next-generation SoC designs, including driver layers, design verification firmware, manufacturing/test firmware, and production firmware.
  • Use FPGA prototyping to develop and validate firmware.
  • Collaborate with HBM architecture, design, and verification teams to co-optimize firmware, RTL, hardware features, and IP selections, ensuring clean interfaces and long-term scalability.
  • Provide technical leadership from early concept and architectural pathfinding through silicon bring-up, qualification, customer enablement, and product sustainment.
  • Drive technical discussions with internal and external collaborators to clarify and align on key requirements and features.
  • Drive innovation for future memory generations in a dynamic work environment.
  • Use GenAI to develop AI-assisted development workflows.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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