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Ethernovia

Automotive Ethernet system for autonomous safety

Program Manager - Chip Development

Program ManagementConfirmed live in the last 24 hours
Full-timeSan Jose, CA, USAIn-person

About the Job

Requirements

  • A Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related technical field.
  • At least 8 years of experience in the semiconductor industry, including at least 3–5 years in a dedicated program or project management role for chip development projects.
  • A proven track record of leading multiple complex ASIC/SoC development programs from concept to high-volume production.
  • Demonstrable experience and strong understanding of ISO 26262, ISO/SAE 21434, and Automotive SPICE requirements and implementation in semiconductor development.
  • Experience with Automotive Safety Integrity Levels and Threat Analysis and Risk Assessment processes.
  • A strong understanding of semiconductor fabrication processes, such as FinFET and FD-SOI, and packaging technologies.
  • Familiarity with industry-standard electronic design automation tools and design flows, such as Cadence, Synopsys, and Siemens EDA.
  • Knowledge of verification methodologies, such as Universal Verification Methodology and formal verification.
  • An understanding of power management, clocking architectures, and high-speed interfaces.
  • Hands-on proficiency with Jira for issue tracking, project management, and reporting, and Confluence for documentation, knowledge sharing, and collaboration.
  • A strong understanding of program management methodologies, such as Agile, Waterfall, and Hybrid.

Responsibilities

  • Define program scope, objectives, deliverables, and success criteria with cross-functional teams, including Architecture, Design, Verification, Physical Design, Software, Test, Product, and Operations.
  • Develop and maintain program plans, schedules, and budgets, including critical path identification and risk mitigation strategies.
  • Drive cross-functional alignment and accountability across the chip development lifecycle, from concept through silicon validation and mass production.
  • Serve as the primary program contact and provide regular updates to stakeholders, senior management, and external partners.
  • Ensure compliance with ISO 26262 throughout chip development, including defining Safety Goals, ASIL decomposition, managing safety requirements, and overseeing safety analyses such as FMEDA and FTA.
  • Oversee adherence to ISO/SAE 21434 by managing cybersecurity risk assessments, defining cybersecurity goals, and ensuring secure design and verification practices for the IC.
  • Drive implementation of Automotive SPICE process requirements, including software and hardware development processes, traceability, configuration management, and quality assurance.
  • Work with functional safety and cybersecurity managers to integrate applicable standards into the program plan and execution.
  • Prepare for and support internal and external audits and assessments related to ISO 26262, ISO/SAE 21434, and Automotive SPICE.
  • Serve as the primary technical and program interface to key customers, understand their needs and expectations, and ensure their satisfaction throughout the development lifecycle.
  • Communicate program status, technical progress, and potential issues or changes to customers.
  • Manage customer expectations and negotiate technical and schedule tradeoffs.
  • Translate customer requirements into internal development plans and maintain effective feedback loops.
  • Lead and motivate diverse technical teams and foster a collaborative, high-performance environment.
  • Track program progress against milestones, identify deviations, and implement corrective actions.
  • Identify and manage program risks, dependencies, and issues, escalating as necessary.
  • Facilitate communication and decision-making across all organizational levels.
  • Manage change requests and ensure appropriate impact analysis and approval processes are followed.
  • Apply understanding of the chip development flow, including RTL design, synthesis, place and route, timing closure, verification methodologies, design for test, analog/mixed-signal integration, packaging, and silicon bring-up.
  • Collaborate with technical leads to resolve complex engineering challenges.
  • Ensure adherence to design methodologies, quality standards, and industry best practices.
  • Build and maintain relationships with internal teams, external vendors such as foundries and IP providers, and customers.
  • Manage stakeholder expectations and negotiate tradeoffs to achieve program goals.
  • Prepare and deliver presentations to audiences including executive reviews and technical forums.
  • Conduct post-mortems and lessons-learned sessions to identify process improvements.
  • Implement program management best practices and contribute to the evolution of development methodologies.

Desired Qualifications

  • Experience with silicon technologies such as CPUs, GPUs, DSPs, AI accelerators, or custom ASICs for automotive applications.
  • PMP or equivalent certification.
  • Pre-IPO stock options as incentive compensation.

About the Company

Ethernovia

Automotive Ethernet system for autonomous safety

Ethernovia builds a complete Ethernet network system for cars. It provides high-bandwidth, unified Ethernet hardware and software that fits into vehicles and follows industry safety standards, so car makers can meet the needs of future autonomous technology. The system is designed to be flexible and scalable, adapting as network requirements evolve, and it includes both the physical components and the software that manage and ensure safe operation. Ethernovia differentiates itself by offering an end-to-end, standards-based solution rather than just parts: a single architecture that combines hardware, software, and safety features, plus long-term services and maintenance for automotive customers. The company’s goal is to enable safe, reliable, and scalable in-vehicle networks that support autonomous driving and other advanced automotive functions.

Company size
51-200
Company stage
Series B
Total funding
$154M
Headquarters
San Jose, CA
Founded
2018

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