Corning

Corning

Specialty glass, ceramics, and tech components

Imaging Sciences Engineer Intern

Summer 2027Posted on 9/18/2026
$20.44 - $39.81/hr

+ Housing assistance + Travel assistance

Internship
Bachelor's
Keene, NH, USA
In Person
No H1B Sponsorship

About the job

Requirements
  • Pursuing a degree in Optics, Electronics, or a related discipline with a concentration in Optics or Imaging Science.
  • Basic understanding of optical systems and imaging techniques.
  • Ability to learn, develop, and advance technical skills in precision engineering and imaging product development.
  • Strong written and oral communication skills.
  • Must be available for 10 weeks during Summer 2027, from May through August 2027.
  • Interest in working for Corning, Inc. after graduation if offered a full-time opportunity.
  • Willingness to work at the posted job location.
Responsibilities
  • Work within the EO/IR imaging team to design, engineer, and build imaging systems, including developing tooling, testing approaches, and instrumentation.
Desired Qualifications
  • Ability to use experimentation to develop basic process knowledge, design prototype test systems, and perform proof-of-principle testing to validate an imaging approach.
  • Experience with focal plane arrays, image processing, and other optical instruments.
  • Exposure to infrared imaging, image processing, detector characterization, or precision optical alignment.
  • Ability to function within a product development team of multidisciplinary engineers.
  • Working knowledge of analysis tools such as MATLAB, Python, or Excel.

About the company

Corning is a materials science company that develops and manufactures specialty glass, ceramics, and related components for multiple industries. Its products include specialty glass for smartphone screens, glass substrates for high-performance displays, optical fiber and connectivity solutions, and glass/ceramic components for automotive emission controls, along with vessels and surfaces for life sciences. It differentiates itself by offering a broad, engineered portfolio across markets, backed by material science expertise and end-to-end components and systems that integrate into devices and infrastructure. Its goal is to enable the performance and reliability of customers’ products by providing durable, high-quality materials and connected solutions that scale with demand for bandwidth, displays, automotive emissions control, and life sciences.

Company Size

1,001-5,000

Company Stage

IPO

Headquarters

Corning, New York

Founded

1851

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What believers are saying

  • Verizon’s September 8, 2026 deal buys over 80 million miles through 2032.
  • Q2 2026 optical communications sales jumped 32%, with enterprise revenue up 65%.
  • Corning’s Q2 core EPS beat again, and management guided further growth for Q3.

What critics are saying

  • September 11, 2026’s $2 billion ATM offering threatens shareholder dilution and price pressure.
  • Pomerantz opened a September 17, 2026 securities-fraud investigation after Corning’s equity announcement.
  • If AI fiber orders slow, Corning’s growth narrative collapses and valuation resets sharply.

What makes Corning unique

  • Corning owns 175 years of glass, ceramics, and optical-physics manufacturing expertise.
  • September 17, 2026 SDM4 multicore fiber standardization positions Corning as an interoperability leader.
  • Corning’s multiyear contracts with Verizon, Amazon, and NVIDIA lock in demand.

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Benefits

Health Insurance

Dental Insurance

Vision Insurance

Life Insurance

Disability Insurance

401(k) Retirement Plan

401(k) Company Match

Unlimited Paid Time Off

Paid Parental Leave

Family Planning Benefits

Company Equity

Wellness Program

Growth & Insights and Company News

Headcount

6 month growth

1%

1 year growth

19%

2 year growth

21%
PR Newswire
Sep 18th, 2026
INVESTOR ALERT: Pomerantz law Firm investigates claimson behalf of investors of Corning Incorporated - COO.

INVESTOR ALERT: Pomerantz law Firm investigates claimson behalf of investors of Corning Incorporated - COO. Sep 17, 2026, 19:11 ET NEW YORK, Sept. 17, 2026 /PRNewswire/ - Pomerantz LLP is investigating claims on behalf of investors of Corning Incorporated ("Corning" or the "Company") (NASDAQ: COO). Such investors are advised to contact Danielle Peyton at [email protected] or 646-581-9980, ext. 7980. The investigation concerns whether Corning and certain of its officers and/or directors have engaged in securities fraud or other unlawful business practices. On September 11, 2026, Corning announced entry into an Equity Distribution Agreement with Goldman Sachs to launch an at-the-market equity offering of up to $2 billion of the Company's common stock, advising that "[t]he Company intends to use any net proceeds from the sale of the Common Stock for general corporate purposes." Following this announcement, Corning's stock price fell $22.80 per share, or 13.7%, to close at $143.60 per share on September 14, 2026. Pomerantz LLP, with offices in New York, Chicago, Los Angeles, London, Paris, and Tel Aviv, is acknowledged as one of the premier firms in the areas of corporate, securities, and antitrust class litigation. Founded by the late Abraham L. Pomerantz, known as the dean of the class action bar, Pomerantz pioneered the field of securities class actions. Today, more than 85 years later, Pomerantz continues in the tradition he established, fighting for the rights of the victims of securities fraud, breaches of fiduciary duty, and corporate misconduct. The Firm has recovered numerous multimillion-dollar damages awards on behalf of class members. See www.pomlaw.com. Attorney advertising. Prior results do not guarantee similar outcomes. SOURCE Pomerantz LLP

TeraHop
Sep 17th, 2026
Industry Leaders Complete SDM4 Multicore Fiber MSA and Release 1.0 Technical Specification

Industry leaders complete SDM4 Multicore Fiber MSA and release 1.0 technical specification. September 17, 2026 AFL, Corning Incorporated, Sumitomo Electric Industries, Ltd., and TeraHop PTE. LTD. today announced the completion of the SDM4 Multicore Fiber Multi-Source Agreement (SDM4 MCF MSA) and the public release of the SDM4 Multicore Fiber MSA Technical Specifications, Version 1.0. The specification defines common geometrical, optical, mechanical and measurement requirements for a four-core multicore fiber intended for AI data centers, campus networks and other short-reach optical links. By reaching agreement on a common fiber specification, the participating companies have completed the objective established for the MSA: to provide an industry-defined technical foundation for multi-vendor interoperability and future international standardization of four-core multicore fiber. "This specification establishes a common technical foundation that can help accelerate adoption of multicore fiber across the industry," said Antonio Castano, Chair, SDM4 MCF MSA. "By aligning around a shared four-core fiber design, we are enabling interoperability while supporting the increasing connectivity demands of AI data centers and campus networks." A common fiber design for higher-density optical infrastructure The continued scale-out of AI infrastructure is increasing the number and density of optical connections required within data centers and across data center campuses. Multicore fiber can provide multiple independent optical paths within a standard fiber cladding, offering a potential path toward greater connection density. Key elements defined in the SDM4 MCF MSA include: - A four-core, square-lattice 2x2 core arrangement with a core pitch of 40 +/- 1 μm - A nominal cladding diameter of 125 μm - Optical characteristics suitable for O-band short-reach applications - Crosstalk limits of −40 dB or less at 1 km and 1310 nm for both adjacent and diagonal core pairs The specification also provides measurement principles and informative guidance on core numbering, rotational alignment, polarization mode dispersion, and marker configurations. A foundation for broader industry standardization With publication of the specification, the SDM4 MCF MSA establishes a stable, industry-aligned technical baseline for interoperable SDM4 multicore fiber. The specification is intended to serve as a durable foundation for multi-vendor implementation, industry adoption, and related standards-development activities. Consistent with its role as a stable industry reference, frequent revisions to the MSA specification are not anticipated. Future evolution of requirements for this class of fiber is expected to be advanced through relevant international standards-development organizations, informed by the published specification. The publicly available specification may serve as a technical reference and foundation for discussions on multicore fiber standardization within ITU-T and IEC, and as a technical reference for discussions on optical transceiver and interface standardization by organizations such as IEEE. The SDM4 Multicore Fiber MSA Technical Specifications, Version 1.0 are available at: - AFL: AFLglobal.com - Corning: Corning(R) Multicore Fiber Solutions website - Sumitomo Electric: https://sumitomoelectric.com/press/2026/09/prs038 - TeraHop: TeraHop.com About the SDM4 MCF MSA The SDM4 Multicore Fiber Multi-Source Agreement is an industry-led agreement defining common technical requirements for a four-core multicore fiber designed for short-reach O-band optical links. The agreement was created to support multi-vendor interoperability and provide a technical foundation for future international standardization of multicore fiber. Publication of the SDM4 Multicore Fiber MSA Technical Specifications, Version 1.0, completes the objective of the MSA. The specification will remain publicly available as an industry reference. Founded in 1984, AFL is a global manufacturer providing end-to-end solutions to the broadband, energy, data center, AI, and industrial markets. With products in more than 130 countries, AFL specializes in fiber optic cable and hardware, transmission, compression and substation accessories, connectivity solutions, fusion splicers, and test and inspection equipment. Guided by customer-focused and community-centered values and a strong commitment to safety, the company operates manufacturing facilities worldwide and provides a comprehensive portfolio of services and solutions supporting network infrastructure, data centers, service providers, wireless networks, and power-grid modernization. For more information, visit www.AFLglobal.com. About Corning Incorporated Corning (www.corning.com) is one of the world's leading innovators in materials science, with a 175-year track record of life-changing inventions. Corning applies its unparalleled expertise in glass science, ceramic science, and optical physics, along with its deep manufacturing and engineering capabilities, to develop category-defining products that transform industries and enhance people's lives. Corning succeeds through sustained investment in research, development, and engineering; a unique combination of material and process innovation; and deep, trust-based relationships with customers that are global leaders in their industries. Corning's capabilities are versatile and synergistic, allowing the company to evolve to meet changing market needs while helping customers capture new opportunities in dynamic industries. Today, Corning's markets include optical communications, mobile consumer electronics, display, automotive, solar, semiconductors, and life sciences. About Sumitomo Electric Industries, Ltd. Sumitomo Electric Industries, Ltd. was established in 1897. Since then, building on its electric-wire and cable manufacturing technologies, the company has conducted original research and development and worked to establish new businesses. These efforts have enabled Sumitomo Electric to create new products and technologies and diversify its business fields. The company currently operates globally in five segments: Environment & Energy; Infocommunications; Automotive; Electronics; and Industrial Materials. Sumitomo Electric contributes to society through environmentally responsible and fair business activities. About TeraHop PTE. LTD. TeraHop is a global leading provider of high-speed optical connectivity solutions for AI and data center networking applications. Headquartered in Singapore, the company has a global presence in the United States, Thailand and Taiwan and Suzhou, China. For more information, visit https://terahop.com. Media Relations Contact SDM4 MCF MSA Media Relations Nancy Rice Email: [email protected] [email protected] Corning Incorporated Brian Dresdow Email: [email protected] Sumitomo Electric Industries, Ltd. TeraHop PTE. LTD. [email protected]

Custom Map Poster
Sep 16th, 2026
Lenovo's revolutionary rollable laptops at CES 2026: ThinkPad XD & Legion Pro hands-on (2026).

Lenovo's revolutionary rollable laptops at CES 2026: ThinkPad XD & Legion Pro hands-on (2026). Get ready for a glimpse into the future of computing! Lenovo, the tech giant, has unveiled two groundbreaking concept laptops with expandable screens, and they're here to revolutionize the way we think about portable devices. The Future is Flexible: Lenovo's Rollable Revolution Lenovo, just six months after launching the world's first rollable laptop, is back with a bang at CES 2026. They've introduced two new concept PCs that push the boundaries of what we thought was possible. But here's where it gets controversial: these aren't just prototypes; they're functional, sleek, and ready to challenge our perceptions of laptop design. The first, the ThinkPad Rollable XD Concept, is a business-oriented powerhouse. Its expandable display can grow from a compact 13.3 inches to a spacious 16 inches, offering a 50% increase in screen real estate in an instant. But it's not just about size; Lenovo has added a unique twist. The OLED display wraps around the top edge of the lid, creating a second 'world-facing' display on the back. It's a bold move, and Lenovo has partnered with Corning to develop a transparent glass cover, showcasing the inner workings of this innovative mechanism. Engineering Excellence: A Win for Lenovo? Even if these concepts never make it to market, they're already a triumph for Lenovo's engineering team. They work seamlessly, and their design is nothing short of impressive. With just a button press or a swipe, you can control the height of the ThinkPad Rollable XD's display. While it doesn't respond to voice or gesture commands yet, remember, this is just the beginning. Lenovo might just surprise us with these features in the future. Now, let's talk about the gaming beast, the Legion Pro Rollable Concept. This laptop takes the expandable screen concept to the next level. Its 240Hz OLED display expands from both sides, offering three distinct modes: Focus, Tactical, and Arena. In Arena Mode, it's like having an entire extra monitor appear out of thin air! It's a gamer's dream, offering more screen space than a dual-screen setup like the Asus ROG Zephyrus Duo. The Future of Gaming Laptops? Despite some minor creases and skid marks on the screen, which Lenovo assures can be improved upon, the Legion Pro Rollable is a force to be reckoned with. Configured like the premium Legion Pro 7i, it boasts high-end Intel Core processors, an Nvidia GeForce RTX 5090 GPU, and an array of ports. Aesthetically, it's a showstopper with RGB accent lighting, a glowing 'Legion' logo, and dynamic LED strips. However, its flashy design comes with a price - it generates a lot of heat, even without running games. While these prototypes might not hit store shelves anytime soon, the success of Lenovo's original rollable laptop, two years after its conceptual debut, gives us hope. Considering the ThinkBook Plus Gen 6's retail price, it might be wise to start saving now. So, what do you think? Are these rollable concepts the future of computing, or just a flashy gimmick? Let us know in the comments! References. Top Articles Article information Last Updated: 2026-09-16T12:52:58+07:00 Views: 6333 Rating: 4 / 5 (51 voted) Name: Horacio Brakus JD Birthday: 1999-08-21 Address: Apt. 524 43384 Minnie Prairie, South Edda, MA 62804 Phone: +5931039998219 Job: Sales Strategist Hobby: Sculling, Kitesurfing, Orienteering, Painting, Computer programming, Creative writing, Scuba diving Introduction: My name is Horacio Brakus JD, I am a lively, splendid, jolly, vivacious, vast, cheerful, agreeable person who loves writing and wants to share my knowledge and understanding with you.

Money365.Market
Sep 15th, 2026
Citi lifts guidance; banks navigate card pressures.

Citi lifts guidance; banks navigate card pressures. Citigroup raises ROTCE outlook on broad momentum; luxury card market faces churn and cost pressures across major issuers Banks & Lending. Citigroup (C) Chief Financial Officer Gonzalo Luchetti said the bank expects full-year return on tangible common equity to finish slightly above the high end of its previously stated 10% to 11% range, citing continued momentum across its markets, banking, services and consumer businesses. Wells Fargo (WFC) lowered its price target on Carnival but maintained a bullish view, noting the bank still sees nearly 60% upside despite Caribbean pricing pressure weighing on the cruise operator. JPMorgan Chase (JPM) has issued a flurry of fixed-rate, callable medium-term notes across maturities from 2030 to 2056, while also hosting investor events and making senior appointments in its international technology investment banking franchise, positioning the bank at the intersection of higher rates and market volatility. The high-end card market is challenging banks with increased costs, a limited consumer pool and churn pressuring the financial institutions competing in the luxury card segment, according to industry reporting that highlighted difficulties for JPMorgan Chase (JPM) and other major issuers. Asset management. MS Direct Lending yield 12% 0.75x P/NAV MS JPM BLK Morgan Stanley (MS) is rated a Hold at $214 with valuation already at 4x tangible book, according to analyst commentary noting the franchise strength but limited upside from current levels. Morgan Stanley Direct Lending (MS) faces persistent portfolio and earnings headwinds despite trading at 0.75x price-to-NAV and offering a 12% yield, with analysts cautioning that the valuation metrics are not enough to warrant immediate investment. JPMorgan Private Bank (JPM) head of alternative investment strategy Sitara Sundar said the AI trade is in a digestion phase, though the firm maintains a constructive long-run view on the industry and would lean more into the integration and application layer of artificial intelligence. BlackRock (BLK) appeared in ETF league tables reflecting daily flows as of September 11, while VanEck saw outflows during the same period, according to asset total reporting. Payments & fintech. Mastercard (MA) was selected by Thredd to power iPayLinks' new virtual commercial debit card programme, expanding the payments network's presence in cross-border payment and capital settlement platforms. Mastercard (MA) entered a multi-year partnership with KEO Capital to expand KEO's cross-border card program, with the agreement focusing on widening access to Mastercard-branded cards for KEO Capital clients and program participants in international markets. Visa (V) and Mastercard payments can now be accepted by Finsei clients through the London-based payments company's newly launched acquisition service, allowing businesses to add card acceptance to their account through a simplified onboarding process with settlement funds landing in the same account holding multi-currency balances. Capital markets. ICE August ADV growth +14% +Record levels Corning equity offering $2B Via Goldman Sachs Intercontinental Exchange (ICE) reported record operating metrics for August 2026 across multiple asset classes and platforms, with trading activity up 14% on an average daily volume basis as trading and open interest in energy, oil, natural gas, agriculture, metals, financials and equity options reached record levels in several categories. Goldman Sachs (GS) is serving as placement agent for Corning's at-the-market equity distribution agreement to sell up to $2 billion of common stock, a program that triggered a 12.7% decline in Corning shares and pressure on AI optical connectivity peers. Important disclaimer - not investment advice. Disclaimer: This article is provided by Money365.Market for general information and educational purposes only. It is not financial advice, a personal recommendation, or an inducement to buy, sell, or invest in any security or product. Capital is at risk and the value of investments can go down as well as up; past performance does not indicate future results. You should seek independent advice from an FCA-authorised adviser before making any financial decision. Read the full disclaimer - 8 further points, including total-loss risk, its regulatory status and conflicts of interest

Industry Blog
Sep 13th, 2026
ASML, Xanadu partner on lithography for quantum photonics.

ASML, Xanadu partner on lithography for quantum photonics. * Xanadu and ASML collaborating on advanced lithography for photonic quantum chips * Partnership targets line edge roughness to reduce optical losses * Xanadu achieved 0.085 dB/facet edge-coupling loss in June 2024 * Optical loss remains primary barrier to fault-tolerant photonic quantum computing (cite index="1-7,19-8">Line edge roughness from lithography causes optical loss in photonic quantum processors, and (cite index="1-5">Xanadu, founded in 2016, just enlisted the world's dominant lithography supplier to help fix it. (cite index="23-1">Xanadu and ASML announced a collaboration to develop advanced lithography processes for Xanadu's photonic quantum hardware, aiming to reduce the scattering losses that destroy quantum information before it completes a computation. The partnership comes seven months after (cite index="2-1">Xanadu and Tower Semiconductor expanded their collaboration to develop advanced silicon photonics on Tower's high-volume platform. ASML brings a different capability: precision patterning control through deep ultraviolet (DUV) and extreme ultraviolet (EUV) exposure systems that can minimize nanometer-scale sidewall imperfections. Optical loss sets the quantum error threshold. (cite index="10-1,10-2">A lost photon cannot be reset or recovered, making loss reduction a central focus of photonic quantum hardware development. (cite index="22-1,22-2">Line edge roughness induces Rayleigh scattering, causing photons to scatter out of integrated optical waveguides. Every scattered photon is lost quantum information - and unlike superconducting or trapped-ion qubits, there's no way to reinitialize it mid-computation. (cite index="3-8,3-9">Xanadu's Aurora photonic quantum computer identified optical loss as the next major hurdle, with the biggest impact found in optimizing chip design and fabrication. (cite index="8-2,8-5">Xanadu demonstrated 0.085 dB/facet edge-coupling loss in June 2024. But (cite index="17-6,17-7">current optical path transmission rates of 78-82% must exceed 99.5% to meet fault-tolerance requirements. The difference between 82% and 99.5% transmission sounds marginal. It's not. A photonic quantum chip routes photons through dozens of components - beam splitters, waveguides, phase shifters - and loss compounds at each step. If a chip requires 50 operations and each has 95% transmission, overall photon survival drops to 7.7%. At 99.5% per operation, survival is 77.8%. That gap determines whether error correction can keep pace with physical errors, or whether the system drowns in noise before completing a single useful calculation. ASML targets patterning precision at nanometer scale. (cite index="1-1,1-2">The work will examine how lithography and process conditions affect line edge roughness and optical losses, aiming to identify manufacturing approaches that improve patterning control. (cite index="22-3">The partnership aims to establish optimized patterning conditions by leveraging ASML's advanced exposure systems and computational lithography. ASML's involvement signals that photonic quantum computing has matured enough to warrant attention from the semiconductor industry's infrastructure providers. The company dominates advanced lithography - it's the sole supplier of EUV systems - and photonics applications represent a growth vector beyond traditional logic and memory chips. (cite index="18-2,18-3">Stan Baron, Senior Vice President at ASML, said the collaboration is an opportunity to explore advanced lithography processes and better understand how ASML's technology can support next-generation photonics applications. Tower and Corning complete the manufacturing stack. Xanadu isn't relying on lithography alone. (cite index="2-3,2-4">Xanadu and Tower co-engineered a unique production flow for Xanadu's custom material stack, designed to sustain scalability and performance as systems grow in complexity. (cite index="8-7">Xanadu also has a joint development agreement with Corning to develop customized fiber and fiber-array solutions engineered for low-loss networking of photonic quantum computing chips. The manufacturing strategy resembles traditional semiconductor fabless models: Xanadu designs the chips, Tower fabricates them on silicon photonics platforms, ASML optimizes the lithography step, and Corning handles chip-to-fiber interconnects. (cite index="3-1">Xanadu's Aurora quantum computer consists of 35 photonic chips and 13 km of fiber optics operating at room temperature, so packaging and interconnect losses matter as much as on-chip waveguide quality. Key Takeaway Lithography partnerships won't solve photonic quantum computing alone, but line edge roughness is one of the few loss mechanisms that advanced manufacturing can address directly. Xanadu has already demonstrated edge-coupling losses below 0.1 dB/facet and built functional 12-qubit systems. The ASML collaboration targets waveguide sidewall quality, which compounds across hundreds of components in a fault-tolerant architecture. If the partnership can push transmission fidelity above 99% per component through better patterning control, photonic quantum systems move closer to error-correction thresholds that make million-qubit machines plausible. Until then, optical loss remains the binding constraint. Frequently Asked Questions Why is line edge roughness the primary lithography challenge for photonic quantum chips? (cite index="22-1,22-2">Line edge roughness is a nanometer-scale sidewall imperfection introduced during photolithography and etch processing that induces Rayleigh scattering, causing photons to scatter out of integrated optical waveguides. Unlike electrical signals that can be amplified or regenerated, scattered photons are permanently lost, destroying the quantum information they carry. Smoother waveguide edges reduce scattering and improve photon survival rates across multi-component circuits. How does Xanadu's approach differ from competing photonic quantum architectures? (cite index="17-10,17-11,17-12">PsiQuantum prioritizes operational redundancy with fusion measurements and hardware fault-tolerance thresholds above 10% photon loss, while Xanadu prioritizes encoding efficiency using GKP logical qubits that resist Gaussian noise but demand extreme optical path transmission fidelity below 0.5 dB loss. Xanadu's architecture requires better component-level performance but offers deterministic gate operations. PsiQuantum tolerates more loss per component but requires higher photon generation rates and more complex fusion networks.